Works matching DE "PLASTIC embedment of electronic equipment"

Results: 160

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.

Published in:

Advanced Functional Materials, 2017, v. 27, n. 4, p. n/a, doi. 10.1002/adfm.201604545

By:

Xu, RENxiao;
Lee, Jung Woo;
Pan, Taisong;
Ma, Siyi;
Wang, Jiayi;
Han, June Hyun;
Ma, Yinji;
Rogers, John A.;
Huang, Yonggang

Publication type:

Article

A graphical peak analysis method for characterizing impurities in SiC, GaN and diamond from temperature-dependent majority-carrier concentration.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 720, doi. 10.1007/s10854-007-9390-6

By:

Matsuura, Hideharu

Publication type:

Article

Pharmacokinetic modeling of paclitaxel encapsulation in Cremophor EL micelles.

Published in:

Cancer Chemotherapy & Pharmacology, 2001, v. 47, n. 4, p. 309, doi. 10.1007/s002800000215

By:

van Zuylen, Lia;
Karlsson, Mats O.;
Verweij, Jaap;
Brouwer, Eric;
de Bruijn, Peter;
Nooter, Kees;
Stoter, Gerrit;
Sparreboom, Alex

Publication type:

Article

Effectiveness of methods of eliminating encapsulation during extrusion of rubber mixtures.

Published in:

Chemical & Petroleum Engineering, 2009, v. 45, n. 1/2, p. 7, doi. 10.1007/s10556-009-9134-y

By:

Goncharov, G.;
Gudanov, I.;
Lavrent’ev, Yu.;
Lomov, A.

Publication type:

Article

Numerical modeling of the performance of thermoelectric module with polydimethylsiloxane encapsulation.

Published in:

International Journal of Energy Research, 2018, v. 42, n. 3, p. 1287, doi. 10.1002/er.3928

By:

Shi, Yaoguang;
Wang, Yancheng;
Mei, Deqing;
Chen, Zichen

Publication type:

Article

The detection and quantification of the defects in adhesive bonded joints of the piezoelectric sensors by infrared thermographic nondestructive testing.

Published in:

Nondestructive Testing & Evaluation, 2017, v. 32, n. 2, p. 185, doi. 10.1080/10589759.2016.1159305

By:

Vinod, P. N.;
Joseph, Sherin;
John, Reji

Publication type:

Article

Thermomechanical Impact of Polyurethane Potting on Gun Launched Electronics.

Published in:

Journal of Engineering (2314-4912), 2013, p. 1, doi. 10.1155/2013/148362

By:

Haynes, A. S.;
Cordes, J. A.;
Krug, J.

Publication type:

Article

Temporal dynamics of the encapsulation response towards a synthetic immune challenge in Acheta domesticus.

Published in:

Physiological Entomology, 2007, v. 32, n. 3, p. 240, doi. 10.1111/j.1365-3032.2007.00572.x

By:

RYDER, JONATHAN J.

Publication type:

Article

Fatigue lifetime study of piezoceramic patch transducers.

Published in:

Acta Mechanica, 2013, v. 224, n. 11, p. 2529, doi. 10.1007/s00707-013-0953-8

By:

Gall, Monika;
Thielicke, Bärbel

Publication type:

Article

The design of the VERS encapsulated object experience with an archival information package.

Published in:

International Journal on Digital Libraries, 2006, v. 6, n. 2, p. 184, doi. 10.1007/s00799-005-0135-y

By:

Waugh, Andrew

Publication type:

Article

Extending the Lifetime of Perovskite Solar Cells using a Perfluorinated Dopant.

Published in:

ChemSusChem, 2016, v. 9, n. 18, p. 2708, doi. 10.1002/cssc.201601030

By:

Salado, Manuel;
Ramos, F. Javier;
Manzanares, Valentin M.;
Gao, Peng;
Nazeeruddin, Mohammad Khaja;
Dyson, Paul J.;
Ahmad, Shahzada

Publication type:

Article

Encapsulation of Perovskite Solar Cells for High Humidity Conditions.

Published in:

ChemSusChem, 2016, v. 9, n. 18, p. 2518, doi. 10.1002/cssc.201601090

By:

Dong, Qi;
Liu, Fangzhou;
Wong, Man Kwong;
Tam, Ho Won;
Djurišić, Aleksandra B.;
Ng, Annie;
Surya, Charles;
Chan, Wai Kin;
Ng, Alan Man Ching

Publication type:

Article

Modeling embroidered contacts for electronics in textiles.

