Microwave Flexible Electronics Directly Transformed from Foundry‐Produced, Multilayered Monolithic Integrated Circuits.
- Published in:
- Advanced Electronic Materials, 2022, v. 8, n. 7, p. 1, doi. 10.1002/aelm.202101350
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- Publication type:
- Article
Works matching Integrated circuits
Results: 5000
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Low-Power Current Integrating Flat-Passband Infinite Impulse Response Filter for Sensor Read-Out Integrated Circuit in 65-nm CMOS Technology.
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- Electronics (2079-9292), 2023, v. 12, n. 5, p. 1191, doi. 10.3390/electronics12051191
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- Article
3
A Neutrosophic Perspective on Enhancing Quality Virtual Simulation Experimental Education of Integrated Circuits: A New Approach.
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- Neutrosophic Sets & Systems, 2025, v. 80, p. 700
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- Article
4
AN EQUIVALENT THERMAL CONDUCTIVITY MODEL OF THROUGH SILICON VIA ARRAYS FOR THERMAL ANALYSIS IN 3-D INTEGRATED CIRCUITS.
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- Thermal Science, 2024, v. 28, n. 5B, p. 4081, doi. 10.2298/TSCI230919129X
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- Article
5
THERMAL MODELLING AND ANALYSIS OF 3-D INTEGRATED CIRCUITS WITH IRREGULAR STRUCTURE.
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- Thermal Science, 2023, v. 27, n. 5B, p. 4193, doi. 10.2298/TSCI220805061R
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- Article
6
THERMAL MODEL FOR 3-D INTEGRATED CIRCUITS WITH INTEGRATED MLGNR-BASED THROUGH SILICON VIA.
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- Thermal Science, 2020, v. 24, n. 3B, p. 2067, doi. 10.2298/TSCI180507321X
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7
THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.
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- Thermal Science, 2019, v. 23, n. 4, p. 2157, doi. 10.2298/TSCI1904157W
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8
Discussion on Improving Safety of Station Tracks Equipped with Integrated Track Circuits of High-speed Railways.
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- Railway Signalling & Communication Engineering, 2024, v. 21, n. 6, p. 13, doi. 10.3969/j.issn.1673-4440.2024.06.003
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- Article
9
站内ZPW-2000A一体化轨道电路低道床 适应性研究.
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- Railway Signalling & Communication Engineering, 2022, v. 19, n. 11, p. 1, doi. 10.3969/j.issn.1673-4440.2022.11.001
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- Article
10
Photonic Integrated Circuits for Passive Optical Networks: Outlook and Case Study of Integrated Quasi-Coherent Receiver.
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- Photonics, 2023, v. 10, n. 2, p. 182, doi. 10.3390/photonics10020182
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- Article
11
Correction Method for Power Analysis of Digital Integrated Circuits Based on Standard Cells.
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- Journal of Circuits, Systems & Computers, 2025, v. 34, n. 7, p. 1, doi. 10.1142/S0218126625501324
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- Article
12
Research on Analog Integrated Circuit Test Parameter Set Reduction Based on XGBoost.
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- Journal of Electronic Testing, 2022, v. 38, n. 3, p. 279, doi. 10.1007/s10836-022-06009-8
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- Article
13
Test Planning for Core-based Integrated Circuits under Power Constraints.
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- Journal of Electronic Testing, 2017, v. 33, n. 1, p. 7, doi. 10.1007/s10836-016-5638-5
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- Article
14
Simulated annealing‐based high‐level synthesis methodology for reliable and energy‐aware application specific integrated circuit designs with multiple supply voltages.
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- International Journal of Circuit Theory & Applications, 2023, v. 51, n. 10, p. 4897, doi. 10.1002/cta.3666
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- Article
15
Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits.
- Published in:
- Applied Sciences (2076-3417), 2020, v. 10, n. 3, p. 748, doi. 10.3390/app10030748
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- Article
16
INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.
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- Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika, 2024, v. 32, n. 1s, p. 71, doi. 10.53656/str2024-1s-5-int
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- Article
17
Integrated circuit design of a discrete memristive chaotic system optimized by the fixed-point specific processor with acceleration instructions.
