Works matching DE "ELECTRONIC packaging"

Results: 851

A Comprehensive Review of Plasma Cleaning Processes Used in Semiconductor Packaging.

Published in:

Applied Sciences (2076-3417), 2025, v. 15, n. 13, p. 7361, doi. 10.3390/app15137361

By:

Sammut, Stephen

Publication type:

Article

Mechanical response identification of local interconnections in boardlevel packaging structures under projectile penetration using Bayesian regularization.

Published in:

Defence Technology, 2025, v. 49, p. 79, doi. 10.1016/j.dt.2025.02.005

By:

Xu Long;
Yuntao Hu;
Ali, Irfan

Publication type:

Article

Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 8, p. 6054, doi. 10.1007/s11664-025-12051-x

By:

Li, Mulan;
Huang, Shijun;
Ding, Zifeng;
Li, Cai-Fu

Publication type:

Article

High-Performance EMI Shielding Film Based on Low-D k Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement.

Published in:

Micro (2673-8023), 2025, v. 5, n. 2, p. 26, doi. 10.3390/micro5020026

By:

Gu, Moses;
Chae, Suin;
Kim, Seonwoo;
Kim, Yubin;
Kang, Shinui;
Park, Soobin;
Park, Se-Hoon;
Choa, Sung-Hoon;
Nam, Hyunjin

Publication type:

Article

Recyclable Low Dielectric Polymers with High Thermal Conductivity for Copper‐Clad Laminated Film for High‐Frequency Applications (Adv. Funct. Mater. 26/2025).

Published in:

Advanced Functional Materials, 2025, v. 35, n. 26, p. 1, doi. 10.1002/adfm.202570156

By:

Ko, Hyeyoon;
Wi, Youngjae;
Koo, Jahyeon;
Rim, Minwoo;
Hyeong, Jaeseok;
Yoo, Myong Jae;
Jeong, Yongchae;
Chaudhary, Girdhari;
Kang, Dong‐Gue;
Jeong, Kwang‐Un

Publication type:

Article

Die Verwaltung elektronischer Ressourcen mit Open Source Systemen – neue Möglichkeiten und Herausforderungen.

Published in:

ABI Technik, 2022, v. 42, n. 1, p. 55, doi. 10.1515/abitech-2022-0006

By:

Schildt, Martina;
Horn, Moritz

Publication type:

Article

The Mechanisms of Oxygen Accelerated Low‐Temperature Bonding by Ag Nanoparticles.

Published in:

Particle & Particle Systems Characterization, 2023, v. 40, n. 7, p. 1, doi. 10.1002/ppsc.202200195

By:

Wang, Wengan;
Zou, Guisheng;
Chen, Na;
Jia, Qiang;
Feng, Bin;
Zhang, Hongqiang;
Deng, Zhongyang;
Liu, Lei

Publication type:

Article

Three-Dimensional Inkjet-Printed Interconnects using Functional Metallic Nanoparticle Inks.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 43, p. 6834, doi. 10.1002/adfm.201401312

By:

Sadie, Jacob A.;
Subramanian, Vivek

Publication type:

Article

Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 6, p. 635, doi. 10.1007/s10854-009-9969-1

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Zhong Sheng;
Guang Zeng;
Yan Chen;
Sheng-lin Yu

Publication type:

Article

Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1144, doi. 10.1007/s10854-008-9841-8

By:

Pequegnat, A.;
Hang, C. J.;
Mayer, M.;
Zhou, Y.;
Moon, J. T.;
Persic, J.

Publication type:

Article

Effect of underfill on bending fatigue behavior of chip scale package.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 406, doi. 10.1007/s10854-007-9354-x

By:

Bo-In Noh;
Noh-Chang Park;
Won-Sik Hong;
Seung-Boo Jung

Publication type:

Article

Effects of bonding frequency on Au wedge wire bondability.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 281, doi. 10.1007/s10854-007-9312-7

By:

Yu Hin Chan;
Jang-Kyo Kim;
Deming Liu;
Liu, Peter C. K.;
Yiu Ming Cheung;
Ming Wai Ng

Publication type:

Article

Design and fabrication of bilayer polylactic acid @ secondary alkyl sulfonate/cellulose fabrics with asymmetric wettability for the electronic device packaging.

