Works matching DE "INTERFACIAL reactions"

Results: 880

Thermoplastic Vulcanizates Based on Silicone Rubber and Polyhydroxybutyrate via In Situ Interfacial Compatibilization.

Published in:

Plastics Science & Technology / Suliao Ke-Ji, 2025, v. 53, n. 4, p. 32, doi. 10.15925/j.cnki.issn1005-3360.2025.04.006

By:

CUI Ying;
ZHENG Kuo;
LI Xu;
HU Jiaming;
LI Long;
FANG Qinghong;
KANG Hailan

Publication type:

Article

The Perylenediimide‐Based Cathode Interfacial Materials can "Kill" Nonfullerene Acceptors ITIC/Y6.

Published in:

ChemNanoMat, 2025, v. 11, n. 5, p. 1, doi. 10.1002/cnma.202400609

By:

Shi, Yaohua;
Zhou, Yuanyuan;
Cui, Xinyue;
Wang, Xingjie;
Li, Miao;
Zhu, Qianqian;
Duan, Ziyou;
Qin, Ruiping

Publication type:

Article

Laser Cladding for Diamond-Reinforced Composites with Low-Melting-Point Transition Layer.

Published in:

Materials (1996-1944), 2025, v. 18, n. 10, p. 2402, doi. 10.3390/ma18102402

By:

Chen, Yongqian;
Du, Yifei;
Liu, Jialin;
Zhang, Shanghua;
Wang, Tianjian;
Guo, Shirui;
Cui, Yinghao;
Li, Xiaolei;
Zheng, Bo;
Zhao, Yue;
Cui, Lujun

Publication type:

Article

Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C.

Published in:

Materials (1996-1944), 2025, v. 18, n. 10, p. 2379, doi. 10.3390/ma18102379

By:

Wang, Chao-Hong;
Li, Yue-Han

Publication type:

Article

Systematic Study of Liquid-State Interfacial Reactions Between Co and In-Sn Solders with Varying Sn Contents.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2589, doi. 10.1007/s11664-024-11382-5

By:

Wang, Chao-hong;
Chang, Tai-yu

Publication type:

Article

Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6471, doi. 10.1007/s11664-024-11360-x

By:

Lin, Bo-Yi;
Lin, Ting-Chun;
Kao, Chin-Li;
Hsiao, Shih-Chieh;
Tseng, Pei-Hsuan;
Kuo, Jui-Chao

Publication type:

Article

Effect of Sn Orientation on Electromigration Failure in CuSn Solders.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6424, doi. 10.1007/s11664-024-11301-8

By:

Pham, Andrew Minh;
Haq, Fariha;
Sadasiva, Subramanya;
Li, Guangxu;
Koslowski, Marisol

Publication type:

Article

Recent Advances in Metal–Organic Framework Electrode Materials for all-Metal-Ion Batteries.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 7, p. 3642, doi. 10.1007/s11664-024-11126-5

By:

Ramasubramanian, Brindha;
Dalapati, Goutam Kumar;
Ramakrishna, Seeram

Publication type:

Article

Dual Strategies with Anion/Cation Co‐Doping and Lithium Carbonate Coating to Enhance the Electrochemical Performance of Lithium‐Rich Layered Oxides.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 71, p. 1, doi. 10.1002/chem.202302569

By:

Chen, Huai;
Ma, Jun;
Liu, Fei;
Yao, Mengqin

Publication type:

Article

Wettability‐Regulated Synthesis of Metal–Organic Framework Array with Subnanochannels Enables Efficient Separation of Mono‐/Multivalent Metal Ions.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 39, p. 1, doi. 10.1002/chem.202301163

By:

Wu, Zihan;
Li, Chen;
Huang, Cheng;
Cheng, Sha;
Ouyang, Xiaozhi;
Chen, Wen;
Zhang, Pengchao;
Jiang, Yanan;
Jiang, Lei

Publication type:

Article

Rapidly Adaptive All‐covalent Nanoparticle Surface Engineering.

