Works matching DE "THREE-dimensional integrated circuits"
Results: 140
3D-Stacked Many-Core Architecture for Biological Sequence Analysis Problems.
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- International Journal of Parallel Programming, 2017, v. 45, n. 6, p. 1420, doi. 10.1007/s10766-017-0495-0
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- Article
Asymmetry Index for Memory Effects Quantification in Wireless Transmitters and Power Amplifiers Driven by Broadband-Modulated Signals.
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- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2014, v. 39, n. 5, p. 4013, doi. 10.1007/s13369-014-1043-5
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- Article
Magnetic Field-Directed Self-Assembly of Magnetic Nanoparticle Chains in Bulk Polymers.
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- Particle & Particle Systems Characterization, 2013, v. 30, n. 9, p. 759, doi. 10.1002/ppsc.201300101
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- Article
Development of thin quartz glass utilising through-glass-via (TGV) formation by dry etching technology.
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- Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 10, p. 568, doi. 10.1049/mnl.2016.0242
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- Article
THE FOCUSING NLS ON EXTERIOR DOMAINS IN THREE DIMENSIONS.
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- Communications on Pure & Applied Analysis, 2017, v. 16, n. 6, p. 2269, doi. 10.3934/cpaa.2017112
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- Article
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).
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- Nanoscale Research Letters, 2017, v. 12, n. 1, p. 1, doi. 10.1186/s11671-017-1831-4
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- Article
Multi-objective Design Method for Hybrid Active Power Filter.
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- International Journal of Emerging Electric Power Systems, 2017, v. 18, n. 6, p. 1, doi. 10.1515/ijeeps-2017-0099
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- Article
Facile Preparation of the Porous PDMS Oil-Absorbent for Oil/Water Separation.
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- Advanced Materials Interfaces, 2017, v. 4, n. 3, p. n/a, doi. 10.1002/admi.201600862
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- Article
Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices.
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- Applied Sciences (2076-3417), 2022, v. 12, n. 8, p. 4086, doi. 10.3390/app12084086
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- Article
Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits.
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- Applied Sciences (2076-3417), 2020, v. 10, n. 3, p. 748, doi. 10.3390/app10030748
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- Article
Single-Grain Gate-All-Around Si Nanowire FET Using Low-Thermal-Budget Processes for Monolithic Three-Dimensional Integrated Circuits.
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- Micromachines, 2020, v. 11, n. 8, p. 741, doi. 10.3390/mi11080741
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- Article
Online Temperature Monitoring in the 3D Measurements Laboratory.
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- Quality - Access to Success, 2013, v. 14, n. 133, p. 89
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- Article
Implementation of High-Q Embedded Band Pass Filter in Wireless Communication.
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- Intelligent Automation & Soft Computing, 2023, v. 36, n. 2, p. 2191, doi. 10.32604/iasc.2023.021188
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- Article
Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging.
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- Journal of Phase Equilibria & Diffusion, 2016, v. 37, n. 4, p. 469, doi. 10.1007/s11669-016-0475-x
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- Article
Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading.
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- Journal of Electronic Materials, 2017, v. 46, n. 10, p. 5916, doi. 10.1007/s11664-017-5577-7
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- Article
In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6163, doi. 10.1007/s11664-016-4874-x
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- Article
Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits.
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- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3888, doi. 10.1007/s11664-015-3925-z
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- Article
Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4262, doi. 10.1007/s11664-014-3360-6
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- Article
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 204, doi. 10.1007/s11664-013-2721-x
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- Article
Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 236, doi. 10.1007/s11664-013-2840-4
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- Article
Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis.
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- Journal of Electronic Materials, 2014, v. 43, n. 1, p. 52, doi. 10.1007/s11664-013-2828-0
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- Article
Intermetallic Compound Formation Mechanisms for Cu-Sn Solid-Liquid Interdiffusion Bonding.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2453, doi. 10.1007/s11664-012-2060-3
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- Article
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2533, doi. 10.1007/s11664-012-2117-3
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- Article
Effect of Prebonding Anneal on the Microstructure Evolution and Cu-Cu Diffusion Bonding Quality for Three-Dimensional Integration.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2567, doi. 10.1007/s11664-012-2153-z
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- Article
Low-Resistance Cu-Sn Electroplated-Evaporated Microbumps for 3D Chip Stacking.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 720, doi. 10.1007/s11664-012-1949-1
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- Article
Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 232, doi. 10.1007/s11664-011-1767-x
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- Article
Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films.
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- Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2329, doi. 10.1007/s11664-011-1747-1
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- Article
Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond Testing.
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- Journal of Electronic Testing, 2019, v. 35, n. 5, p. 741, doi. 10.1007/s10836-019-05824-w
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- Article
Optimization of Test Wrapper for TSV Based 3D SOCs.
