Works matching DE "SEMICONDUCTOR manufacturing"
Results: 1080
Chip War: The Fight for the World's Most Critical Technology: Chris Miller, Simon & Schuster, London, UK, 2022, 431 pp., Price: £14.99 (Paperback), ISBN: 978-1-3985-0410-3.
- Published in:
- 2024
- By:
- Publication type:
- Book Review
Conflict and cooperation in the semiconductor industry: the global evolution of chip production.
- Published in:
- 2025
- By:
- Publication type:
- Book Review
Adsorption of Fluoride Ions Using Si–Al–Mg Layered Double Hydroxides.
- Published in:
- Solvent Extraction & Ion Exchange, 2025, v. 43, n. 1, p. 3, doi. 10.1080/07366299.2024.2401803
- By:
- Publication type:
- Article
Tensor‐based process control and monitoring for semiconductor manufacturing with unstable disturbances.
- Published in:
- Naval Research Logistics, 2025, v. 72, n. 3, p. 356, doi. 10.1002/nav.22228
- By:
- Publication type:
- Article
Nanoscale NMOS Device Model Analysis and its Characteristics.
- Published in:
- Macromolecular Symposia, 2025, v. 414, n. 1, p. 1, doi. 10.1002/masy.202400191
- By:
- Publication type:
- Article
High-Purity Processing Demands Contamination Control and Containment: Advanced technologies help pharmaceutical and semiconductor producers achieve excellence.
- Published in:
- Chemical Engineering, 2025, v. 122, n. 3, p. 13
- By:
- Publication type:
- Article
Research on laser multi-focal scribe cutting of silicon wafer based on spatial light modulation.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 3, p. 1117, doi. 10.1007/s00170-025-15267-7
- By:
- Publication type:
- Article
Optimising distributed heterogeneous flowshop group scheduling arising from PCB mounting: integrating construction and improvement heuristics.
- Published in:
- International Journal of Production Research, 2025, v. 63, n. 5, p. 1753, doi. 10.1080/00207543.2024.2390979
- By:
- Publication type:
- Article
CowSSL: contrastive open-world semi-supervised learning for wafer bin map.
- Published in:
- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 2163, doi. 10.1007/s10845-024-02351-0
- By:
- Publication type:
- Article
Virtual metrology for chemical mechanical planarization of semiconductor wafers.
- Published in:
- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 1923, doi. 10.1007/s10845-024-02335-0
- By:
- Publication type:
- Article
A novel joint segmentation approach for wafer surface defect classification based on blended network structure.
- Published in:
- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 1907, doi. 10.1007/s10845-024-02324-3
- By:
- Publication type:
- Article
Effective implementation for introducing ISO/TS 16949 in semiconductor manufacturing industries.
- Published in:
- Total Quality Management & Business Excellence, 2013, v. 24, n. 4, p. 462, doi. 10.1080/14783363.2012.728854
- By:
- Publication type:
- Article
Fluorinated MOF‐Based Hexafluoropropylene Nanotrap for Highly Efficient Purification of Octafluoropropane Electronic Specialty Gas.
- Published in:
- Angewandte Chemie, 2024, v. 136, n. 15, p. 1, doi. 10.1002/ange.202401770
- By:
- Publication type:
- Article
In Situ Exploration of the Structural Transition during Morphology‐ and Efficiency‐Conserving Halide Exchange on a Single Perovskite Nanocrystal.
- Published in:
- Angewandte Chemie, 2021, v. 133, n. 5, p. 2578, doi. 10.1002/ange.202013386
- By:
- Publication type:
- Article
Direct Nanomachining on Semiconductor Wafer By Scanning Electrochemical Microscopy.
- Published in:
- Angewandte Chemie, 2020, v. 132, n. 47, p. 21315, doi. 10.1002/ange.202008697
- By:
- Publication type:
- Article
Unraveling the Connection between Deposition, Microstructure, and Performance of Superconducting Quantum Circuits using Multi-modal Electron Microscopy.
- Published in:
- Microscopy & Microanalysis, 2024, v. 30, p. 1, doi. 10.1093/mam/ozae044.766
- By:
- Publication type:
- Article
Expanding the Role of Atom Probe Tomography in Semiconductor Manufacturing and R&D – The Initiation of a Project Between CAMECA Instruments Inc. and imec.
- Published in:
- 2023
- By:
- Publication type:
- Abstract
Ternary TiO<sub>2</sub>/MoS<sub>2</sub>/ZnO hetero-nanostructure based multifunctional sensing devices.
