Void-free copper deposition.
- Published in:
- Solid State Technology, 2001, v. 44, n. 11, p. 97
- By:
- Publication type:
- Article
Works matching DE "INDUSTRIAL applications of copper"
Results: 20
1
2
Copper moves to the forefront of high tech.
- Published in:
- Solid State Technology, 1998, v. 41, n. 12, p. 16
- Publication type:
- Article
3
Cu, low-k dielectrics top MRS meeting agenda.
- Published in:
- Solid State Technology, 1998, v. 41, n. 7, p. 66
- By:
- Publication type:
- Article
4
IBM's copper technology.
- Published in:
- Solid State Technology, 1998, v. 41, n. 7, p. 52
- Publication type:
- Article
5
Copper ECD in beta test.
- Published in:
- Solid State Technology, 1998, v. 41, n. 7, p. 52
- By:
- Publication type:
- Article
6
Novellus, others unveil integrated copper system.
- Published in:
- Solid State Technology, 1998, v. 41, n. 7, p. 48
- By:
- Publication type:
- Article
7
Applied Materials' copper roadmap.
- Published in:
- Solid State Technology, 1998, v. 41, n. 3, p. 26
- By:
- Publication type:
- Article
8
Composite nanomaterials based on copper to replace silver in electrical contacts.
- Published in:
- Mechanics & Industry, 2016, v. 17, p. 1, doi. 10.1051/meca/2016075
- By:
- Publication type:
- Article
9
High Sensitive and Selective Spectrophotometric Method for the Determination of Copper in Industrial, Environmental, Biological and Soil Samples Using 2-Hydroxynaphthaldehydebenzoylhydrazone.
- Published in:
- Eurasian Journal of Analytical Chemistry, 2011, v. 6, n. 3, p. 206
- By:
- Publication type:
- Article
10
Small Tubes of Copper Yield Major Advantages.
- Published in:
- ASHRAE Journal, 2010, v. 52, n. 12, p. 94
- Publication type:
- Article
11
High-temperature Adhesion Promoter Based on (3-Glycidoxypropyl) Trimethoxysilane for Cu Paste.
- Published in:
- Bulletin of the Korean Chemical Society, 2014, v. 35, n. 10, p. 3025, doi. 10.5012/bkcs.2014.35.10.3025
- By:
- Publication type:
- Article
12
Extreme Extensibility of Copper Foil under Compound Forming Conditions.
- Published in:
- Scientific Reports, 2013, p. 1, doi. 10.1038/srep03556
- By:
- Publication type:
- Article
13
Sliding wear properties of high purity copper in cryogenic environment.
- Published in:
- Journal of Materials Science, 2009, v. 44, n. 9, p. 2300, doi. 10.1007/s10853-008-3043-x
- By:
- Publication type:
- Article
14
Materials progress: Metals.
- Published in:
- Advanced Materials & Processes, 1997, v. 152, n. 6, p. 9
- Publication type:
- Article
15
THE WEATHERVANE Artist.
- Published in:
- Weatherwise, 1999, v. 52, n. 4, p. 38, doi. 10.1080/00431679909604313
- By:
- Publication type:
- Article
16
Effect of Cu addition on microstructure and mechanical properties of Fe-2 wt-%Ni alloy processed by metal injection moulding.
- Published in:
- Materials Research Innovations, 2014, v. 18, n. S2, p. 629, doi. 10.1179/1432891714Z.000000000541
- By:
- Publication type:
- Article
17
Facile Assembly of a Large‐Area BNNSs Film for Oxidation/Corrosion‐Resistant Coatings.
- Published in:
- Advanced Materials Interfaces, 2018, v. 5, n. 19, p. N.PAG, doi. 10.1002/admi.201800750
- By:
- Publication type:
- Article
18
Copper and copper alloy powder technology and market developments in China.
- Published in:
- Powder Metallurgy, 2014, v. 57, n. 5, p. 314, doi. 10.1179/0032589914Z.000000000197
- By:
- Publication type:
- Article
19
Long-Term R&D Scores as IBM Completes Circuit with Copper.
- Published in:
- Research Technology Management, 2000, v. 43, n. 1, p. 5
- By:
- Publication type:
- Article
20
Using Less Metal in ACs.
- Published in:
- ASHRAE Journal, 2009, v. 51, n. 1, p. 10
- Publication type:
- Article