Published in:

Journal of the Textile Institute, 2012, v. 103, n. 6, p. 644, doi. 10.1080/00405000.2011.597568

By:

Linz, Torsten;
Simon, ErikP.;
Walter, Hans

Publication type:

Article

Thermal behavior of epoxy blends for light emitting diode encapsulation.

Published in:

e-Polymers, 2012, n. 91, p. 1

By:

Tan, Seah-Guan;
Chow, Wen-Shyang

Publication type:

Article

Thermoplastic encapsulations of a sensor platform by high‐temperature injection molding up to 360°C.

Published in:

Polymer Engineering & Science, 2019, v. 59, n. 7, p. 1315, doi. 10.1002/pen.25114

By:

Werner, Valerie M. K.;
Krumpholz, Roman;
Rehekampff, Christoph;
Scherzer, Tim;
Eblenkamp, Markus

Publication type:

Article

Foldable and washable textile-based OLEDs with a multi-functional near-room-temperature encapsulation layer for smart e-textiles.

Published in:

NPJ Flexible Electronics, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41528-021-00112-0

By:

Jeong, So Yeong;
Shim, Hye Rin;
Na, Yunha;
Kang, Ki Suk;
Jeon, Yongmin;
Choi, Seungyeop;
Jeong, Eun Gyo;
Park, Yong Cheon;
Cho, Ha-Eun;
Lee, Junwoo;
Kwon, Jeong Hyun;
Im, Sung Gap;
Choi, Kyung Cheol

Publication type:

Article

OPTIMIZATION OF THE POSITION OF SINGLE-LEAD WIRELESS SENSOR WITH LOW ELECTRODES SEPARATION DISTANCE FOR ECG-DERIVED RESPIRATION.

Published in:

Advances in Electrical & Electronic Engineering, 2018, v. 16, n. 4, p. 528, doi. 10.15598/aeee.v16i4.2773

By:

SVOBODOVA, Helena;
VAVRINSKY, Erik;
TURONOVA, Daniela;
DONOVAL, Martin;
DARICEK, Martin;
TELEK, Peter;
KOPANI, Martin

Publication type:

Article

Combining Encryption and Proof of Knowledge in the Random Oracle Model.

Published in:

Computer Journal, 2004, v. 47, n. 1, p. 58, doi. 10.1093/comjnl/47.1.58

By:

Masayuki Abe

Publication type:

Article

Adhesion of underfill and components in flip chip encapsulation.

Published in:

Journal of Adhesion Science & Technology, 2002, v. 16, n. 2, p. 213, doi. 10.1163/156856102317293713

By:

Fan, Lianhua;
Moon, Kyoung-Sik;
Wong, C. P.

Publication type:

Article

Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect.

Published in:

Telkomnika, 2011, v. 9, n. 1, p. 27, doi. 10.12928/telkomnika.v9i1.642

By:

Ramdan, Dadan;
Abdullah, Mohd Zulkifly;
Khor Chu Yee

Publication type:

Article

Towards Production and Energy Coupling System Modeling and Simulation for Energy Optimization in the Process Industry.

Published in:

Journal of Donghua University (English Edition), 2011, v. 28, n. 2, p. 128

By:

Dai Yi-Ru;
Wang Jian

Publication type:

Article

Advanced encapsulation for photovoltaics: where are the opportunities?

Published in:

Photovoltaics International, 2011, n. 11, p. 160

By:

Markowitz, Paul

Publication type:

Article

Encapsulation polymers -- a key issue in module reliability.

Published in:

Photovoltaics International, 2011, n. 11, p. 118

By:

Schulze, Stefan-H.;
Pander, Matthias;
Dietrich, Sascha;
Ebert, Matthias

Publication type:

Article

Luminescent encapsulation layers for multicrystalline silicon PV modules.

Published in:

Photovoltaics International, 2011, n. 11, p. 104

By:

Richards, Bryce S.;
Kiampaftis, Efthymios

Publication type:

Article

Trends and developments in the lamination process of PV modules (part 1).

Published in:

Photovoltaics International, 2009, n. 5, p. 160

By:

Osborne, Mark

Publication type:

Article

Uhderstanding moisture ingress and packaging requirements for photovoltaic modules.