- Published in:
- Discover Nano, 2024, v. 19, n. 1, p. 1, doi. 10.1186/s11671-024-04112-7
- By:
- Publication type:
- Article
Optimal Ventilation Design for Flammable Gas Leaking from Gas Box Used in Semiconductor Manufacturing: Case Study on Korean Semiconductor Industry.
- Published in:
- Fire (2571-6255), 2023, v. 6, n. 11, p. 432, doi. 10.3390/fire6110432
- By:
- Publication type:
- Article
CMP Parameter Optimization and Polishing Mechanism Analysis of Cadmium Zinc Telluride Wafer Based on the Orthogonal Test.
- Published in:
- Lubrication Engineering (0254-0150), 2022, v. 47, n. 4, p. 92, doi. 10.3969/j.issn.0254-0150.2022.04.012
- By:
- Publication type:
- Article
Electrochemically exfoliated phosphorene nanosheet thin films for wafer-scale near-infrared phototransistor array.
- Published in:
- NPJ 2D Materials & Applications, 2022, v. 6, n. 1, p. 1, doi. 10.1038/s41699-022-00360-2
- By:
- Publication type:
- Article
A novel fault detection approach based on multilinear sparse PCA: application on the semiconductor manufacturing processes.
- Published in:
- Turkish Journal of Electrical Engineering & Computer Sciences, 2022, v. 30, n. 4, p. 1586, doi. 10.55730/1300-0632.3867
- By:
- Publication type:
- Article
3‐D Nanofabrication of Silicon and Nanostructure Fine‐Tuning via Helium Ion Implantation.
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202101643
- By:
- Publication type:
- Article
3‐D Nanofabrication of Silicon and Nanostructure Fine‐Tuning via Helium Ion Implantation.
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 10, p. 1, doi. 10.1002/admi.202101643
- By:
- Publication type:
- Article
Microscopical Quantification of Ion‐Induced Nanodefects in Monolayer MoS<sub>2</sub> Based on Differential Reflectance.
- Published in:
- Advanced Materials Interfaces, 2022, v. 9, n. 2, p. 1, doi. 10.1002/admi.202101612
- By:
- Publication type:
- Article
Improved Performances of CVD‐Grown MoS<sub>2</sub> Based Phototransistors Enabled by Encapsulation.
- Published in:
- Advanced Materials Interfaces, 2021, v. 8, n. 11, p. 1, doi. 10.1002/admi.202100164
- By:
- Publication type:
- Article
Wafer Bonding: Solution‐Processed‐ZnO‐Mediated Semiconductor Bonding with High Mechanical Stability, Electrical Conductivity, Optical Transparency, and Roughness Tolerance (Adv. Mater. Interfaces 22/2019).
- Published in:
- Advanced Materials Interfaces, 2019, v. 6, n. 22, p. N.PAG, doi. 10.1002/admi.201970137
- By:
- Publication type:
- Article
Periodic Scheduling Optimization for Dual-Arm Cluster Tools with Arm Task and Residency Time Constraints via Petri Net Model.
- Published in:
- Mathematics (2227-7390), 2024, v. 12, n. 18, p. 2912, doi. 10.3390/math12182912
- By:
- Publication type:
- Article
Wafer Delay Minimization in Scheduling Single-Arm Cluster Tools with Two-Space Process Modules.
- Published in:
- Mathematics (2227-7390), 2024, v. 12, n. 12, p. 1783, doi. 10.3390/math12121783
- By:
- Publication type:
- Article
A Machine Learning Approach for Improving Wafer Acceptance Testing Based on an Analysis of Station and Equipment Combinations.
- Published in:
- Mathematics (2227-7390), 2023, v. 11, n. 7, p. 1569, doi. 10.3390/math11071569
- By:
- Publication type:
- Article
A Credibility Theory-Based Robust Optimization Model to Hedge Price Uncertainty of DSO with Multiple Transactions.
- Published in:
- Mathematics (2227-7390), 2022, v. 10, n. 23, p. 4420, doi. 10.3390/math10234420
- By:
- Publication type:
- Article
Hierarchical Transfer Learning for Cycle Time Forecasting for Semiconductor Wafer Lot under Different Work in Process Levels.
- Published in:
- Mathematics (2227-7390), 2021, v. 9, n. 17, p. 2039, doi. 10.3390/math9172039
- By:
- Publication type:
- Article
An effective scheduling method to single-arm cluster tools for processing multiple wafer types.