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 38, p. 9948, doi. 10.1002/chem.202101042

By:

Diez‐Castellnou, Marta;
Suo, Rongtian;
Marro, Nicolas;
Matthew, Saphia A. L.;
Kay, Euan R.

Publication type:

Article

The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18878, doi. 10.1007/s10854-019-02244-6

By:

Sun, Fenglian;
Yin, Zuozhu

Publication type:

Article

Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18462, doi. 10.1007/s10854-019-02200-4

By:

Sun, Lei;
Chen, Ming-he;
Zhang, Liang;
Xie, Lan-sheng;
Wei, Chun-chun

Publication type:

Article

Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14791, doi. 10.1007/s10854-019-01852-6

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Qinglin

Publication type:

Article

Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12840, doi. 10.1007/s10854-019-01729-8

By:

Du, Yahong;
Wen, Ming;
Ji, Hongjun;
Li, Mingyu;
Liu, Zhi-Quan

Publication type:

Article

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12911, doi. 10.1007/s10854-019-01653-x

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11552, doi. 10.1007/s10854-019-01512-9

By:

Wang, Haozhong;
Hu, Xiaowu;
Li, Qinglin;
Qu, Min

Publication type:

Article

Unique interfacial reaction and so-induced change in mechanical performance of Sn-3.0Ag-0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4770, doi. 10.1007/s10854-019-00771-w

By:

Zhou, M. B.;
Zhao, X. F.;
Yue, W.;
Zhang, X. P.

Publication type:

Article

Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4359, doi. 10.1007/s10854-019-00758-7

By:

Huang, Ru;
Ma, Haoran;
Shang, Shengyan;
Kunwar, Anil;
Wang, Yunpeng;
Ma, Haitao

Publication type:

Article

Interfacial reaction between liquid-state Sn-xBi solder and Co substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9155, doi. 10.1007/s10854-018-8943-1

By:

Qiu, Yu;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3985, doi. 10.1007/s10854-017-8340-1

By:

Fu, Shao-Wei;
Lee, Chin C.

Publication type:

Article

Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 1, p. 589, doi. 10.1007/s10854-017-7951-x

By:

Guo, Bingfeng;
Kunwar, Anil;
Jiang, Chengrong;
Zhao, Ning;
Sun, Junhao;
Chen, Jun;
Wang, Yunpeng;
Huang, Mingliang;
Ma, Haitao

Publication type:

Article

The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 18515, doi. 10.1007/s10854-017-7799-0

By:

Xu, Tao;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

Effects of Al, Pr additions on the wettability and interfacial reaction of Zn-25Sn solder on Cu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 105, doi. 10.1007/s10854-016-5498-x

By:

Niu, Xi;
Lin, Kwang-Lung

Publication type:

Article

Effect of Ni and Ni-coated Carbon Nanotubes on the interfacial reaction and growth behavior of Sn58Bi/Cu intermetallic compound layers.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 12264, doi. 10.1007/s10854-016-5384-6

By:

Yang, Lizhuang;
Zhou, Wei;
Li, Xuezheng;
Ma, Yong;
Liang, Yinghua;
Cui, Wenquan;
Wu, Ping

Publication type:

Article

Effect of Zn concentration on the interfacial reactions between Sn-3.0Ag-0.5Cu solder and electroplated Cu- xZn wetting layers ( x = 0-43 wt%).

