Works matching DE "TIN alloys"

Results: 880

Influence of nitrogen content on the thermal diffusivity of TiN films prepared by magnetron sputtering.

Published in:

Surface Engineering, 2020, v. 36, n. 2, p. 192, doi. 10.1080/02670844.2019.1646964

By:

Lu, Guiyun;
Yu, Lihua;
Ju, Hongbo;
Zuo, Bin;
Xu, Junhua

Publication type:

Article

Electrodeposition of SnBi coatings based on deep eutectic solvent.

Published in:

Surface Engineering, 2014, v. 30, n. 1, p. 59, doi. 10.1179/1743294413Y.0000000198

By:

Gao, Y.;
Hu, W.;
Gao, X.;
Duan, B.

Publication type:

Article

Analysis and research of damage phenomena on tin based organ pipes of different ages.

Published in:

Surface Engineering, 2005, v. 21, n. 5/6, p. 373, doi. 10.1179/174329305X64349

By:

Mapelli, C.;
Nicodemi, W.;
Venturini, R.

Publication type:

Article

Tin rich layers on ancient copper based objects.

Published in:

Surface Engineering, 2005, v. 21, n. 5/6, p. 359, doi. 10.1179/174329305X64321

By:

Giumlia-Mair, A.

Publication type:

Article

Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2

By:

Bashir, Muhammad Nasir;
Haseeb, A. S. M. A.;
Naher, Sumsun;
Ali, Muhammad Mahmood;
Ali Bashir, Mohamed Bashir;
Zaidi, Asad A.;
Jamshaid, Muhammad;
Javed, Iqra

Publication type:

Article

The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 1, p. 1, doi. 10.1007/s10854-022-09496-9

By:

Pooshgan, Hoda;
Naffakh-Moosavy, Homam

Publication type:

Article

Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 1, p. 1, doi. 10.1007/s10854-022-09445-6

By:

Liu, Chen;
Peng, Jubo;
Hu, Juntao;
Cai, Shanshan;
Wang, Xiaojing

Publication type:

Article

A dual-scale elasto-viscoplastic self-consistent model for the cyclic behavior of polycrystalline materials considering combined nonlinear kinematic hardening.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 26050, doi. 10.1007/s10854-022-09294-3

By:

He, Xu;
Liu, Lu;
Yao, Yao

Publication type:

Article

Structure and properties of low-Ag SAC solders for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22668, doi. 10.1007/s10854-022-09091-y

By:

Lu, Xiao;
Zhang, Liang;
Xi, Wang;
Li, Mu-lan

Publication type:

Article

Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22573, doi. 10.1007/s10854-022-09035-6

By:

Nasir Bashir, M.;
Saad, Hafiz Muhammad;
Rizwan, Muhammad;
Bingöl, Sedat;
Channa, Iftikhar Ahmed;
Gul, Mustabshirha;
Haseeb, A. S. M. A.;
Naher, Sumsun

Publication type:

Article

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22499, doi. 10.1007/s10854-022-09028-5

By:

Bashir, M. Nasir;
Saad, Hafiz Muhammad;
Rizwan, Muhammad;
Quazi, M. M.;
Ali, Muhammad Mahmood;
Ahmed, Arslan;
Zaidi, Asad A.;
Soudagar, Manzoore Elahi M.;
Haseeb, A. S. M. A.;
Naher, Sumsun

Publication type:

Article

Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 25, p. 20106, doi. 10.1007/s10854-022-08827-0

By:

Bashir, M. Nasir;
Haseeb, A. S. M. A.;
Wakeel, Saif;
Khan, Muhammad Ali;
Quazi, M. M.;
Khan, Niaz Bahadur;
Ahmed, Arslan;
Soudagar, Manzoore Elahi M.