Published in:

Photovoltaics International, 2009, n. 5, p. 121

By:

Dameron, Arrelaine A.;
Reese, Matthew O.;
Moricone, Thomas J.;
Kempe, Michael D.

Publication type:

Article

Experimental and numerical investigation of phase change materials with finned encapsulation for energy-efficient buildings.

Published in:

Journal of Building Performance Simulation, 2010, v. 3, n. 4, p. 245, doi. 10.1080/19401491003624224

By:

Siva, Kalaiselvam;
Lawrence, Marcel Xavier;
Kumaresh, G. R.;
Rajagopalan, Parameshwaran;
Santhanam, Harikrishnan

Publication type:

Article

Rational design of vapor‐deposited self‐crosslinking polymer for transparent flexible oxygen barrier coatings.

Published in:

Journal of Applied Polymer Science, 2021, v. 138, n. 21, p. 1, doi. 10.1002/app.50505

By:

Sheng, Weijie;
Chen, Ying;
Mao, Haizhuo;
Li, Yanshuo;
Xiao, Xinle;
Wang, Chunting;
Ye, Yumin;
Liu, Wenna

Publication type:

Article

Metal Ceramic Segmented Ring Transducer under Deep Submergence Conditions.

Published in:

Defence Science Journal, 2017, v. 67, n. 6, p. 612, doi. 10.14429/dsj.67.11201

By:

Chandrabose, M. R. Subash;
Pereira, Shan Victor;
Jayakumar, B.;
Ebenezer, D. D.

Publication type:

Article

High‐temperature thin‐film barriers for foldable AMOLED displays.

Published in:

Journal of the Society for Information Display, 2018, v. 26, n. 4, p. 214, doi. 10.1002/jsid.647

By:

Akkerman, Hylke B.;
Pendyala, Raghu K.;
Panditha, Pradeep;
Salem, Ahmed;
Shen, Jie;
van de Weijer, Peter;
Bouten, Piet C. P.;
de Winter, Suzanne H. P. M.;
van Diesen‐Tempelaars, Karin;
de Haas, Gerard;
Steudel, Soeren;
Huang, Ching‐Yu;
Lai, Ming‐Hsiang;
Huang, Yen‐Yu;
Yeh, Ming‐Hua;
Kronemeijer, Auke Jisk;
Poodt, Paul;
Gelinck, Gerwin H.

Publication type:

Article

Optimization of Solar Module Encapsulant Lamination by Optical Constant Determination of Ethylene-Vinyl Acetate.

Published in:

International Journal of Photoenergy, 2015, v. 2015, p. 1, doi. 10.1155/2015/276404

By:

Chen, Bing-Mau;
Peng, Cheng-Yu;
Cho, Ju-Lu;
Porter, Glen Andrew

Publication type:

Article

PROTOCOL LAYERING AND INTERNET POLICY.

Published in:

University of Pennsylvania Law Review, 2013, v. 161, n. 6, p. 1707

By:

YOO, CHRISTOPHER S.

Publication type:

Article

Mussel‐Inspired Highly Sensitive, Stretchable, and Self‐Healable Yarns Enabled by Dual Conductive Pathways and Encapsulation for Wearable Electronics.

Published in:

Advanced Functional Materials, 2025, v. 35, n. 7, p. 1, doi. 10.1002/adfm.202412461

By:

Zhao, Songfang;
Zhang, Yongjing;
Li, Guolin;
Zhou, Yunlong;
Xia, Meili;
Hoang, Anh Tuan;
Gao, Yongju;
Cao, Duxia;
Li, Guoqiang;
Li, Yang;
Lai, Yuekun;
Ahn, Jong‐Hyun

Publication type:

Article

An examination of household solid waste generation in a Mekong Delta City, Vietnam.

Published in:

Journal of Solid Waste Technology & Management, 2010, v. 36, n. 1, p. 526

By:

Thanh, Nguyen P.;
Matsui, Yasuhiro;
Fujiwara, Takeshi

Publication type:

Article

Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding.

Published in:

Journal of Polymer Engineering, 2023, v. 43, n. 2, p. 179, doi. 10.1515/polyeng-2022-0150

By:

Ott, Constantin;
Drummer, Dietmar

Publication type:

Article

REVIEW ON SOFTWARE DEPENDABILITY AND EXCEPTION HANDLING FOR THE OBJECT-ORIENTED DESIGN PHASE.

