Works matching AU Q
1
- Journal of Applied Fluid Mechanics, 2025, v. 18, n. 7, p. 1938, doi. 10.47176/jafm.18.7.3144
- Li, Q.;
- Cheng, S.;
- Hou, Z.;
- Zhao, W.;
- Guan, Q.
- Article
2
- Russian Journal of Genetics, 2025, v. 61, n. 5, p. 546, doi. 10.1134/S1022795425700061
- Cui, X. J.;
- Xiang, Q.;
- Zhong, L. Z.;
- Pu, H. C.;
- Li, H. T.;
- Lu, Z. X.;
- Xiong, Y. L.;
- Wang, X.;
- Zhang, M. Q.;
- Chen, L. X.;
- Yang, C. Z.;
- Peng, J. J.
- Article
3
- Biotechnic & Histochemistry, 2012, v. 87, n. 3, p. 172, doi. 10.3109/10520295.2011.577754
- Zhang, SM;
- Zuo, L;
- Zhou, Q;
- Gui, SY;
- Shi, R;
- Wu, Q;
- Wei, W;
- Wang, Y
- Article
4
- Aeronautical Journal, 2021, v. 125, n. 1285, p. 578, doi. 10.1017/aer.2020.126
- Yu, J.-L.;
- Jia, Q.;
- Gao, C.;
- Hu, H.-Q.
- Article
5
- Aeronautical Journal, 2018, v. 122, n. 1253, p. 1102, doi. 10.1017/aer.2018.49
- Zhao, Q.-J.;
- Chen, X.;
- Ma, Y.-Yang;
- Zhao, G.-Q.
- Article
6
- Surface Engineering, 2024, v. 40, n. 1, p. 25, doi. 10.1177/02670844231224243
- Zhu, Q. Q.;
- Li, H. Y.;
- Wang, Y.;
- Wang, Z. W.;
- Zhou, Z. Q.;
- Shu, C. H.
- Article
7
- Surface Engineering, 2015, v. 31, n. 8, p. 570, doi. 10.1179/1743294414Y.0000000358
- Huang, Y.-G.;
- Chen, J.-R.;
- Zhang, X.-H.;
- Wang, H.-Q.;
- Fang, Z.;
- Li, Q.-Y.
- Article
8
- Surface Engineering, 2015, v. 31, n. 5, p. 354, doi. 10.1179/1743294414Y.0000000363
- Xu, Y.;
- Liang, W.;
- Miao, Q.;
- Jiang, Q.;
- Ren, B.;
- Yao, Z.;
- Zhang, P.;
- Wei, D.
- Article
9
- Surface Engineering, 2014, v. 30, n. 8, p. 568, doi. 10.1179/1743294414Y.0000000285
- Bai, Y.;
- Wang, Y. H.;
- Wang, Z.;
- Fu, Q. Q.;
- Han, Z. H.
- Article
10
- Surface Engineering, 2014, v. 30, n. 2, p. 134, doi. 10.1179/1743294413Y.0000000215
- Huang, Y-G.;
- Chen, J-R.;
- Zhang, M-L.;
- Zhong, X-X.;
- Li, Q-Y.;
- Wang, H-Q.
- Article
11
- Surface Engineering, 2013, v. 29, n. 4, p. 296, doi. 10.1179/1743294412Y.0000000094
- Li, F Q;
- Li, L Q;
- Chen, Y B
- Article
12
- Surface Engineering, 2012, v. 28, n. 9, p. 678, doi. 10.1179/1743294412Y.0000000042
- Wei, X Q;
- Zhao, R R;
- Wang, Y J;
- Liu, L Y;
- Cao, B Q
- Article
13
- Surface Engineering, 2012, v. 28, n. 8, p. 612, doi. 10.1179/1743294412Y.0000000038
- Jiang, J B;
- Zhang, L;
- Zhong, Q D;
- Zhou, Q Y;
- Wang, Y;
- Luo, J
- Article
14
- Surface Engineering, 2012, v. 28, n. 8, p. 605, doi. 10.1179/1743294412Y.0000000031
- Xing, Y Q;
- Deng, J X;
- Tan, Y Q;
- Zhou, H M
- Article
15
- Surface Engineering, 2012, v. 28, n. 5, p. 345, doi. 10.1179/1743294412Y.0000000004
- Zhang, J J;
- Wang, Z H;
- Lin, P H;
- Si, L Q;
- Shen, G J;
- Zhou, Z H;
- Jiang, S Q;
- Lu, W H
- Article
16
- Surface Engineering, 2011, v. 27, n. 7, p. 536, doi. 10.1179/1743294410Y.0000000025
- Dai, Y;
- Li, Q;
- Gao, H;
- Li, L Q;
- Chen, F N;
- Luo, F;
- Zhang, S Y
- Article
17
- Surface Engineering, 2011, v. 27, n. 5, p. 355, doi. 10.1179/026708410X12687356948670
- Chu, Y-H;
- Fu, Q-G;
- Cao, C-W;
- Li, H-J;
- Li, K-Z;
- Lei, Q
- Article
18
- Surface Engineering, 2010, v. 26, n. 5, p. 328, doi. 10.1179/026708409X364948
- Xu, S. Q.;
- Li, Q.;
- Lu, Y. H.;
- Chen, B.;
- Fan, J. M.