Published in:

Cellulose, 2024, v. 31, n. 8, p. 5249, doi. 10.1007/s10570-024-05845-5

By:

Zhai, Qian;
Zhang, Heng;
Cao, Yang;
Qian, Xiaoming;
Shi, Dianwang;
Xu, Wenjie

Publication type:

Article

Twin-roll forming, a novel method for producing high-consistency microfibrillated cellulosic films.

Published in:

Cellulose, 2022, v. 29, n. 18, p. 9627, doi. 10.1007/s10570-022-04884-0

By:

Sharifi Zamani, Elaheh;
Ahadian, Hamidreza;
Maloney, Thaddeus

Publication type:

Article

Directional fabricating of flexible and compressible cellulose nanofibril composite cryogel with excellent thermal insulation, flame-retardancy and radiative cooling for efficient thermal management.

Published in:

Cellulose, 2022, v. 29, n. 18, p. 9671, doi. 10.1007/s10570-022-04861-7

By:

Zhao, Jiaojiao;
Zhou, Jianhua;
Li, Hong;
Xiao, Anguo

Publication type:

Article

Additive Manufacturing Based Dissolvable Chip Packaging for Sustainable E‐Waste Reduction.

Published in:

Advanced Sustainable Systems, 2024, v. 8, n. 9, p. 1, doi. 10.1002/adsu.202400129

By:

Belkadi, Dhiya;
Kim, Min Sung;
Hahn, Carl P.;
Saleha, Sunehra;
Houston, Hannah L.;
Hussain, Muhammad Mustafa

Publication type:

Article

Infrared Radiation-Assisted Non-Pressure Sintering of Micron-Sized Silver for Power Electronic Packaging.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 8, p. 1492, doi. 10.3390/electronics13081492

By:

Song, Renhao;
Yuan, Fang;
Su, Yue;
Wang, Shuo;
Zhang, Xu

Publication type:

Article

Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 8, p. 1899, doi. 10.3390/electronics12081899

By:

Du, Yanfeng;
Qiao, Yuanyuan;
Ren, Xiaolei;
Lai, Yanqing;
Zhao, Ning

Publication type:

Article

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 7, p. 1666, doi. 10.3390/electronics12071666

By:

Mo, Zihao;
Wang, Fangcheng;
Li, Jinhui;
Liu, Qiang;
Zhang, Guoping;
Li, Weimin;
Yang, Chunlei;
Sun, Rong

Publication type:

Article

A Strain Rate Dependent Damage Model for Evaluating the Dynamic Response of CFRTP Laminates with Different Stacking Sequence.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 22, p. 3728, doi. 10.3390/electronics11223728

By:

Zhang, Yiben;
Liu, Bo

Publication type:

Article

Evaluating Cu Printed Interconnects "Sinterconnects" versus Wire Bonds for Switching Converters.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091373

By:

Hasan, Md. Nazmul;
Polom, Timothy;
Holzmann, Dominik;
Malagó, Perla;
Binder, Alfred;
Roshanghias, Ali

Publication type:

Article

Survey on Fatigue Life Prediction of BGA Solder Joints.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 4, p. 542, doi. 10.3390/electronics11040542

By:

Qiu, Baojun;
Xiong, Jingang;
Wang, Han;
Zhou, Shuai;
Yang, Xiuding;
Lin, Zhengpei;
Liu, Maolin;
Cai, Nian

Publication type:

Article

Modulation of the electromagnetic shielding effectiveness through micro/macrostructure design for electronic packaging.

Published in:

NPG Asia Materials, 2024, v. 16, n. 1, p. 1, doi. 10.1038/s41427-024-00554-8

By:

Guan, Lizhi;
Fan, Jingbo;
Ng, Zhi Kai;
Teo, Edwin Hang Tong;
Le Ferrand, Hortense

Publication type:

Article

Strategies and techniques for quality control and semantic enrichment with multimodal data: a case study in colorectal cancer with eHDPrep.

Published in:

GigaScience, 2023, v. 12, n. 1, p. 1, doi. 10.1093/gigascience/giad030

By:

Toner, Tom M;
Pancholi, Rashi;
Miller, Paul;
Forster, Thorsten;
Coleman, Helen G;
Overton, Ian M

Publication type:

Article

Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application.