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- Journal of Electronic Testing, 2016, v. 32, n. 5, p. 511, doi. 10.1007/s10836-016-5610-4
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- Article
A Test-Ordering Based Temperature-Cycling Acceleration Technique for 3D Stacked ICs.
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- Journal of Electronic Testing, 2015, v. 31, n. 5/6, p. 503, doi. 10.1007/s10836-015-5541-5
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- Article
A Novel Wafer Manipulation Method for Yield Improvement and Cost Reduction of 3D Wafer-on-Wafer Stacked ICs.
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- Journal of Electronic Testing, 2014, v. 30, n. 1, p. 57, doi. 10.1007/s10836-013-5429-1
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- Article
Coordinated 3D spectrum utilization for B5G indoor HetNets: A collaborated crowdsensing approach.
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- IET Communications (Wiley-Blackwell), 2022, v. 16, n. 2, p. 111, doi. 10.1049/cmu2.12322
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- Article
Intermetallic compounds in 3D integrated circuits technology: a brief review.
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- Science & Technology of Advanced Materials, 2017, v. 18, n. 1, p. 693, doi. 10.1080/14686996.2017.1364975
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- Article
Intermetallic compounds in 3D integrated circuits technology: a brief review.
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- Science & Technology of Advanced Materials, 2017, v. 18, n. 1, p. 693, doi. 10.1080/14686996.2017.1364975
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- Article
Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips' Thermal Layout.
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- Technologies (2227-7080), 2023, v. 11, n. 5, p. 122, doi. 10.3390/technologies11050122
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- Article
Artificial intelligence deep learning for 3D IC reliability prediction.
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- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-08179-z
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- Article
Optimization of TSV interconnects and BEOL layers under annealing process through fracture evaluation.
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- Fatigue & Fracture of Engineering Materials & Structures, 2020, v. 43, n. 7, p. 1433, doi. 10.1111/ffe.13206
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- Article
Multilayer Reconfigurable 3D Photonics Integrated Circuits Based on Deposition Method.
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- Laser & Photonics Reviews, 2025, v. 19, n. 2, p. 1, doi. 10.1002/lpor.202400827
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- Article
Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications.
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- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 3, p. 124, doi. 10.4071/imaps.930748
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- Article
Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 71, doi. 10.4071/imaps.494
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- Article
High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D Integration.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 161, doi. 10.4071/imaps.416
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- Article
Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).
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- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 2, p. 97, doi. 10.4071/imaps.309
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- Article
AN ITERATIVE SOURCE RECONSTRUCTION METHOD EXPLOITING PHASELESS ELECTRIC FIELD DATA.
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- Progress in Electromagnetics Research, 2013, v. 134, p. 419, doi. 10.2528/pier12102105
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- Article
New Tile Structure for Microwave Modules Using Solderless Vertical Interconnections.
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- Microwave Journal, 2012, v. 55, n. 10, p. 76
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- Article
Advanced Electronic Interconnection.
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- 2019
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- Publication type:
- Editorial
Cellulose Nanofiber Supported 3D Interconnected BN Nanosheets for Epoxy Nanocomposites with Ultrahigh Thermal Management Capability.
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- Advanced Functional Materials, 2017, v. 27, n. 5, p. n/a, doi. 10.1002/adfm.201604754
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- Article
2021 JETTA-TTTC Best Paper Award: Thiago Copetti, Guilherme Cardoso Medeiros, Mottaqiallah Taouil, Said Hamdioui, Letícia Bolzani Poehls, and Tiago Balen, "Evaluation of Single Event Upset Susceptibility of FinFET‑based SRAMs with Weak Resistive Defects," Journal of Electronic Testing: Theory and Applications, Volume 37, Number 3, pp. 383–394, June 2021
- Published in:
- Journal of Electronic Testing, 2022, v. 38, n. 5, p. 465, doi. 10.1007/s10836-022-06031-w
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- Article
A Low-Cost, Robust and Tolerant, Digital Scheme for Post-Bond Testing and Diagnosis of TSVs.
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- Journal of Electronic Testing, 2021, v. 37, n. 2, p. 191, doi. 10.1007/s10836-021-05939-z
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- Article
Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC.
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- Journal of Electronic Testing, 2020, v. 36, n. 6, p. 771, doi. 10.1007/s10836-020-05916-y
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- Article
Three-Dimensional Numerical Modeling of Heat and Moisture Transfer in Natural Rubber Sheet Drying Process.
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- Drying Technology, 2015, v. 33, n. 9, p. 1124, doi. 10.1080/07373937.2015.1014910
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- Article