- Article
19
- Surface Engineering, 2006, v. 22, n. 3, p. 177, doi. 10.1179/174329406X108816
- Dong, Q.;
- Chen, C. Z.;
- Wang, D. G.;
- Ji, Q. M.
- Article
20
- Advanced Materials, 2008, v. 20, n. 2, p. 298, doi. 10.1002/adma.200701627
- Ortony, J. H.;
- Yang, R. Q.;
- Brzezinski, J. Z.;
- Edman, L.;
- Nguyen, T.-Q.;
- Bazan, G. C.
- Article
21
- Advanced Materials, 2007, v. 19, n. 20, p. 3358, doi. 10.1002/adma.200602966
- Li, Q. W.;
- Li, Y.;
- Zhang, X. F.;
- Chikkannanavar, S. B.;
- Zhao, Y. H.;
- Dangelewicz, A. M.;
- Zheng, L. X.;
- Doorn, S. K.;
- Jia, Q. X.;
- Peterson, D. E.;
- Arendt, P. N.;
- Zhu, Y. T.
- Article
22
- Advanced Materials, 2007, v. 19, n. 19, p. 3008, doi. 10.1002/adma.200701167
- Gao, J. H.;
- Li, R. J.;
- Li, L. Q.;
- Meng, Q.;
- Jiang, H.;
- Li, H. X.;
- Hu, W. P.
- Article
23
- Advanced Materials, 2007, v. 19, n. 18, p. 2567, doi. 10.1002/adma.200602648
- Zheng, L.;
- Zhang, X.;
- Li, Q.;
- Chikkannanavar, S. B.;
- Li, Y.;
- Zhao, Y.;
- Liao, X.;
- Jia, Q.;
- Doorn, S. K.;
- Peterson, D. E.;
- Zhu, Y.
- Article
24
- Advanced Materials, 2007, v. 19, n. 17, p. 2360, doi. 10.1002/adma.200602468
- Xiang, R.;
- Luo, G.;
- Qian, W.;
- Zhang, Q.;
- Wang, Y.;
- Wei, F.;
- Li, Q.;
- Cao, A.
- Article
25
- Advanced Materials, 2007, v. 19, n. 16, p. 2141, doi. 10.1002/adma.200700366
- Xu, L. Q.;
- Zhan, J. H.;
- Hu, J. Q.;
- Bando, Y.;
- Yuan, X. L.;
- Sekiguchi, T.;
- Mitome, M.;
- Golberg, D.
- Article
26
- Advanced Materials, 2007, v. 19, n. 6, p. 852, doi. 10.1002/adma.200600703
- Dang, Z.-M.;
- Wang, L.;
- Yin, Y.;
- Zhang, Q.;
- Lei, Q.-Q.
- Article
27
- Advanced Materials, 2006, v. 18, n. 17, p. 2307, doi. 10.1002/adma.200601098
- Y.-H. Chu;
- Q. Zhan;
- L. W. Martin;
- M. P. Cruz;
- P.-L. Yang;
- G. W. Pabst;
- F. Zavaliche;
- S.-Y. Yang;
- J.-X. Zhang;
- L.-Q. Chen;
- D. G. Schlom;
- I.-N. Lin;
- T.-B. Wu;
- R. Ramesh
- Article
28
- Advanced Materials, 2005, v. 17, n. 4, p. 407, doi. 10.1002/adma.200401251
- Miao, Q.;
- Lefenfeld, M.;
- Nguyen, T.-Q.;
- Siegrist, T.;
- Kloc, C.;
- Nuckolls, C.
- Article
29
- Advanced Materials, 2004, v. 16, n. 5, p. 432, doi. 10.1002/adma.200306414
- Q. Zhang;
- Q. Zhou;
- Y. Cheng;
- L. Wang;
- D. Ma;
- X. Jing;
- F. Wang
- Article
30
- Advanced Materials, 2004, v. 16, n. 4, p. 350, doi. 10.1002/adma.200306213
- L. Fu;
- Z. M. Liu;
- Y. Q. Liu;
- B. X. Han;
- J. Q. Wang;
- P. A. Hu;
- L. C. Cao
- Article
31
- Advanced Materials, 2004, v. 16, n. 2, p. 133, doi. 10.1002/adma.200305680
- Q. Li;
- G. Mathur;
- S. Gowda;
- S. Surthi;
- Q. Zhao;
- L. Yu;
- J. S. Lindsey;
- D. F. Bocian
- Article
32
- Advanced Materials, 2002, v. 14, n. 19, p. 1396, doi. 10.1002/1521-4095(20021002)14:19<1396::AID-ADMA1396>3.0.CO;2-U
- Hu, J.-Q.;
- Li, Q.;
- Meng, X.-M.;
- Lee, C.S.;
- Lee, S.T.