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- Nonlinear Dynamics, 2024, v. 112, n. 12, p. 10451, doi. 10.1007/s11071-024-09624-6
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- Publication type:
- Article
18
Radiation-Hardened Design and Experimental Validation Using a Mixed-Stage Model for Reliability Assessment of Integrated Circuits in Radiation Environments.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 7, p. 1296, doi. 10.3390/electronics14071296
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- Publication type:
- Article
19
A Gain-Enhanced Low Hardware Complexity Charge-Domain Read-Out Integrated Circuit Using a Sampled Charge Redistribution Technique.
- Published in:
- Electronics (2079-9292), 2022, v. 11, n. 23, p. 3846, doi. 10.3390/electronics11233846
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- Publication type:
- Article
20
Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course.
- Published in:
- Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091437
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- Article
21
Integrated gate driver circuit technology with IGZO TFT for sensing operation.
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- Journal of the Society for Information Display, 2019, v. 27, n. 5, p. 313, doi. 10.1002/jsid.785
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- Article
22
Compact photonic crystal integrated circuit for all‐optical logic operation.
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- IET Optoelectronics (Wiley-Blackwell), 2016, v. 10, n. 4, p. 142, doi. 10.1049/iet-opt.2015.0072
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- Publication type:
- Article
23
Multislice imaging of integrated circuits by precession X-ray ptychography.
- Published in:
- Acta Crystallographica. Section A, Foundations & Advances, 2018, v. 74, n. 1, p. 66, doi. 10.1107/S205327331701525X
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- Article
24
60 Years from the Invention of the Integrated Circuits.
- Published in:
- Electrotehnica, Electronica, Automatica, 2018, v. 66, n. 3, p. 72
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- Article
25
Development of Integrated Circuits Using Artificial Conducting Liquid (Synthetic Plasma) - A Novel Research.
- Published in:
- American Journal of Biomedical Sciences, 2018, v. 10, n. 2, p. 65, doi. 10.5099/aj180200065
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- Article
26
Multilayer Reconfigurable 3D Photonics Integrated Circuits Based on Deposition Method.
- Published in:
- Laser & Photonics Reviews, 2025, v. 19, n. 2, p. 1, doi. 10.1002/lpor.202400827
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- Article
27
Widely Tunable (2.47–2.64 µm) Hybrid Laser Based on GaSb/GaInAsSb Quantum‐Wells and a Low‐Loss Si<sub>3</sub>N<sub>4</sub> Photonic Integrated Circuit.
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- Laser & Photonics Reviews, 2023, v. 17, n. 7, p. 1, doi. 10.1002/lpor.202201028
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- Article
28
AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.
- Published in:
- Thermal Science, 2023, v. 27, n. 3B, p. 2391, doi. 10.2298/TSCI220621140X
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- Article
29
THERMAL OPTIMIZATION OF A 3-D INTEGRATED CIRCUIT.
- Published in:
- Thermal Science, 2020, v. 24, n. 4, p. 2615, doi. 10.2298/TSCI2004615W
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30
THERMAL MANAGEMENT OF THE HOTSPOTS IN 3-D INTEGRATED CIRCUITS.
- Published in:
- Thermal Science, 2018, v. 22, n. 4, p. 1685, doi. 10.2298/TSCI1804685W
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- Article
31
INTEGRATED MICROCHANNEL COOLING IN A THREE DIMENSIONAL INTEGRATED CIRCUIT.
- Published in:
- Thermal Science, 2016, v. 20, n. 3, p. 899, doi. 10.2298/TSCI1603899W
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- Article
32
Predicting gate oxide reliability from statistical process control nodes in integrated circuit manufacturing — a case study.
- Published in:
- Quality & Reliability Engineering International, 1997, v. 13, n. 5, p. 269, doi. 10.1002/(SICI)1099-1638(199709/10)13:5<269::AID-QRE101>3.0.CO;2-H
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- Article
33
A COMPARISON OF DETERMINISTIC AND STATISTICAL SAMPLING TECHNIQUES FOR QUALITY ANALYSIS OF INTEGRATED CIRCUITS.
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- Quality & Reliability Engineering International, 1993, v. 9, n. 6, p. 489, doi. 10.1002/qre.4680090606
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- Article
34
A COMPUTER-CONTROLLED ENVIRONMENTAL TEST SYSTEM FOR HIGH PIN-COUNT INTEGRATED CIRCUIT PACKAGES.
