Works matching DE "THERMAL shock"
1
- Sensors (14248220), 2025, v. 25, n. 10, p. 3115, doi. 10.3390/s25103115
- Gong, Yangqing;
- Li, Yanrong;
- He, Shengdi
- Article
2
- Materials (1996-1944), 2025, v. 18, n. 10, p. 2200, doi. 10.3390/ma18102200
- Jakubus, Aneta;
- Soiński, Marek Sławomir;
- Stradomski, Grzegorz;
- Nadolski, Maciej;
- Mróz, Marek
- Article
3
- Materials (1996-1944), 2025, v. 18, n. 10, p. 2168, doi. 10.3390/ma18102168
- Xu, Yuchen;
- Chu, Zhenhua;
- Xu, Jingxiang;
- Tang, Wan;
- Gao, Li
- Article
4
- Journal of Wuhan University of Science & Technology, 2025, v. 48, n. 3, p. 179, doi. 10.3969/j.issn.1674-3644.2025.03.003
- 许向阳;
- 刘浩;
- 王周福;
- 朱 珠;
- 马 妍;
- 王玺堂;
- 杨雨菲
- Article
5
- Zygote, 2025, v. 33, n. 1, p. 10, doi. 10.1017/S0967199424000509
- Bazaz, Asim Iqbal;
- Shah, Tasaduq H.;
- Bhat, Farooz A.;
- Ahmad, Irfan;
- Kushwaha, Basdeo;
- Kumar, Ravindra;
- Abubakr, Adnan;
- Bhat, Bilal A.;
- Malik, Rizwana;
- Naqshbandi, Nafhat-Ul-Arab
- Article
6
- Crystals (2073-4352), 2025, v. 15, n. 5, p. 427, doi. 10.3390/cryst15050427
- Xu, Xiaohong;
- Li, Yuntian;
- Cheng, Tiantian;
- Wu, Jianfeng;
- Shen, Yaqiang;
- Qiu, Saixi;
- Yu, Jiaqi
- Article
7
- Surface Engineering, 2025, v. 41, n. 2, p. 176, doi. 10.1177/02670844251315284
- P. V., Sachin Raj;
- S. P., Kumaresh Babu;
- P. V., Adarsh Vijayan;
- S., Manivannan
- Article
8
- Surface Engineering, 2023, v. 39, n. 6, p. 738, doi. 10.1080/02670844.2023.2257856
- Kochmańska, Agnieszka;
- Kochmański, Paweł
- Article
9
- Surface Engineering, 2022, v. 38, n. 10-12, p. 977, doi. 10.1080/02670844.2023.2180856
- Márquez-Cortés, R.;
- Martínez-Trinidad, J.;
- García-León, R. A.
- Article
10
- Surface Engineering, 2022, v. 38, n. 1, p. 44, doi. 10.1080/02670844.2022.2026665
- Dai, Weibing;
- Zhang, Xiulu;
- Li, Changyou;
- Yao, Guo
- Article
11
- Surface Engineering, 2021, v. 37, n. 9, p. 1194, doi. 10.1080/02670844.2021.1959287
- Miri, T.;
- Seifzadeh, D.;
- Rajabalizadeh, Z.
