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Influence of Cu and Cr contents on the solidification path and microstructure formation of hypoeutectic as-cast Al–Cu–Cr alloys.
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- Journal of Thermal Analysis & Calorimetry, 2023, v. 148, n. 18, p. 9403, doi. 10.1007/s10973-023-12346-3
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- Article
Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.
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- Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 8, p. 4945, doi. 10.1007/s10973-021-10755-w
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- Article
Correlation between unsteady-state solidification thermal parameters and microstructural growth of Zn–8 mass% Al and Zn–8 mass% Al–XBi tribological alloys.
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- Journal of Thermal Analysis & Calorimetry, 2020, v. 139, n. 3, p. 1741, doi. 10.1007/s10973-019-08600-2
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- Article
Thermal analysis during solidification of an Al–Cu eutectic alloy: interrelation of thermal parameters, microstructure and hardness.
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- Journal of Thermal Analysis & Calorimetry, 2019, v. 137, n. 3, p. 983, doi. 10.1007/s10973-018-07992-x
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- Article
Dendritic solidification microstructure affecting mechanical and corrosion properties of a Zn4Al alloy.
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- Journal of Materials Science, 2005, v. 40, n. 17, p. 4493, doi. 10.1007/s10853-005-0852-z
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- Article
CORRELAÇÃO ENTRE MICROESTRUTURA, RESISTÊNCIAS MECÂNICA E À CORROSÃO DA LIGA DE SOLDAGEM LIVRE DE CHUMBO Sn-0,7%Cu.
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- Tecnologia em Metalurgia, Materiais e Mineração, 2014, v. 11, n. 4, p. 277, doi. 10.4322/tmm.2014.045
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- Article
Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 2, p. 1994, doi. 10.1007/s10854-015-3983-2
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- Article
Experimental and numerical analyses of laser remelted Sn-0.7 wt%Cu solder surfaces.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 3100, doi. 10.1007/s10854-015-2802-0
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- Article
Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 478, doi. 10.1007/s10854-013-1612-5
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- Article
The influence of NbB inoculation on dendritic spacing and grain size of an aluminum 2017 alloy at different cooling rates.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 125, n. 11/12, p. 5681, doi. 10.1007/s00170-023-11104-x
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- Article
Laser remelting of AlSi10Mg(-Ni) alloy surfaces: influence of Ni content and cooling rate on the microstructure.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 11/12, p. 8117, doi. 10.1007/s00170-022-09263-4
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- Article
Effects of cobalt and solidification cooling rate on intermetallic phases and tensile properties of a -Cu, -Zn, -Fe containing Al-Si alloy.
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- International Journal of Advanced Manufacturing Technology, 2020, v. 107, n. 1/2, p. 717, doi. 10.1007/s00170-020-05077-4
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- Article
Measurement and interrelation of length scale of dendritic microstructures, tensile properties, and machinability of Al-9 wt% Si-(1 wt% Bi) alloys.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 105, n. 1-4, p. 1391, doi. 10.1007/s00170-019-04211-1
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- Article
Microstructure and Tensile Strength of an Al-Si-Fe-V Alloy: Vanadium and Solidification Thermal Parameters as Recycling Strategies.
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- Sustainability (2071-1050), 2022, v. 14, n. 21, p. 13859, doi. 10.3390/su142113859
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- Article
Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys.
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- Science & Technology of Welding & Joining, 2016, v. 21, n. 6, p. 429, doi. 10.1080/13621718.2015.1124176
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- Article
The columnar to equiaxed transition in the directional solidification of aluminum based multicomponent alloys.
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- Rem: Revista Escola de Minas, 2015, v. 68, n. 1, p. 85, doi. 10.1590/0370-44672015680237
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- Article
Microstructural and segregation effects affecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution.
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- Journal of Applied Electrochemistry, 2021, v. 51, n. 5, p. 769, doi. 10.1007/s10800-021-01533-5
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- Article
Effect of Aging on Dendritic Array, Ag<sub>3</sub>Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy.
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- Journal of Electronic Materials, 2022, v. 51, n. 8, p. 4640, doi. 10.1007/s11664-022-09713-5
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- Article
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 173, doi. 10.1007/s11664-019-07454-6
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- Article
Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions.
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- Journal of Electronic Materials, 2019, v. 48, n. 8, p. 4773, doi. 10.1007/s11664-019-07286-4
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- Article
Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys.
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- Journal of Electronic Materials, 2018, v. 47, n. 2, p. 1647, doi. 10.1007/s11664-017-5837-6
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- Article
Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys.
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- Journal of Electronic Materials, 2017, v. 46, n. 3, p. 1754, doi. 10.1007/s11664-016-5225-7
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- Article
Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu- xAg Solder Alloys.
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- Journal of Electronic Materials, 2014, v. 43, n. 5, p. 1347, doi. 10.1007/s11664-014-3087-4
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- Article
Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni.
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- Journal of Electronic Materials, 2013, v. 42, n. 1, p. 179, doi. 10.1007/s11664-012-2263-7
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- Article
Application of an Artificial Intelligence Technique to Improve Purification in the Zone Refining Process.
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- Journal of Electronic Materials, 2010, v. 39, n. 1, p. 49, doi. 10.1007/s11664-009-0947-4
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- Article
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys.
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- Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2405, doi. 10.1007/s11664-009-0888-y
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- Article
The Role of Microstructural Length Scale in Hydrogen Generation Features of an Al-Sn-Fe Alloy.
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- Metals (2075-4701), 2024, v. 14, n. 2, p. 187, doi. 10.3390/met14020187
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- Article
Fe-Containing Al-Based Alloys: Relationship between Microstructural Evolution and Hardness in an Al-Ni-Fe Alloy.