Published in:

Journal of the Chinese Chemical Society, 2017, v. 64, n. 9, p. 1035, doi. 10.1002/jccs.201700131

By:

Hsieh, Ya ‐ Yu;
Huang, Chin ‐ Zen;
Tsai, Yun ‐ Chih;
Lin, Hong ‐ Ping;
Hsu, Chun ‐ Han;
Loganathan, Aswaghosh

Publication type:

Article

Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget.

Published in:

Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-51510-7

By:

He, Chuan;
Zhou, Jingzhuo;
Zhou, Rui;
Chen, Cong;
Jing, Siyi;
Mu, Kaiyu;
Huang, Yu-Ting;
Chung, Chih-Chun;
Cherng, Sheng-Jye;
Lu, Yang;
Tu, King-Ning;
Feng, Shien-Ping

Publication type:

Article

Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget.

Published in:

Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-51510-7

By:

He, Chuan;
Zhou, Jingzhuo;
Zhou, Rui;
Chen, Cong;
Jing, Siyi;
Mu, Kaiyu;
Huang, Yu-Ting;
Chung, Chih-Chun;
Cherng, Sheng-Jye;
Lu, Yang;
Tu, King-Ning;
Feng, Shien-Ping

Publication type:

Article

On numerical investigation of nonuniformity in cooling characteristic for different materials of target surfaces being exposed to impingement of air jet.

Published in:

International Journal of Modeling, Simulation & Scientific Computing, 2017, v. 8, n. 3, p. -1, doi. 10.1142/S1793962317500246

By:

Umair, Siddique Mohd;
Gulhane, Nitin Parashram

Publication type:

Article

A New Two-Phase Multiplier for Flow Pressure Drop in Multiport Minichannel Condensers and Evaporators.

Published in:

Heat Transfer Engineering, 2023, v. 44, n. 15, p. 1323, doi. 10.1080/01457632.2022.2134076

By:

Mukkamala, Yagnavalkya;
Dirker, Jaco

Publication type:

Article

Thermal Management in Hybrid Power Systems Using Cylindrical and Prismatic Battery Cells.

Published in:

Heat Transfer Engineering, 2016, v. 37, n. 6, p. 581, doi. 10.1080/01457632.2015.1060776

By:

He, Fan;
Ma, Lin

Publication type:

Article

Multi-physical and anti-corrosion properties of graphene-reinforced epoxy nanocomposite coatings for industrial applications.

Published in:

Arabian Journal of Chemistry, 2024, v. 17, n. 1, p. N.PAG, doi. 10.1016/j.arabjc.2023.105424

By:

Ali, Md. Ramjan;
Chowdhury, Mohammad Asaduzzaman;
Shahin, Mohammad;
Rahman, Md. Mostafizur;
Ali, Md. Osman;
Gafur, Md. Abdul

Publication type:

Article

The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging.

Published in:

Modern Physics Letters B, 2021, v. 35, n. 33, p. 1, doi. 10.1142/S0217984921504273

By:

Mitić, Vojislav V.;
Fleshman, Collin;
Duh, Jenq-Gong;
Ilić, Ivana D.;
Lazović, Goran

Publication type:

Article

Study on the properties of bismuthate sealing glass brazing bonded TC4/ZrO2 joints.

Published in:

International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2025, v. 39, n. 9, p. 1, doi. 10.1142/S0217979225400612

By:

Ji, Fei;
Li, Yuanxing;
Dong, Wenxin;
Chen, Hui

Publication type:

Article

Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 1592, doi. 10.1007/s11664-025-11738-5

By:

Lee, Dong-Bok;
Seo, Young-Jin;
Yoon, Jeong-Won

Publication type:

Article

Sodium Fluoroborate Glass Loaded with Fixed CoO and Variable La2O3: Fabrication, Physical, FTIR, and Dielectric Characteristics: Sodium Fluoroborate Glass Loaded with Fixed CoO and Variable La2O3: Fabrication, Physical, FTIR...: N. Alfryyan et al

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 2, p. 1467, doi. 10.1007/s11664-024-11478-y

By:

Alfryyan, Nada;
Al-Ghamdi, Hanan;
Alsaif, Norah A. M.;
Shaaban, Shaaban M.;
Shams, M. S.;
El-Refaey, Adel M.;
Elsad, R. A.;
Abdelghany, A. M.;
Abouhaswa, A. S.;
Mesalam, Yehya I.;
Rammah, Yasser S.