- Article
12
- Surface Engineering, 2021, v. 37, n. 8, p. 991, doi. 10.1080/02670844.2020.1840692
- Taghi-Ramezani, Saeid;
- Valefi, Zia;
- Mirjani, Masud;
- Ghasemi, Reza
- Article
13
- Surface Engineering, 2021, v. 37, n. 5, p. 572, doi. 10.1080/02670844.2020.1812478
- Gao, Minghao;
- Xu, Na;
- Zhang, Jia;
- Luan, Shengjia;
- Chang, Hui;
- Hou, Wanliang;
- Chang, Xinchun
- Article
14
- Surface Engineering, 2020, v. 36, n. 10, p. 1113, doi. 10.1080/02670844.2020.1766866
- Li, Min;
- Wei, Kun Xia;
- Wei, Wei;
- Du, Qing Bo;
- Zhao, Xiao Bing;
- Hu, Jing
- Article
15
- Surface Engineering, 2019, v. 35, n. 8, p. 710, doi. 10.1080/02670844.2019.1573343
- Men, Xiangdong;
- Tao, Fenghe;
- Gan, Lin;
- Zhao, Fang
- Article
16
- Surface Engineering, 2019, v. 35, n. 7, p. 627, doi. 10.1080/02670844.2018.1557996
- Wang, Ping;
- Gong, Ze Yu;
- Hu, Jie;
- Pu, Jun;
- Cao, Wen Jie
- Article
17
- Surface Engineering, 2017, v. 33, n. 3, p. 237, doi. 10.1080/02670844.2016.1216053
- Zhang, M.-Y.;
- Li, K.-Z.;
- Shi, X.-H.;
- Liu, N.-K.
- Article
18
- Surface Engineering, 2015, v. 31, n. 5, p. 335, doi. 10.1179/1743294414Y.0000000428
- Hu, M. H.;
- Li, K. Z.;
- Li, H. J.;
- Wang, B.;
- Ma, H. L.
- Article
19
- Surface Engineering, 2015, v. 31, n. 1, p. 64, doi. 10.1179/1743294414Y.0000000397
- Pourbafrani, M.;
- Razavi, R. Shoja;
- Bakhshi, S. R.;
- Loghman-Estarki, M. R.;
- Jamali, H.
- Article
20
- Surface Engineering, 2014, v. 30, n. 8, p. 579, doi. 10.1179/1743294414Y.0000000289
- Lu, G. X.;
- Hao, L. J.;
- Cheng, Z. X.;
- Ye, F. X.
- Article
21
- Surface Engineering, 2014, v. 30, n. 3, p. 195, doi. 10.1179/1743294413Y.0000000236
- Deng, J.;
- Li, S.;
- Xing, Y.;
- Li, Y.
- Article
22
- Surface Engineering, 2013, v. 29, n. 2, p. 134, doi. 10.1179/1743294412Y.0000000063
- Article
23
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4
- Seo, Wonil;
- Ko, Yong-Ho;
- Kim, Young-Ho;
- Yoo, Sehoon
- Article
24
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5526, doi. 10.1007/s10854-019-00846-8
- Yang, Fan;
- Hu, Bo;
- Peng, Ye;
- Hang, Chunjin;
- Chen, Hongtao;
- Lee, Changwoo;
- Wei, Jun;
- Li, Mingyu
- Article
25
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2342, doi. 10.1007/s10854-018-0507-x
- Chou, Tzu-Ting;
- Fleshman, Collin Jordon;
- Chen, Hao;
- Duh, Jenq-Gong
- Article
26
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8767, doi. 10.1007/s10854-018-8893-7
- Wang, Ziming;
- Zou, Jun;
- Zhang, Canyun;
- Shi, Mingming;
- Yang, Bobo;
- Li, Yang;
- Zhou, Heyu;
- Liu, Yiming;
- Li, Mengtian;
- Qian, Xinglu
- Article
27
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8584, doi. 10.1007/s10854-018-8872-z
- Sun, Huayu;
- Chan, Y. C.;
- Wu, Fengshun
- Article
28
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8116, doi. 10.1007/s10854-017-6518-1
- Sharma, Ashutosh;
- Kumar, Santosh;
- Jung, Do-Hyun;
- Jung, Jae
- Article
29
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9159, doi. 10.1007/s10854-016-4952-0
- Yim, Byung-Seung;
- Kim, Jong-Min
- Article
30
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9642, doi. 10.1007/s10854-016-5022-3
- Tan, Shihai;
- Han, Jing;
- Guo, Fu
- Article
31
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9470, doi. 10.1007/s10854-015-3406-4
- Article
32
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 7277, doi. 10.1007/s10854-015-3355-y
- Park, Semin;
- Nagao, Shijo;
- Sugahara, Tohru;
- Suganuma, Katsuaki
- Article
33
- Geotechnical & Geological Engineering, 2021, v. 39, n. 1, p. 37, doi. 10.1007/s10706-020-01305-6
- Wu, Xinghui;
- Wang, Peitao;
- Guo, Qifeng;
- Zhang, Jie;
- Cai, Meifeng
- Article
34
- BioMetals, 2018, v. 31, n. 4, p. 477, doi. 10.1007/s10534-018-0093-7
- Abreu, Patrícia L.;
- Cunha-Oliveira, Teresa;
- Ferreira, Leonardo M. R.;
- Urbano, Ana M.