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- Metals (2075-4701), 2023, v. 13, n. 12, p. 1980, doi. 10.3390/met13121980
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- Article
The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy.
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- Metals (2075-4701), 2023, v. 13, n. 11, p. 1813, doi. 10.3390/met13111813
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- Article
Influence of Minor Additions of Be on the Eutectic Modification of an Al-33wt.%Cu Alloy Solidified under Transient Conditions.
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- Metals (2075-4701), 2023, v. 13, n. 1, p. 94, doi. 10.3390/met13010094
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- Article
Hypereutectic Zn–Al Alloys: Microstructural Development under Unsteady-State Solidification Conditions, Eutectic Coupled Zone and Hardness.
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- Metals (2075-4701), 2022, v. 12, n. 7, p. N.PAG, doi. 10.3390/met12071076
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- Article
Assessing Microstructure Tensile Properties Relationships in Al-7Si-Mg Alloys via Multiple Regression.
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- Metals (2075-4701), 2022, v. 12, n. 6, p. 1040, doi. 10.3390/met12061040
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- Article
Relationship between Microstructure Evolution and Tensile Properties of AlSi10Mg Alloys with Varying Mg Content and Solidification Cooling Rates.
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- Metals (2075-4701), 2021, v. 11, n. 7, p. 1019, doi. 10.3390/met11071019
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- Article
Evaluating Microstructure, Wear Resistance and Tensile Properties of Al-Bi(-Cu, -Zn) Alloys for Lightweight Sliding Bearings.
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- Metals (2075-4701), 2021, v. 11, n. 1, p. 153, doi. 10.3390/met11010153
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- Article
Tailoring of Microstructures and Tensile Properties in the Solidification of Al-11Si(-xCu) Brazing Alloys.
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- Metals (2075-4701), 2018, v. 8, n. 10, p. 784, doi. 10.3390/met8100784
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- Article
Nature inspired algorithms for the solution of inverse heat transfer problems applied to distinct unsteady heat flux orientations in cylindrical castings.
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- Journal of Intelligent Manufacturing, 2023, v. 34, n. 5, p. 2407, doi. 10.1007/s10845-022-01935-y
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- Article
Dry Sliding Wear Features of an Al-20Sn-5Zn Alloy Affected by Microstructural Length Scales.
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- Lubricants (2075-4442), 2022, v. 10, n. 12, p. 352, doi. 10.3390/lubricants10120352
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- Article
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels.
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- Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design & Applications (Sage Publications, Ltd.), 2019, v. 233, n. 9, p. 1733, doi. 10.1177/1464420718784314
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- Article
Length scale of the dendritic microstructure affecting tensile properties of Al-(Ag)-(Cu) alloys.
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- International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2016, v. 30, n. 3, p. 1, doi. 10.1142/S0217979215502616
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- Article
The influences of macrosegregation, intermetallic particles, and dendritic spacing on the electrochemical behavior of hypoeutectic Al-Cu alloys.
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- Microscopy Research & Technique, 2007, v. 70, n. 11, p. 928, doi. 10.1002/jemt.20496
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- Article
Dendritic Growth, Solidification Thermal Parameters, and Mg Content Affecting the Tensile Properties of Al-Mg-1.5 Wt Pct Fe Alloys.
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- Metallurgical & Materials Transactions. Part A, 2017, v. 48, n. 4, p. 1841, doi. 10.1007/s11661-017-3978-0
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- Article
Thermal Parameters and Microstructural Development in Directionally Solidified Zn-Rich Zn-Mg Alloys.
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- Metallurgical & Materials Transactions. Part A, 2016, v. 47, n. 6, p. 3052, doi. 10.1007/s11661-016-3494-7
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- Article
Electrochemical and Mechanical Behavior of Lead-Silver and Lead-Bismuth Casting Alloys for Lead-Acid Battery Components.
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- Metallurgical & Materials Transactions. Part A, 2015, v. 46, n. 9, p. 4255, doi. 10.1007/s11661-015-3023-0
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- Article
Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys.
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- Metallurgical & Materials Transactions. Part A, 2015, v. 46, n. 8, p. 3342, doi. 10.1007/s11661-015-2967-4
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- Article
Erratum to: Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys.
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- 2015
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- Erratum
Dendritic Arm Spacing Affecting Mechanical Properties and Wear Behavior of Al-Sn and Al-Si Alloys Directionally Solidified under Unsteady-State Conditions.
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- Metallurgical & Materials Transactions. Part A, 2010, v. 41, n. 4, p. 972, doi. 10.1007/s11661-009-0161-2
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- Article
Microstructural Development in Al-Ni Alloys Directionally Solidified under Unsteady-State Conditions.
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- Metallurgical & Materials Transactions. Part A, 2008, v. 39, n. 7, p. 1712, doi. 10.1007/s11661-008-9536-z
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- Article
Effect of Dendritic Arm Spacing on Mechanical Properties and Corrosion Resistance of Al 9 Wt Pct Si and Zn 27 Wt Pct Al Alloys.
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- Metallurgical & Materials Transactions. Part A, 2006, v. 37, n. 8, p. 2525, doi. 10.1007/BF02586225
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- Article
Effect of Bi content on microstructure and corrosion behaviour of Zn–8Al–(Bi) alloys.
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- Corrosion Engineering, Science & Technology, 2021, v. 56, n. 5, p. 461, doi. 10.1080/1478422X.2021.1916235
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- Article
Galvanic corrosion analysis of a Bi–Zn solder alloy coupled to Ni and Cu substrates.
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- Corrosion Engineering, Science & Technology, 2020, v. 55, n. 8, p. 729, doi. 10.1080/1478422X.2020.1788772
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- Article