- Published in:
- Journal of Industrial & Management Optimization, 2023, v. 19, n. 6, p. 1, doi. 10.3934/jimo.2022137
- By:
- Publication type:
- Article
A novel quality prediction method based on feature selection considering high dimensional product quality data.
- Published in:
- Journal of Industrial & Management Optimization, 2022, v. 18, n. 4, p. 2977, doi. 10.3934/jimo.2021099
- By:
- Publication type:
- Article
Memory type Bayesian adaptive max-EWMA control chart for weibull processes.
- Published in:
- Scientific Reports, 2024, v. 12, n. 1, p. 1, doi. 10.1038/s41598-024-59680-6
- By:
- Publication type:
- Article
Resilience evaluation of memristor based PUF against machine learning attacks.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-73839-1
- By:
- Publication type:
- Article
Resilience evaluation of memristor based PUF against machine learning attacks.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-73839-1
- By:
- Publication type:
- Article
Solution-processed NO<sub>2</sub> gas sensor based on poly(3-hexylthiophene)-doped PbS quantum dots operable at room temperature.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-71453-9
- By:
- Publication type:
- Article
Fabrication of nitrogen-hyperdoped silicon by high-pressure gas immersion excimer laser doping.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-69552-8
- By:
- Publication type:
- Article
An adaptive Bayesian approach for improved sensitivity in joint monitoring of mean and variance using Max-EWMA control chart.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-60625-2
- By:
- Publication type:
- Article
Memory type Bayesian adaptive max-EWMA control chart for weibull processes.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-59680-6
- By:
- Publication type:
- Article
Detecting defects that reduce breakdown voltage using machine learning and optical profilometry.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-57875-5
- By:
- Publication type:
- Article
Microstructural characterization and inductively coupled plasma-reactive ion etching resistance of Y<sub>2</sub>O<sub>3</sub>–Y<sub>4</sub>Al<sub>2</sub>O<sub>9</sub> composite under CF<sub>4</sub>/Ar/O<sub>2</sub> mixed gas conditions.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-57697-5
- By:
- Publication type:
- Article
DESENVOLVIMENTO DE LASERS DE ALTA INTENSIDADE ULTRACURTOS PARA A FAIXA DE ESPECTROS VISÍVEIS.
- Published in:
- Periódico Tchê Química, 2020, v. 17, n. 35, p. 739, doi. 10.52571/ptq.v17.n35.2020.63_abdulrahman_pgs_739_752.pdf
- By:
- Publication type:
- Article
Recent Developments in the Use of Heterogeneous Semiconductor Photocatalyst Based Materials for a Visible-Light-Induced Water-Splitting System—A Brief Review.
- Published in:
- Catalysts (2073-4344), 2021, v. 11, n. 2, p. 160, doi. 10.3390/catal11020160
- By:
- Publication type:
- Article
Relation of Heat Transfer with the Growth Rate of InSb based Bulk Crystals Grown by VDS and its Effect on the Crystal Quality.
- Published in:
- Journal of Nano- & Electronic Physics, 2020, v. 12, n. 2, p. 1, doi. 10.21272/jnep.12(2).02012
- By:
- Publication type:
- Article
INTEGRATING RELEASE AND DISPATCH POLICIES IN PRODUCTION MODELS.
- Published in:
- Networks & Heterogeneous Media, 2015, v. 10, n. 3, p. 511, doi. 10.3934/nhm.2015.10.511
- By:
- Publication type:
- Article
Photodetector without Electron Transport Layer Based on Hexane-1,6-Diammonium Pentaiodobismuth (HDA-BiI 5) Molecular Semiconductor.
- Published in:
- Coatings (2079-6412), 2021, v. 11, n. 9, p. 1099, doi. 10.3390/coatings11091099
- By:
- Publication type:
- Article
Theoretical Analysis of Si 2 H 6 Adsorption on Hydrogenated Silicon Surfaces for Fast Deposition Using Intermediate Pressure SiH 4 Capacitively Coupled Plasma.
- Published in:
- Coatings (2079-6412), 2021, v. 11, n. 9, p. 1041, doi. 10.3390/coatings11091041
- By:
- Publication type:
- Article
Surface Analysis of Chamber Coating Materials Exposed to CF 4 /O 2 Plasma.
- Published in:
- Coatings (2079-6412), 2021, v. 11, n. 1, p. 105, doi. 10.3390/coatings11010105
- By:
- Publication type:
- Article