Works matching DE "HIGH temperature electronics"
Results: 95
PdTe<sub>2</sub> Transition‐Metal Dichalcogenide: Chemical Reactivity, Thermal Stability, and Device Implementation.
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- Advanced Functional Materials, 2020, v. 30, n. 5, p. N.PAG, doi. 10.1002/adfm.201906556
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- Article
Ferroelectric Field Effect Transistors: Highly Robust Flexible Ferroelectric Field Effect Transistors Operable at High Temperature with Low‐Power Consumption (Adv. Funct. Mater. 1/2020).
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- Advanced Functional Materials, 2020, v. 30, n. 1, p. N.PAG, doi. 10.1002/adfm.202070005
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- Article
High‐Temperature Oxidation‐Resistant Printed Copper Conductors.
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- Advanced Electronic Materials, 2023, v. 9, n. 3, p. 1, doi. 10.1002/aelm.202200979
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- Article
AN APPARATUS FOR HIGH-TEMPERATURE GAS PERMEABILITY MEASUREMENTS AND THE EVALUATION OF THE GAS BARRIER PROPERTIES OF CLAY NANOPLATE COATINGS UP TO 160°C.
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- Clay Science, 2021, v. 25, n. 1/2, p. 21, doi. 10.11362/jcssjclayscience.MS-21-3
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- Article
Directly Confirming the Z<sub>1/2</sub> Center as the Electron Trap in SiC Through Accessing the Nonradiative Recombination.
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- Physica Status Solidi - Rapid Research Letters, 2022, v. 16, n. 2, p. 1, doi. 10.1002/pssr.202100458
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- Article
New cryogenic technology for cooling superconducting cables.
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- Chemical Engineering, 2015, v. 122, n. 5, p. 7
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- Article
A 9-bit successive approximation ADC in SOI CMOS operating up to 300 °C.
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- International Journal of Circuit Theory & Applications, 2016, v. 44, n. 2, p. 418, doi. 10.1002/cta.2084
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- Article
Sodium–Sulfur Flow Battery for Low‐Cost Electrical Storage.
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- Advanced Energy Materials, 2018, v. 8, n. 11, p. 1, doi. 10.1002/aenm.201701991
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- Article
Investigation of a Quasi-Diamagnetic Machine Based on High-Temperature Superconductor-Based Rotor.
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- Journal of Superconductivity & Novel Magnetism, 2015, v. 28, n. 2, p. 663, doi. 10.1007/s10948-014-2792-9
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- Article
High-Temperature Superconducting Fiber.
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- Journal of Superconductivity & Novel Magnetism, 2014, v. 27, n. 4, p. 891, doi. 10.1007/s10948-014-2483-6
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- Article
TRANSIENT ANALYSIS OF DEPRESSURIZED LOSS-OF-FORCED-CIRCULATION ACCIDENT WITHOUT SCRAM IN HIGH-TEMPERATURE GAS-COOLED REACTOR.
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- Nuclear Technology, 2014, v. 185, n. 3, p. 227, doi. 10.13182/NT13-97
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- Article
Thermal imaging system based on a high-temperature superconductor.
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- Instruments & Experimental Techniques, 2013, v. 56, n. 4, p. 485, doi. 10.1134/S0020441213030196
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- Article
Editorial for the Special Issue on SiC Based Miniaturized Devices.
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- 2020
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- Editorial
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review.
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- Micromachines, 2019, v. 10, n. 6, p. 406, doi. 10.3390/mi10060406
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- Article
Impact of Wide-Bandgap Technology on Renewable Energy and Smart-Grid Power Conversion Applications Including Storage.
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- Energies (19961073), 2019, v. 12, n. 23, p. 4462, doi. 10.3390/en12234462
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- Article
Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.
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- Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2988, doi. 10.1007/s11664-024-11021-z
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- Article
A Junctionless Silicon Carbide Transistor for Harsh Environment Applications.
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- Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5682, doi. 10.1007/s11664-021-09087-0
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Commercial GaN-Based Power Electronic Systems: A Review.
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- Journal of Electronic Materials, 2020, v. 49, n. 11, p. 6247, doi. 10.1007/s11664-020-08397-z
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- Article
Electrical Properties of a p-n Heterojunction of Li-Doped NiO and Al-Doped ZnO for Thermoelectrics.
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- Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5296, doi. 10.1007/s11664-018-6394-3
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- Article
Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 430, doi. 10.1007/s11664-017-5792-2
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- Article
High-Temperature Thermoelectric Properties of (1 − x) SrTiO − ( x) LaNbO Ceramic Solid Solution.
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- Journal of Electronic Materials, 2015, v. 44, n. 6, p. 1803, doi. 10.1007/s11664-014-3560-0
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- Article
Unileg Thermoelectric Generator Design for Oxide Thermoelectrics and Generalization of the Unileg Design Using an Idealized Metal.
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- Journal of Electronic Materials, 2015, v. 44, n. 6, p. 1834, doi. 10.1007/s11664-014-3569-4
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- Article
Reliability Investigation of Cu/In TLP Bonding.
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- Journal of Electronic Materials, 2015, v. 44, n. 1, p. 435, doi. 10.1007/s11664-014-3373-1
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- Article
Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals.