Publication type:

Article

Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17745, doi. 10.1007/s10854-022-08637-4

By:

Wang, Fengyi;
Wang, Xinjie;
Xu, Kexin;
Wang, Jintao;
Zhang, Weiwei;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11002, doi. 10.1007/s10854-022-08079-y

By:

Lee, Dong-hun;
Jang, Jae-il;
Kim, Young-Ho

Publication type:

Article

Effect of Ni-coated carbon nanotubes addition on the wettability, microhardness, and shear strength of Sn-3.0Ag-0.5Cu/Cu lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 10866, doi. 10.1007/s10854-022-08067-2

By:

Qu, Min;
Gao, Zixuan;
Chen, Jin;
Cui, Yan

Publication type:

Article

Superconductivity of Ga-In-Sn liquid alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10021, doi. 10.1007/s10854-022-07993-5

By:

Zhang, Ting-Ting;
Xie, Gui-Xu;
Cheng, Guo-Ting;
Chen, Si-Heng;
Zhu, Dong-Yang;
Zhang, Yu-Rui;
Han, Wen-Peng;
Chen, Dong;
Long, Yun-Ze

Publication type:

Article

Study of liquid-phase ultrasonically exfoliated Cu0.4Sn0.6Se ternary alloy nanoparticles-based photodetector.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 11, p. 8361, doi. 10.1007/s10854-021-06188-8

By:

Patel, Kunjal;
Patel, Anand;
Jethwa, Vibhutiba P.;
Solanki, G. K.;
Patel, K. D.;
Pathak, V. M.

Publication type:

Article

Influence of 0.05 wt% Pr addition on interfacial microstructure and mechanical properties of Sn–0.3Ag–0.7Cu/Cu solder joint during thermal shocking.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 7099, doi. 10.1007/s10854-022-07892-9

By:

Zhang, Peng;
Xue, Songbai;
Qian, Cheng;
Wang, Jianhao;
Liu, Lu;
Wu, Jie

Publication type:

Article

Enhanced mechanical properties and corrosion behavior of Zn–30Sn–2Cu high-temperature lead-free solder alloy by adding Sm.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 6469, doi. 10.1007/s10854-022-07821-w

By:

zhang, Huajin;
Hu, Xiaowu;
Liu, Yi;
zhang, Jiankang;
Jiang, Xiongxin;
Li, Qinglin

Publication type:

Article

The doping of SZC solders with bismuth to improve their thermal and tensile characteristics for microelectronic applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 4831, doi. 10.1007/s10854-021-07672-x

By:

Deghady, A. M.;
Fadel, M. M.;
Eid, E. A.

Publication type:

Article

Role of graphene oxide (GO) for enhancing the solidification rate and mechanical properties of Sn–6.5Zn–0.4 wt% Cu Pb-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 522, doi. 10.1007/s10854-021-07324-0

By:

Fouda, A. N.;
Eid, E. A.

Publication type:

Article

Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 177, doi. 10.1007/s10854-021-07283-6

By:

Qin, Weiou;
Li, Jidong;
Zhang, Qiang;
Jiang, Shiwei;
Feng, Junli;
Yang, Wenchao;
Zhan, Yongzhong

Publication type:

Article

Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 11, doi. 10.1007/s10854-021-07144-2

By:

Aksöz, Sezen;
Esener, Pınar Ata;
Öztürk, Esra;
Maraşlı, Necmettin

Publication type:

Article

Strengthening mechanism of Ni-modified graphene nanosheets reinforced SnAgCuRE composite solder/Cu joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28695, doi. 10.1007/s10854-021-07245-y

By:

Wang, Huigai;
Zhang, Keke;
Wu, Yongjin;
Wang, Bingying

Publication type:

Article

The effect of alkaline earth additions on the physical property and the corrosion behavior of Sn-0.7Cu-0.075Al solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24152, doi. 10.1007/s10854-021-06881-8

By:

Qi, Da;
Du, Zaixiang;
Fu, Yaokun;
Jiang, Shiwei;
Liu, Dianfang;
Yang, Wenchao;
Zhan, Yongzhong

Publication type:

Article

Electrochemical behaviour of lead-free Sn–0.7Cu–xIn solders alloys in 3.5 wt% NaCl solution.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 23371, doi. 10.1007/s10854-021-06824-3

By:

Jaiswal, Dheeraj;
Singh, Vikrant;
Pathote, Dileep;
Behera, C. K.