Publication type:

Article

Enhanced Thermal Conductivity of EP Composites by Introducing BN-Al2O3 Hybrid.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6403, doi. 10.1007/s11664-024-11285-5

By:

Tu, Xuesong;
Zhou, Hong;
Chi, Hao;
Zhou, Jian

Publication type:

Article

Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8

By:

Zhang, Dan;
Ma, Haoran;
Dong, Chong;
Guo, Tianhao;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4410, doi. 10.1007/s11664-024-11107-8

By:

Bickel, Steffen;
Quednau, Sebastian;
Birlem, Olav;
Graff, Andreas;
Altmann, Frank;
Junghähnel, Manuela;
Panchenko, Juliana

Publication type:

Article

Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2988, doi. 10.1007/s11664-024-11021-z

By:

Ma, Limin;
Lu, Ziyi;
Jia, Qiang;
Cui, Ze;
Wang, Yishu;
Li, Dan;
Zhang, Hongqiang;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2703, doi. 10.1007/s11664-024-10970-9

By:

Cui, Ze;
Jia, Qiang;
Zhang, Hongqiang;
Wang, Yishu;
Ma, Limin;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

The Effects of Core–Shell-Structured SiO2@Ag Spheres in Enhancing the Performance of Ag-Flake-Filled Electrically Conductive Adhesive and Insight into the Conduction Mechanism.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1272, doi. 10.1007/s11664-023-10864-2

By:

Jiang, H.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

In Situ Electrical Characterization of Transient Liquid-Phase Sintered Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1239, doi. 10.1007/s11664-023-10847-3

By:

Nave, G.;
McCluskey, P.

Publication type:

Article

Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 1, p. 228, doi. 10.1007/s11664-023-10763-6

By:

Ma, Limin;
Wang, Yuchen;
Jia, Qiang;
Zhang, Hongqiang;
Wang, Yishu;
Li, Dan;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Study of the Rapid Determination of Phosphorus in Electronic Packaging Material by Phosphorus-Molybdenum Yellow Spectrophotometry.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7590, doi. 10.1007/s11664-023-10689-z

By:

Wang, Tongju;
Lin, Zipeng;
Zhang, Wenqian;
Qin, Zihan

Publication type:

Article

Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7512, doi. 10.1007/s11664-023-10660-y

By:

Wang, Xianyu;
He, Liang;
Chen, Hua;
Xiao, Xiaolei

Publication type:

Article

Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3903, doi. 10.1007/s11664-023-10358-1

By:

Deng, Zhongyang;
Zou, Guisheng;
Zhang, Hongqiang;
Jia, Qiang;
Wang, Wengan;
Wu, Ying;
Zhanwen, A.;
Feng, Bin;
Liu, Lei

Publication type:

Article

Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3786, doi. 10.1007/s11664-023-10340-x

By:

Njoku, Jude E.;
Amalu, Emeka H.;
Ekere, Ndy;
Mallik, Sabuj;
Ekpu, Mathias;
Ogbodo, Eugene A.

Publication type:

Article

Improved Heat Resistance and Electrical Properties of Epoxy Resins by Introduction of Bismaleimide.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 3, p. 1865, doi. 10.1007/s11664-022-10017-x

By:

Wang, Xubin;
Zhang, Tiandong;
Zhang, Changhai;
Li, Zhonghua;
Chi, Qingguo

Publication type:

Article

Hybrid Solder Joint for Low-Temperature Bonding Application.

Published in:

Journal of Electronic Materials, 2023, v. 52, n. 2, p. 782, doi. 10.1007/s11664-022-10111-0

By:

Lai, Yu-Yuan;
Chao, Jui-Lin;
Hsu, Chia-Jung;
Wang, Chang-Meng;
Wu, Albert T.

Publication type:

Article

Preventing Void Growth Between Ni3Sn4 and Solder.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 11, p. 6333, doi. 10.1007/s11664-022-09853-8

By:

Njuki, M.;
Thekkut, S.;
Das, R.;
Borgesen, P.;
Dimitrov, N.

Publication type:

Article