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- Advanced Functional Materials, 2024, v. 34, n. 4, p. 1, doi. 10.1002/adfm.202311085
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- Article
Corundum Refractory Material in Alumina-Binder Resistant to High-Temperature Deformation.
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- Refractories & Industrial Ceramics, 2018, v. 59, n. 1, p. 85, doi. 10.1007/s11148-018-0187-3
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- Article
Contemporary Methods for Modeling High-Temperature Systems<sup>1</sup>.
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- Refractories & Industrial Ceramics, 2018, v. 59, n. 1, p. 71, doi. 10.1007/s11148-018-0185-5
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- Article
Electrically Conducting Ceramics Based on Al-AlN-TiB<sub>2</sub>.
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- High Temperature, 2018, v. 56, n. 4, p. 527, doi. 10.1134/S0018151X18040089
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- Article
Temperature dependence of the thermo-optic coefficient in 4H-SiC and GaN slabs at the wavelength of 1550 nm.
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- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-08232-x
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- Article
High-temperature Processing and Recovery of Decommissioned Electrochemical Cells and Batteries.
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- Acta Mechanica Slovaca, 2019, v. 23, n. 2, p. 56, doi. 10.21496/ams.2019.007
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- Article
High-Temperature Double-Layer Ceramic Packaging Substrates.
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- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 3, p. 99, doi. 10.4071/imaps.1123535
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- Article
Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 78, doi. 10.4071/imaps.873073
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- Article
Evaluation of Printed-Circuit Board Materials for High-Temperature Operation.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 166, doi. 10.4071/imaps.516313
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- Article
Electrical Performance of a 32-I/O HTCC Alumina Package for High-Temperature Microelectronics.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 11, doi. 10.4071/imaps.529
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- Article
A Resistive GaN-HEMT Mixer for a Cable Modem Operable up to 250°C for Downhole Communications.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 17, doi. 10.4071/imaps.526
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Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 39, doi. 10.4071/imaps.503
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Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 33, doi. 10.4071/imaps.487
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- Article
Test Results of Sintered Nanosilver Paste Die Attach for High-Temperature Applications.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 6, doi. 10.4071/imaps.492
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- Article
Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections.
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- Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 4, p. 163, doi. 10.4071/imaps.392
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- Article
EFFECT OF DIFFRENT LOADS ON THE WEAR BEHAVIORS OF 5Cr5Mo2V STEEL AT 700 °C.
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- Materials & Technologies / Materiali in Tehnologije, 2021, v. 55, n. 6, p. 753, doi. 10.17222/mit.2021.222
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- Article
High Temperature Superconductivity in Single-Unit-Cell-FeSe/TiO<sub>2-δ</sub>.
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- AAPPS Bulletin, 2017, v. 27, n. 4, p. 3
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- Article
A "Floatilla" of Airborne Seismometers for Venus.
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- Geophysical Research Letters, 2023, v. 50, n. 2, p. 1, doi. 10.1029/2022GL100978
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- Article
Development of a High-Temperature Tensile Tester for Micromechanical Characterization of Materials Supporting Meso-Scale ICME Models.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2016, v. 68, n. 11, p. 2754, doi. 10.1007/s11837-016-2100-1
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- Article
Advances in High-Temperature Alloys.
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- 2016
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- Editorial
Electrode kinetics at the Pt, O|LaSrScO interface.
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- Journal of Solid State Electrochemistry, 2017, v. 21, n. 8, p. 2457, doi. 10.1007/s10008-017-3593-4
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- Article
Crystal structure and high-temperature electrical conductivity of novel perovskite-related gallium and indium oxides.
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- Journal of Solid State Electrochemistry, 2014, v. 18, n. 5, p. 1415, doi. 10.1007/s10008-013-2190-4
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- Article
Neutronic Assessment of High-Temperature Gas-Cooled Thorium Burner using Monte Carlo Calculation Method with Full Core Model.
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- Gazi Üniversitesi Fen Bilimleri Dergisi Part C: Tasarım ve Teknoloji, 2023, v. 11, n. 4, p. 903, doi. 10.29109/gujsc.1302009
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- Article
Coefficients of Thermal Expansion of Al- and Y-Substituted NaSICON Solid Solution Na<sub>3+2x</sub>Al<sub>x</sub>Y<sub>x</sub>Zr<sub>2-2x</sub>Si<sub>2</sub>PO<sub>12</sub>.
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- Batteries, 2018, v. 4, n. 3, p. 1, doi. 10.3390/batteries4030033
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- Article
An Integrated Charge Pump for Phase-Locked Loop Applications in Harsh Environments.
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- Electronics (2079-9292), 2024, v. 13, n. 4, p. 744, doi. 10.3390/electronics13040744
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- Article
Thermal Characterization of Multi‐Layer Graphene Heat Spreader by Pt/Cu/Ti Micro‐Coil.
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- Physica Status Solidi. A: Applications & Materials Science, 2021, v. 218, n. 22, p. 1, doi. 10.1002/pssa.202100301
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- Article
Application of AlMgGaLi foil for joining copper to SiC<sub>p</sub>/Al-MMCs for high-temperature and high-power electronics.
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- Applied Physics A: Materials Science & Processing, 2019, v. 125, n. 8, p. N.PAG, doi. 10.1007/s00339-019-2884-2
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- Article