Publication type:

Article

Competitive growth of Cu3Sn and Cu6Sn5 at Sn/Cu interface during various multi-reflow processes.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 22771, doi. 10.1007/s10854-021-06711-x

By:

Shang, Min;
Dong, Chong;
Yao, Jinye;
Wang, Chen;
Ma, Haoran;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Microstructure evolution of Cu/Sn58Bi/Cu solder joint bearing graphene nanosheets for 3D packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16970, doi. 10.1007/s10854-021-06261-2

By:

Jiang, Nan;
Zhang, Liang;
Gao, Li-li;
Long, Wei-min;
Zhong, Su-juan;
Zhang, Lei

Publication type:

Article

The effects of the addition of CNT@Ni on the hardness, density, wettability and mechanical properties of Sn-0.7Cu lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 8, p. 10843, doi. 10.1007/s10854-021-05742-8

By:

Mao, Jun;
Yang, Wenchao;
Song, Qianqian;
Lv, Yang;
Jiang, Shiwei;
Li, Yitai;
Zhan, Yongzhong

Publication type:

Article

A SnBiAgIn solder alloy with exceptional mechanical properties by rapid quenching.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 8167, doi. 10.1007/s10854-021-05539-9

By:

Ma, Hailan;
Zhao, Bingge;
Wu, Guanzhi;
Li, Zhen;
Gao, Yulai

Publication type:

Article

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6199, doi. 10.1007/s10854-021-05336-4

By:

El-Taher, A. M.;
Abd El Azeem, S. E.;
Ibrahiem, A. A.

Publication type:

Article

Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 3, p. 2865, doi. 10.1007/s10854-020-05040-9

By:

Tikale, Sanjay;
Narayan Prabhu, K.

Publication type:

Article

The preparation of black phosphorus in RP/Sn/I2 system: its nucleation agent and relatively optimal temperature program.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 19093, doi. 10.1007/s10854-020-04446-9

By:

Xu, Qian;
Zhu, Yabo;
Shi, Chao;
Zhang, Nao;
Xie, Tingting

Publication type:

Article

AC and DC bias effect on capacitance–voltage nonlinearities in Au/HfO2/M (M = Pt, TiN, W, and AlCu) MIM capacitors: effect of the bottom electrode material.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 19036, doi. 10.1007/s10854-020-04440-1

By:

Khaldi, Othmen;
Jomni, Fathi;
Gonon, Patrice;
Vallée, Christophe

Publication type:

Article

Microwave characteristics and microstructure of Zn2(Sn1−xTix)O4 for use as a Yagi antenna.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 21, p. 18515, doi. 10.1007/s10854-020-04395-3

By:

Chen, Yih-Chien;
Tai, Chun-Hao;
Hsiao, Chih-Lung

Publication type:

Article

Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn–30Sn–2Cu high temperature lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16437, doi. 10.1007/s10854-020-04196-8

By:

Zeng, Xianwei;
Liu, Yichi;
Zhang, Jiankang;
Liu, Yi;
Hu, Xiaowu;
Jiang, Xiongxin

Publication type:

Article

Structure and electrical properties in Sb-doped Ba0.93Ca0.07Ti0.92Sn0.08O3 ceramics near the phase coexistence point.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 19, p. 16235, doi. 10.1007/s10854-020-04166-0

By:

Peng, Shiqiang;
Zeng, Fangfang;
Wang, Yuanyu;
Liu, Qibin;
Xue, An;
Cai, Enpei;
Mou, Fanghui