- Published in:
- Quality & Reliability Engineering International, 1993, v. 9, n. 2, p. 95, doi. 10.1002/qre.4680090206
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- Article
35
THE TEST NEEDS OF APPLICATION-SPECIFIC INTEGRATED CIRCUITS.
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- Quality & Reliability Engineering International, 1986, v. 2, n. 3, p. 159, doi. 10.1002/qre.4680020305
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- Publication type:
- Article
36
Large-Scale Reconfigurable Integrated Circuits for Wideband Analog Photonic Computing.
- Published in:
- Photonics, 2023, v. 10, n. 3, p. 300, doi. 10.3390/photonics10030300
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- Publication type:
- Article
37
Key Technologies for THz Wireless Link by Silicon CMOS Integrated Circuits.
- Published in:
- Photonics, 2018, v. 5, n. 4, p. 50, doi. 10.3390/photonics5040050
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- Publication type:
- Article
38
Active Terahertz Modulator and Slow Light Metamaterial Devices with Hybrid Graphene–Superconductor Photonic Integrated Circuits.
- Published in:
- Nanomaterials (2079-4991), 2021, v. 11, n. 11, p. 2999, doi. 10.3390/nano11112999
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- Publication type:
- Article
39
Fabrication of Low Cost and Low Temperature Poly-Silicon Nanowire Sensor Arrays for Monolithic Three-Dimensional Integrated Circuits Applications.
- Published in:
- Nanomaterials (2079-4991), 2020, v. 10, n. 12, p. 2488, doi. 10.3390/nano10122488
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- Publication type:
- Article
40
A Review of Carbon-Based Conductive Inks and Their Printing Technologies for Integrated Circuits.
- Published in:
- Coatings (2079-6412), 2023, v. 13, n. 10, p. 1769, doi. 10.3390/coatings13101769
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- Publication type:
- Article
41
A 4H-SiC Bipolar Technology for High-Temperature Integrated Circuits.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 4, p. 155, doi. 10.4071/imaps.390
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- Publication type:
- Article
42
Integrated Circuit Design for Radiation-Hardened Charge-Sensitive Amplifier Survived up to 2 Mrad.
- Published in:
- Sensors (14248220), 2020, v. 20, n. 10, p. 2765, doi. 10.3390/s20102765
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- Publication type:
- Article
43
Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature.
- Published in:
- Sensors (14248220), 2018, v. 18, n. 7, p. 2338, doi. 10.3390/s18072338
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- Publication type:
- Article
44
Two-Dimensional Materials, the Ultimate Solution for Future Electronics and Very-Large-Scale Integrated Circuits.
- Published in:
- Nano-Micro Letters, 2025, v. 17, n. 1, p. 1, doi. 10.1007/s40820-025-01769-2
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- Publication type:
- Article
45
Enhancing Integrated Circuit Quality Control: A CNN-Based Approach for Defect Detection in Scanning Acoustic Tomography Images.
- Published in:
- Processes, 2025, v. 13, n. 3, p. 683, doi. 10.3390/pr13030683
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- Publication type:
- Article
46
Dependability evaluation of integrated circuits at design time against laser fault injection.
- Published in:
- Security & Communication Networks, 2012, v. 5, n. 5, p. 450, doi. 10.1002/sec.327
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- Publication type:
- Article
47
An In-Depth Study of Ring Oscillator Reliability under Accelerated Degradation and Annealing to Unveil Integrated Circuit Usage.
- Published in:
- Micromachines, 2024, v. 15, n. 6, p. 769, doi. 10.3390/mi15060769
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- Publication type:
- Article
48
A Fast Simulation Method for Evaluating the Single-Event Effect in Aerospace Integrated Circuits.
- Published in:
- Micromachines, 2023, v. 14, n. 10, p. 1887, doi. 10.3390/mi14101887
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- Article
49
Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects.
- Published in:
- Micromachines, 2022, v. 13, n. 6, p. 883, doi. 10.3390/mi13060883
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- Publication type:
- Article
50
320×256 Readout Integrated Circuit for Infrared Focal Plane Arrays with Low-temperature MOSFET Model.
- Published in:
- IETE Journal of Research, 2011, v. 57, n. 6, p. 550, doi. 10.4103/0377-2063.92271
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- Publication type:
- Article