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5916, doi. 10.1007/s10854-016-4510-9

By:

Park, Jae-Yong;
Kim, Young;
Kim, Young-Ho

Publication type:

Article

Interfacial reaction mechanism and kinetics between Au-20Sn and Sn.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5982, doi. 10.1007/s10854-016-4520-7

By:

Liu, Wensheng;
Wang, Yikai;
Ma, Yunzhu;
Huang, Yufeng;
Yu, Qiang

Publication type:

Article

Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4245, doi. 10.1007/s10854-016-4288-9

By:

Hu, Xiaowu;
Xu, Tao;
Jiang, Xiongxin;
Li, Yulong

Publication type:

Article

Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4839, doi. 10.1007/s10854-016-4366-z

By:

Shao, Huakai;
Wu, Aiping;
Bao, Yudian;
Zhao, Yue;
Zou, Guisheng

Publication type:

Article

Effects of Bi addition on interfacial reactions and mechanical properties of In-3Ag-xBi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 103, doi. 10.1007/s10854-015-3724-6

By:

Ma, Yunzhu;
Luo, Huiting;
Liu, Wensheng;
Huang, Yufeng;
Yu, Qiang;
Li, Yongjun

Publication type:

Article

Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 11, p. 8522, doi. 10.1007/s10854-015-3524-z

By:

Li, Yi;
Wu, Fengshun;
Chan, Y.

Publication type:

Article

Interfacial reactions between Cu substrate and Sn-1Ag-0.5Cu solder containing 0.1 wt% Al by dipping method.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 8229, doi. 10.1007/s10854-015-3486-1

By:

Shnawah, Dhafer;
Sabri, Mohd;
Said, Suhana;
Jauhari, Iswadi;
Mahdavifard, Mohammad;
Bashir, Mohamed;
Elsheikh, Mohamed

Publication type:

Article

Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3427, doi. 10.1007/s10854-015-2852-3

By:

Garnier, Arnaud;
Baillin, Xavier;
Hodaj, Fiqiri

Publication type:

Article

Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn-0.7Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 345, doi. 10.1007/s10854-014-2406-0

By:

Zhao, N.;
Huang, M.;
Zhong, Y.;
Ma, H.;
Pan, X.

Publication type:

Article

Microstructure and interfacial reaction of Sn-Zn-x(Al,Ag) near-eutectic solders on Al and Cu substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 5, p. 2311, doi. 10.1007/s10854-014-1877-3

By:

Huang, M.;
Hou, X.;
Kang, N.;
Yang, Y.

Publication type:

Article

Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 328, doi. 10.1007/s10854-013-1590-7

By:

Liu, Xiaoying;
Huang, Mingliang;
Zhao, Ning;
Wang, Lai

Publication type:

Article

Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 423, doi. 10.1007/s10854-013-1605-4

By:

Bui, Q.;
Jung, S.

Publication type:

Article

Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 57, doi. 10.1007/s10854-013-1548-9

By:

Hu, Xiaowu;
Yu, Xiao;
Li, Yulong;
Huang, Qiang;
Liu, Yi;
Min, Zhixian

Publication type:

Article

Interfacial Reaction Mechanism of Silicon Carbide and Heat Resistant Steel in High-Temperature Vacuum.

Published in:

Bulletin of the Chinese Ceramic Society, 2023, v. 42, n. 6, p. 2161

By:

XIE Yingying;
CHEN Mao;
SONG Zijie;
FAN Bingbing;
ZHANG Rui;
CHEN Yongqiang

Publication type:

Article

Hazardous Waste Slag Corrosion Resistance of Cement Bonded Al2O3 -Cr2O3 Castable.

Published in:

Bulletin of the Chinese Ceramic Society, 2022, v. 41, n. 9, p. 3304

By:

LIAO Zixin;
LI Yawei;
LIAO Ning;
LIU Huilin

Publication type:

Article

Dependence of photocatalytic performance on interfacial reaction in carbon dots/mesoporous hydroxyapatite nanocomposites.

Published in:

Micro & Nano Letters (Wiley-Blackwell), 2020, v. 15, n. 2, p. 106, doi. 10.1049/mnl.2019.0389

By:

Wei Xu;
Shanshan Yang;
Kaikai Li;
Jinlong Yang;
Trinchi, Adrian;
Qing Chang;
Shengliang Hu

Publication type:

Article

Tailored alumina nanocomposite membranes featuring MIL-125-NH2 metal-organic frameworks for oily wastewater treatment.