Publication type:

Article

Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15308, doi. 10.1007/s10854-020-04095-y

By:

Li, Feng;
Verdingovas, Vadimas;
Dirscherl, Kai;
Harsányi, Gábor;
Medgyes, Bálint;
Ambat, Rajan

Publication type:

Article

Influence of graphene nanosheets addition on the microstructure, wettability, and mechanical properties of Sn-0.7Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14035, doi. 10.1007/s10854-020-03920-8

By:

Yang, Wenchao;
Lv, Yang;
Zhang, Xinjiang;
Wei, Xuanchen;
Li, Yitai;
Zhan, Yongzhong

Publication type:

Article

Recent advances in method of suppressing dendrite formation of tin-based solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 16, p. 13001, doi. 10.1007/s10854-020-03880-z

By:

Liao, Bokai;
Wang, Hong;
Xiao, Weiping;
Cai, Yu;
Guo, Xingpeng

Publication type:

Article

Conducting polymer-based electrically conductive adhesive materials: design, fabrication, properties, and applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 10947, doi. 10.1007/s10854-020-03712-0

By:

Derakhshankhah, Hossein;
Mohammad-Rezaei, Rahim;
Massoumi, Bakhshali;
Abbasian, Mojtaba;
Rezaei, Aram;
Samadian, Hadi;
Jaymand, Mehdi

Publication type:

Article

Investigation of anisotropic photoresponse in Re0.2Sn0.8Se2 ternary alloy at low temperature conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11123, doi. 10.1007/s10854-020-03661-8

By:

Chauhan, Payal;
Patel, Alkesh B.;
Patel, Kunjal;
Patel, Anand;
Solanki, G. K.;
Patel, K. D.;
Pathak, V. M.

Publication type:

Article

Chromium improvements on the mechanical performance of a rapidly solidified eutectic Sn–Ag alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 13, p. 10731, doi. 10.1007/s10854-020-03623-0

By:

Gumaan, Mohammed S.

Publication type:

Article

Corrosion behavior of Sn-based lead-free solder alloys: a review.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 12, p. 9076, doi. 10.1007/s10854-020-03540-2

By:

Li, Shuai;
Wang, Xingxing;
Liu, Zhongying;
Jiu, Yongtao;
Zhang, Shuye;
Geng, Jinfeng;
Chen, Xiaoming;
Wu, Shengjin;
He, Peng;
Long, Weimin

Publication type:

Article

Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 12, p. 9630, doi. 10.1007/s10854-020-03506-4

By:

El-Taher, A. M.;
Abd El Azeem, S. E.;
Ibrahiem, A. A.

Publication type:

Article

Effect of bismuth–tin composition on bonding strength of zinc particle–mixed copper nanoparticle/bismuth–tin solder hybrid joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 9, p. 6547, doi. 10.1007/s10854-020-03211-2

By:

Satoh, Toshikazu;
Usui, Masanori

Publication type:

Article

Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn–3.5Ag composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 5907, doi. 10.1007/s10854-019-02821-9

By:

Shalaby, Rizk Mostafa;
Elzanaty, Hesham

Publication type:

Article

Viscoplastic characterization of novel (Fe, Co, Te)/Bi containing Sn–3.0Ag–0.7Cu lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 7, p. 5521, doi. 10.1007/s10854-020-03117-z

By:

El-Taher, A. M.;
Ibrahiem, A. A.;
Razzk, A. F.

Publication type:

Article

Effect of doping Ni nanoparticles on microstructure evolution and shear behavior of Sn–3.0Ag–0.5Cu(SAC305)/Cu–2.0Be solder joints during reflowing.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 6, p. 4905, doi. 10.1007/s10854-020-03054-x

By:

Yin, Zuozhu;
Lin, Mei;
Li, Qi;
Wu, Ziyuan

Publication type:

Article

Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4027, doi. 10.1007/s10854-020-02950-6

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article