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- Title
ФАЗОВІ ТА СТРУКТУРНІ ПЕРЕТВОРЕННЯ ПРИ НАГРІВАННІ БАГАТОШАРОВИХ ФОЛЬГ Ti/Cu ЕВТЕКТИЧНОГО СКЛАДУ, ОТРИМАНИХ МЕТОДОМ EBPVD.
- Authors
Демченков, С. О.; Мельниченко, Т. В.; Устінов, А. І.; Руденко, О. Е.; Самофалов, О. В.
- Abstract
Phase and structural transformations in multilayer Ti/Cu foils of eutectic Composition I (Ti50‒Cu50 wt.%) and Composition II (Ti22‒Cu78 wt.%), obtained by layer-by-layer electron beam physical vapor deposition of components in vacuum, were investigated using differential thermal analysis (DTA), X-ray diffraction (XRD), and scanning electron microscopy (SEM) methods. It was found that during heating of multilayer foils in the temperature range of 400…600 °C, due to the diffusion interaction between Ti and Cu layers, the following intermetallic compounds are formed: Cu4 Ti, Cu4 Ti3, CuTi, and CuTi2 in Composition I foils, and Cu4 Ti and Cu4 Ti3 in Composition II foils. Upon further heating, melting of the multilayer foils of both eutectic compositions occurs. The Composition II multilayer foils begin to melt at a temperature of 879 °C, close to the equilibrium melting temperature of the eutectic alloy of the same composition (875 °C), while in the case of Composition I multilayer foils, the onset of melting occurs at a temperature of 915 °C, which is lower compared to the melting temperature of the eutectic alloy of Composition I (960 °C). Considering that Cu4 Ti and Cu4 Ti3 metastable phases are formed in Composition I multilayer foils, which are components of the more fusible eutectic of Composition II, the reduction in the melting temperature of the foils may be due to their metastable structure. Such behavior of multilayer Ti/Cu foil of eutectic Composition I may facilitate softening of the temperature conditions required to establish physical contact in the material bonding zone during their reactive brazing.
- Subjects
PHYSICAL vapor deposition; EUTECTIC alloys; DIFFERENTIAL thermal analysis; INTERMETALLIC compounds; COPPER
- Publication
Electrometallurgy Today / Sovremennaya Elektrometallurgiya, 2024, Issue 3, p13
- ISSN
3041-2382
- Publication type
Academic Journal
- DOI
10.37434/sem2024.03.02