Published in:

NPJ Clean Water, 2024, v. 7, n. 1, p. 1, doi. 10.1038/s41545-024-00321-w

By:

Baig, Umair;
Waheed, Abdul;
Yogarathinam, Lukka Thuyavan;
Aljundi, Isam H.

Publication type:

Article

Evaluation and Study of Injection Performance of Binary System of Anti-Salt Polymer and Surfactant.

Published in:

Special Oil & Gas Reservoirs, 2023, v. 30, n. 1, p. 120, doi. 10.3969/j.issn.1006-6535.2023.01.017

By:

Zhou Quan;
Zhang Shidong;
Zhou Wanfu

Publication type:

Article

Effect of Ni-P Coating on Microstructure and Mechanical Properties of Cu/Al Brazed Joints.

Published in:

Journal of Henan University of Science & Technology, Natural Science, 2024, v. 45, n. 4, p. 31, doi. 10.15926/j.cnki.issn1672-6871.2024.04.004

By:

ZHANG Xuezhi;
HUANG Lingling;
LI Yunpeng;
YU Zhuoli;
CAO Xinna;
SONG Luyang;
AN Pengtao;
WEI Shizhong

Publication type:

Article

Effect of Ni-P Coating on Microstructure and Mechanical Properties of Cu/Al Brazed Joints.

Published in:

Journal of Henan University of Science & Technology, Natural Science, 2024, v. 45, n. 4, p. III

By:

ZHANG Xuezhi;
HUANG Lingling;
LI Yunpeng;
YU Zhuoli;
CAO Xinna;
SONG Luyang;
AN Pengtao;
WEI Shizhong

Publication type:

Article

Reinforcing electrochemical performance of Ni‐rich NCM cathode co‐modified by mg‐doping and Li3PO4‐coating.

Published in:

International Journal of Energy Research, 2022, v. 46, n. 11, p. 15244, doi. 10.1002/er.8222

By:

Hwang, Do‐Young;
Kang, Chea‐Yun;
Yoon, Jung‐Rag;
Lee, Seung‐Hwan

Publication type:

Article

Effects of yttria doping on the interfacial reaction between barium zirconate ceramics and TiAl alloy melt.

Published in:

Journal of Asian Ceramic Societies, 2025, v. 13, n. 1, p. 89, doi. 10.1080/21870764.2024.2447623

By:

Shen, Yun;
Hong, Du;
Sun, Tianfang;
Hou, Rui;
Zheng, Gong;
Niu, Yaran;
Chen, Guang

Publication type:

Article

Microstructure evolution of Ag-Cu/BaCo0.7Fe0.2Nb0.1O3-δ joints in air and argon atmospheres.

Published in:

Journal of Asian Ceramic Societies, 2021, v. 9, n. 2, p. 710, doi. 10.1080/21870764.2021.1913866

By:

Zhang, Chao;
Lv, Jinjin;
Chen, Zhiyu;
Bai, Dan;
Zhang, Lili;
Zhang, Yuwen;
Lu, Xionggang

Publication type:

Article

Interfacial reactions in thermoelectric modules.

Published in:

Materials Research Letters, 2018, v. 6, n. 4, p. 244, doi. 10.1080/21663831.2018.1436092

By:

Wu, Hsin-jay;
Wu, Albert T.;
Wei, Pai-chun;
Chen, Sinn-wen

Publication type:

Article

Cracking and Microstructure Transition of Iron Ore Containing Goethite in Fe-C Melt Based on the HIsmelt Process.

Published in:

Minerals (2075-163X), 2023, v. 13, n. 3, p. 448, doi. 10.3390/min13030448

By:

Wang, Guilin;
Zhang, Jianliang;
Liu, Zhengjian;
Tan, Yubo;
Wang, Yaozu

Publication type:

Article