- Article
35
- PAMM: Proceedings in Applied Mathematics & Mechanics, 2014, v. 14, n. 1, p. 459, doi. 10.1002/pamm.201410217
- Jung, Anne;
- Diebels, Stefan
- Article
36
- Journal of Solid State Electrochemistry, 2016, v. 20, n. 1, p. 143, doi. 10.1007/s10008-015-3010-9
- Tatko, Maciej;
- Mosiałek, Michał;
- Kędra, Aneta;
- Bielańska, Elżbieta;
- Ruggiero-Mikołajczyk, Małgorzata;
- Nowak, Paweł
- Article
38
- Continuum Mechanics & Thermodynamics, 2020, v. 32, n. 4, p. 1095, doi. 10.1007/s00161-019-00812-z
- Zhang, Jinghua;
- Chen, Shuai;
- Zheng, Wu
- Article
39
- Continuum Mechanics & Thermodynamics, 2020, v. 32, n. 3, p. 883, doi. 10.1007/s00161-019-00765-3
- Article
40
- Computational Mechanics, 2022, v. 69, n. 5, p. 1165, doi. 10.1007/s00466-021-02135-w
- Storm, J.;
- Yin, B.;
- Kaliske, M.
- Article
41
- Computational Mechanics, 2020, v. 65, n. 5, p. 1305, doi. 10.1007/s00466-020-01820-6
- Wang, Tao;
- Ye, Xuan;
- Liu, Zhanli;
- Liu, Xiaoming;
- Chu, Dongyang;
- Zhuang, Zhuo
- Article
42
- Strength of Materials, 2023, v. 55, n. 5, p. 888, doi. 10.1007/s11223-023-00579-4
- Article
43
- Strength of Materials, 2022, v. 54, n. 6, p. 1082, doi. 10.1007/s11223-023-00483-x
- Article
44
- Strength of Materials, 2022, v. 54, n. 3, p. 525, doi. 10.1007/s11223-022-00427-x
- Article
45
- Strength of Materials, 2022, v. 54, n. 2, p. 188, doi. 10.1007/s11223-022-00394-3
- Pokrovs'kyi, V. V.;
- Sidyachenko, V. G.;
- Ezhov, V. M.
- Article
46
- Strength of Materials, 2016, v. 48, n. 5, p. 603, doi. 10.1007/s11223-016-9803-y
- Kharchenko, V.;
- Chirkov, A.
- Article
47
- Strength of Materials, 2014, v. 46, n. 2, p. 256, doi. 10.1007/s11223-014-9544-8
- Wang, Y.;
- Dong, M.;
- Li, H.;
- Liu, Y.;
- Shang, Q.
- Article
48
- Astrophysics, 2020, v. 63, n. 1, p. 91, doi. 10.1007/s10511-020-09617-4
- Article
49
- Trends in Sciences, 2023, v. 20, n. 10, p. 1, doi. 10.48048/tis.2023.6793
- Daniel, Shetha;
- Banerjee, Nilotpal;
- Majumder, Manik;
- Vishweshwara, Sudhir Chitrapady
- Article
50
- Journal of Ordnance Equipment Engineering, 2023, v. 44, n. 6, p. 25, doi. 10.11809/bqzbgcxb2023.06.004
- Article