- Article
33
- Advanced Materials, 2001, v. 13, n. 21, p. 1631, doi. 10.1002/1521-4095(200111)13:21<1631::AID-ADMA1631>3.0.CO;2-R
- Bao, J.;
- Tie, C.;
- Xu, Z.;
- Zhou, Q.;
- Shen, D.;
- Ma, Q.
- Article
34
- Advanced Materials, 1999, v. 11, n. 11, p. 941, doi. 10.1002/(SICI)1521-4095(199908)11:11<941::AID-ADMA941>3.0.CO;2-T
- Ye, Xiang R.;
- Jia, Dian Z.;
- Yu, Jian Q.;
- Xin, Xin Q.;
- Xue, Ziling
- Article
35
- Positivity, 2021, v. 25, n. 4, p. 1323, doi. 10.1007/s11117-021-00818-5
- Anh, L. Q.;
- Duy, T. Q.;
- Khanh, P. Q.
- Article
36
- Positivity, 2018, v. 22, n. 1, p. 39, doi. 10.1007/s11117-017-0496-7
- Article
37
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 302, doi. 10.1007/s10854-018-0293-5
- Xing, C. F.;
- Liu, Q. Q.;
- Wu, H. T.
- Article
38
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 12, p. 9814, doi. 10.1007/s10854-018-9021-4
- Xie, J.;
- Luo, Q.;
- Peng, D. L.;
- Su, A. M.;
- Wang, L. S.;
- Zhang, Q. F.
- Article
39
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9275, doi. 10.1007/s10854-018-8957-8
- Liu, X. F.;
- Jiang, L. Y.;
- Qi, J. Q.;
- Sui, Y. W.;
- He, Y. Z.;
- Meng, Q. K.;
- Wei, F. X.;
- Zhang, X. P.;
- Jin, Y. X.
- Article
40
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7763, doi. 10.1007/s10854-018-8773-1
- Liu, H. R.;
- Yang, F.;
- Jin, L. H.;
- Zhang, S. N.;
- Wang, Q. Y.;
- Xiong, X. M.;
- Feng, J. Q.;
- Li, C. S.;
- Zhang, P. X.;
- Zhou, L.
- Article
41
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 5025, doi. 10.1007/s10854-017-8464-3
- Zhu, Q. S.;
- Gao, F.;
- Ma, H. C.;
- Liu, Z. Q.;
- Guo, J. D.;
- Zhang, L.
- Article
42
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2645, doi. 10.1007/s10854-015-4072-2
- Chen, G.;
- Zheng, J.;
- Li, Z.;
- Xu, J.;
- Li, Q.;
- Zhou, C.;
- Yuan, C.;
- Feng, Q.
- Article
43
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 7, p. 2992, doi. 10.1007/s10854-014-1972-5
- Wang, L.-L.;
- Ren, Z.-Q.;
- Li, Q.
- Article
44
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3768, doi. 10.1007/s10854-013-1316-x
- Article
45
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 5, p. 463, doi. 10.1007/s10854-010-0160-5
- Wang, G. Q.;
- Lan, W.;
- Yu, M. L.;
- Han, G. J.;
- Wang, Y.;
- Su, Q.;
- Liu, X. Q.
- Article
46
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 241, doi. 10.1007/s10854-007-9291-8
- Jiang, Q.;
- Zhang, Q.;
- Du, B.;
- Zou, R. L.;
- Liu, Y. H.;
- Zhao, Y.
- Article
47
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 855, doi. 10.1007/s10854-006-9089-0
- Liu, Y. C.;
- Shi, Q. Z.;
- Zhao, Q.;
- Ma, Z. Q.
- Article
48
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 211
- Article
49
- Journal of Materials Science Letters, 2003, v. 22, n. 23, p. 1731, doi. 10.1023/B:JMSL.0000004660.67750.7c
- Zhang, Q. S.;
- Deng, Y. F.;
- Zhang, H. F.;
- Ding, B. Z.;
- Hu, Z. Q.
- Article
50
- Journal of Materials Science Letters, 2003, v. 22, n. 21, p. 1523, doi. 10.1023/A:1026111400090
- Chen, X. W.;
- Bai, X. D.;
- Peng, D. Q.;
- Zhou, Q. G.;
- Chen, B. S.
- Article