Works matching DE "THROUGH-silicon via"
Results: 93
Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration.
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- Microsystems & Nanoengineering, 2025, v. 11, n. 1, p. 1, doi. 10.1038/s41378-024-00797-z
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- Article
Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology.
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- Journal of Low Power Electronics & Applications, 2014, v. 4, n. 2, p. 77, doi. 10.3390/jlpea4020077
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- Article
Experimental characterisation of coaxial TSV transistor keep out zones.
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- Micro & Nano Letters (Wiley-Blackwell), 2018, v. 13, n. 10, p. 1457, doi. 10.1049/mnl.2018.5280
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- Article
STTAR: A Traffic- and Thermal-Aware Adaptive Routing for 3D Network-on-Chip Systems.
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- Computers, Materials & Continua, 2022, v. 72, n. 3, p. 5531, doi. 10.32604/cmc.2022.027177
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- Article
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).
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- Nanoscale Research Letters, 2017, v. 12, n. 1, p. 1, doi. 10.1186/s11671-017-1831-4
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- Article
Through-Silicon-Via Pairs Modelling via Compressed Sensing.
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- PIERS Proceedings, 2014, p. 2496
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- Article
A TSV-Structured Room Temperature p-Type TiO 2 Nitric Oxide Gas Sensor.
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- Applied Sciences (2076-3417), 2022, v. 12, n. 19, p. 9946, doi. 10.3390/app12199946
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- Article
Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices.
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- Applied Sciences (2076-3417), 2022, v. 12, n. 8, p. 4086, doi. 10.3390/app12084086
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- Article
Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition.
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- 2024
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- Publication type:
- Editorial
A Cross-Process Signal Integrity Analysis (CPSIA) Method and Design Optimization for Wafer-on-Wafer Stacked DRAM.
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- Micromachines, 2024, v. 15, n. 5, p. 557, doi. 10.3390/mi15050557
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- Article
Editorial for the Special Issue on State-of-the-Art CMOS and MEMS Devices.
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- Micromachines, 2024, v. 15, n. 3, p. 327, doi. 10.3390/mi15030327
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- Article
Research of Vertical via Based on Silicon, Ceramic and Glass.
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- Micromachines, 2023, v. 14, n. 7, p. 1391, doi. 10.3390/mi14071391
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- Article
Modeling and Validation of Total Ionizing Dose Effect on the TSVs in RF Microsystem.
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- Micromachines, 2023, v. 14, n. 6, p. 1180, doi. 10.3390/mi14061180
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- Article
Thermodynamic Multi-Field Coupling Optimization of Microsystem Based on Artificial Intelligence.
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- Micromachines, 2023, v. 14, n. 2, p. 411, doi. 10.3390/mi14020411
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- Article
Editorial for the Special Issue on Advanced Interconnect and Packaging.
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- 2023
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- Editorial
Process Optimization and Performance Evaluation of TSV Arrays for High Voltage Application.
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- Micromachines, 2023, v. 14, n. 1, p. 102, doi. 10.3390/mi14010102
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- Article
Design and Manufacture of Millimeter-Scale 3D Transformers for RF-IC.
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- Micromachines, 2022, v. 13, n. 12, p. 2162, doi. 10.3390/mi13122162
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- Article
An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias.
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- Micromachines, 2021, v. 12, n. 10, p. 1223, doi. 10.3390/mi12101223
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- Article
Editorial for the Special Issue on Small-Scale Deformation using Advanced Nanoindentation Techniques.
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- 2019
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- Editorial
In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures.
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- Micromachines, 2019, v. 10, n. 2, p. 86, doi. 10.3390/mi10020086
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- Article
Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor.
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- Micromachines, 2018, v. 9, n. 10, p. 528, doi. 10.3390/mi9100528
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- Article
Research Status of Copper Film Slurries for Through-Silicon Via Process: Research Status of Copper Film Slurries for Through-Silicon Via Process: X. Chen et al.
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- Journal of Electronic Materials, 2025, v. 54, n. 2, p. 910, doi. 10.1007/s11664-024-11629-1
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- Article
Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1214, doi. 10.1007/s11664-023-10845-5
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- Article
Study on Thermal Shock and Annealing Behavior of Sn3Ag0.5Cu-TSV Prepared by Modified Molten Metal Infiltration Method.
