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Impact of Back-Gate Radiation on Single-Event Effects of Ultrathin Body and Buried Oxide Fully Depleted Silicon-on-Insulator MOSFETs.
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- Journal of Electronic Materials, 2023, v. 52, n. 11, p. 7496, doi. 10.1007/s11664-023-10680-8
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- Article
Microstructures and Properties of the Copper-Coated SiC<sub>p</sub> Reinforced Al-Si Alloy Composites.
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- Advanced Engineering Materials, 2017, v. 19, n. 6, p. n/a, doi. 10.1002/adem.201600816
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- Article
Microstructure evolution and shear behavior of Pb–16Sn–7.5Sb–xAg/Cu joints.
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- Journal of Materials Science, 2024, v. 59, n. 28, p. 13133, doi. 10.1007/s10853-024-09938-1
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- Article
Hot deformation behavior and finite element simulation of hot isostatic pressed Mo-50Cu composite.
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- Journal of Materials Science, 2022, v. 57, n. 1, p. 717, doi. 10.1007/s10853-021-06601-x
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- Article
Annexin A2: The diversity of pathological effects in tumorigenesis and immune response.
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- International Journal of Cancer, 2022, v. 151, n. 4, p. 497, doi. 10.1002/ijc.34048
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- Article
Microstructure and properties of Al-Si/Al-SiC<sub>p</sub> bilayer composite for electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7811, doi. 10.1007/s10854-022-07932-4
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- Article
Precipitation behavior and properties of Al–50Si–0.5X (X = Sc, La, Nb) alloys.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7380, doi. 10.1007/s10854-022-07851-4
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- Article
Microstructure, properties, and corrosion resistance of as-cast Al-12Si-1.0Mn-0.6 Mg-xSc alloys.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 10, p. 13279, doi. 10.1007/s10854-021-05892-9
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- Article
Effects of Cu and Mg alloying on the microstructure and properties of Al–12Si alloy prepared by spray forming.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 7, p. 5416, doi. 10.1007/s10854-020-03103-5
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- Article
Effect of minor scandium addition on the microstructure and properties of Al–50Si alloys for electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 23, p. 20770, doi. 10.1007/s10854-019-02444-0
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- Article
Thermal cycling reliability of Al/50Sip composite for thermal management in electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4894, doi. 10.1007/s10854-015-2999-y
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- Article
Microstructure and properties of Al/Sip composites for thermal management applications.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 4234, doi. 10.1007/s10854-015-2973-8
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- Article
Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 185, doi. 10.1007/s10854-014-2381-5
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- Article
Microstructure and thermal expansion behavior of spray-formed Al-27Si alloy used for electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4889, doi. 10.1007/s10854-014-2249-8
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- Article
Reactions and mechanical properties between AuSn20 solders and metalized Al-Si alloys for electronic packaging application.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 742, doi. 10.1007/s10854-013-1639-7
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- Article
Effect of Particle Size on Microstructure and Cold Compaction of Gas-Atomized Hypereutectic Al-Si Alloy Powder.
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- Metallurgical & Materials Transactions. Part B, 2015, v. 46, n. 2, p. 824, doi. 10.1007/s11663-014-0253-2
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Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing process.
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- Rare Metals, 2011, v. 30, n. 6, p. 627, doi. 10.1007/s12598-011-0440-0
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Study on circuit modeling of stretchable serpentine interconnects.
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- International Journal of Circuit Theory & Applications, 2022, v. 50, n. 3, p. 988, doi. 10.1002/cta.3174
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- Article
Effects of Ionic Liquid Content on the Electrical Properties of PVDF Films by Fused Deposition Modeling.
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- Materials (1996-1944), 2024, v. 17, n. 1, p. 9, doi. 10.3390/ma17010009
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Topological Resistance-Free One-Way Transport in a Square-Hexagon Lattice Gyromagnetic Photonic Crystal.
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- Nanomaterials (2079-4991), 2022, v. 12, n. 17, p. 3009, doi. 10.3390/nano12173009
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- Article
Phase Behavior of Polyelectrolyte Complexes and Rheological Behavior of Alumina suspensions for Direct Ink Writing.
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- Journal of the American Ceramic Society, 2016, v. 99, n. 6, p. 1902, doi. 10.1111/jace.14155
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Postcasting Contraction: Improving the Density of Gelcast Nanoparticle Green Bodies with Heated Liquid Desiccants.
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- Journal of the American Ceramic Society, 2015, v. 98, n. 6, p. 1706, doi. 10.1111/jace.13593
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- Article
Thermoresponsive Gelcasting: Improved Drying of Gelcast Bodies.
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- Journal of the American Ceramic Society, 2011, v. 94, n. 6, p. 1679, doi. 10.1111/j.1551-2916.2011.04557.x
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Polymerization and Rheological Behavior of the Thermoresponsive Gelcasting System Based on N-isopropylacrylamide.
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- International Journal of Applied Ceramic Technology, 2016, v. 13, n. 5, p. 966, doi. 10.1111/ijac.12564
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- Article