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- Journal of Electronic Materials, 2022, v. 51, n. 7, p. 4054, doi. 10.1007/s11664-022-09600-z
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- Article
Evaluation of Cu-TSV Barrier Materials as a Solution to Copper Protrusion.
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- Journal of Electronic Materials, 2020, v. 49, n. 3, p. 2076, doi. 10.1007/s11664-019-07894-0
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- Article
Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 159, doi. 10.1007/s11664-018-6805-5
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- Article
Mechanism of the Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 152, doi. 10.1007/s11664-018-6803-7
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- Article
Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 142, doi. 10.1007/s11664-017-5885-y
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- Article
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications.
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- Journal of Electronic Materials, 2015, v. 44, n. 8, p. 2898, doi. 10.1007/s11664-015-3752-2
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- Article
Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4214, doi. 10.1007/s11664-014-3319-7
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- Article
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2533, doi. 10.1007/s11664-012-2117-3
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- Article
Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 712, doi. 10.1007/s11664-012-1943-7
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- Article
Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects.
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- Journal of Electronic Testing, 2017, v. 33, n. 5, p. 573, doi. 10.1007/s10836-017-5681-x
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- Article
High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs).
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- Advances in Electrical & Computer Engineering, 2018, v. 18, n. 3, p. 9, doi. 10.4316/AECE.2018.03002
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- Article
SIP with TSV for Class 1 Medical Devices.
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- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 1, doi. 10.4071/imaps.497
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- Article
Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects.
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- Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 118, doi. 10.4071/imaps.456
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- Article
Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV).
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- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 2, p. 97, doi. 10.4071/imaps.309
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- Article
Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding.
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- Nanoscale Research Letters, 2014, v. 9, n. 1, p. 1, doi. 10.1186/1556-276X-9-541
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- Article
A Framework for Scalable TSV Assignment and Selection in Three-Dimensional Networks-on-Chips.
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- VLSI Design, 2017, p. 1, doi. 10.1155/2017/9427678
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- Article
A Novel 3D Encapsulation Structure Based on Subwavelength Structure and Inserted Pyrex Glass for RF MEMS Infrared Detectors.
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- Electronics (2079-9292), 2019, v. 8, n. 9, p. 974, doi. 10.3390/electronics8090974
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- Article
Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design.
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- Electronics (2079-9292), 2019, v. 8, n. 9, p. 1010, doi. 10.3390/electronics8091010
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- Article
TSV Technology and High-Energy Heavy Ions Radiation Impact Review.
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- Electronics (2079-9292), 2018, v. 7, n. 7, p. 112, doi. 10.3390/electronics7070112
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- Article
Electrical and Mechanical Analysis of Different TSV Geometries.
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- Metals (2075-4701), 2020, v. 10, n. 4, p. 467, doi. 10.3390/met10040467
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- Article
High-efficiency core-shell solar cell array from Si wafer.
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- Applied Physics A: Materials Science & Processing, 2012, v. 107, n. 4, p. 911, doi. 10.1007/s00339-012-6818-5
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- Article
High Frequency Electrical Characterization of 3D Signal/Ground through Silicon Vias.
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- Progress in Electromagnetics Research Letters, 2014, v. 47, p. 71, doi. 10.2528/pierl14052704
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- Article
Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling.
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- Applied Computational Intelligence & Soft Computing, 2021, p. 1, doi. 10.1155/2021/8830395
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- Article
TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither.
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- Journal of Advanced Computational Intelligence & Intelligent Informatics, 2019, v. 23, n. 1, p. 42, doi. 10.20965/jaciii.2019.p0042
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- Article
Addressing Interposer and TSV Quality Challenges.
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- EE: Evaluation Engineering, 2012, v. 51, n. 2, p. 16
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- Article
Peer-Reviewed Literature of Interest to Failure Analysis: A Cornucopia.
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- Electronic Device Failure Analysis, 2021, v. 23, n. 3, p. 46
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- Article
LITERATURE REVIEW.
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- Electronic Device Failure Analysis, 2020, v. 22, n. 2, p. 46
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- Article