Published in:

i-Manager's Journal on Software Engineering, 2022, v. 17, n. 2, p. 31, doi. 10.26634/jse.17.2.19182

By:

AHMAD ABIDI, SYED SAIF

Publication type:

Article

Thermal and Electromagnetic Combined Optimization Design of Dry Type Air Core Reactor.

Published in:

Energies (19961073), 2017, v. 10, n. 12, p. 1989, doi. 10.3390/en10121989

By:

Fating Yuan;
Zhao Yuan;
Lixue Chen;
Yong Wang;
Junxiang Liu;
Junjia He;
Yuan Pan

Publication type:

Article

DC electrical stimulation enhances proliferation and differentiation on N2a and MC3T3 cell lines.

Published in:

Journal of Biological Engineering, 2022, v. 16, n. 1, p. 1, doi. 10.1186/s13036-022-00306-8

By:

Martín, Daniel;
Bocio-Nuñez, J.;
Scagliusi, Santiago F.;
Pérez, Pablo;
Huertas, Gloria;
Yúfera, Alberto;
Giner, Mercè;
Daza, Paula

Publication type:

Article

Biodegradable baked foam made with chayotextle starch mixed with plantain flour and wood fiber.

Published in:

Journal of Applied Polymer Science, 2017, v. 134, n. 48, p. n/a, doi. 10.1002/app.45565

By:

Vargas-Torres, Apolonio;
Palma-Rodriguez, Heidi Maria;
Berrios, Jose De J.;
Glenn, Gregory;
Salgado-Delgado, Rene;
Olarte-Paredes, Alfredo;
Prieto-Mendez, Judith;
Hernandez-Uribe, Juan Pablo

Publication type:

Article

Synthesis and Enhanced Field-Emission of Thin-Walled, Open-Ended, and Well-Aligned N-Doped Carbon Nanotubes.

Published in:

Nanoscale Research Letters, 2010, v. 5, n. 6, p. 941, doi. 10.1007/s11671-010-9586-1

By:

Tongxiang Cui;
Ruitao Lv;
Feiyu Kang;
Qiang Hu;
Jialin Gu;
Kunlin Wang;
Dehai Wu

Publication type:

Article

Sir Georg Solti and the Record Industry.

Published in:

ARSC Journal, 2010, v. 41, n. 2, p. 200

By:

Patmore, David N. C.

Publication type:

Article

Business Not As Usual.

Published in:: 2022
Publication type:: Interview

Cancelable Fingerprint Features Using Chaff Points Encapsulation.

Published in:

Informatica (03505596), 2018, v. 42, n. 3, p. 369, doi. 10.31449/inf.v42i3.1855

By:

Al-Tarawneh, Mokhled S.

Publication type:

Article

Izvlečki.

Published in:: 2011
Publication type:: Abstract

A knowledge encapsulation approach to ontology modularization.

Published in:

Knowledge & Information Systems, 2011, v. 26, n. 2, p. 249, doi. 10.1007/s10115-009-0279-y

By:

Ensan, Faezeh;
Weichang Du

Publication type:

Article

Failure detectors encapsulate fairness.

Published in:

Distributed Computing, 2012, v. 25, n. 4, p. 313, doi. 10.1007/s00446-012-0164-x

By:

Pike, Scott;
Sastry, Srikanth;
Welch, Jennifer

Publication type:

Article

65.1: Invited Paper: World 1<sup>st</sup> Large Size 18-inch Flexible OLED Display and the Key Technologies.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 962, doi. 10.1002/sdtp.10275

By:

Yoon, Jonggeun;
Kwon, Hoiyong;
Lee, Mireum;
Yu, Youn‐yeol;
Cheong, Nuri;
Min, Sungjoon;
Choi, Jaekyung;
Im, Hunbae;
Lee, Kwonhyung;
Jo, Jungsik;
Kim, Hojin;
Choi, Hyunmin;
Lee, Yongbaek;
Yoo, Choongkeun;
Kuk, Seunghee;
Cho, Mingu;
Kwon, Seyeoul;
Park, Weonseo;
Yoon, Sooyoung;
Kang, Inbyeong

Publication type:

Article

P-87: Applying Low Temperature Thin Film Encapsulation to 6-inch IGZO Flexible AMOLED.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 1480, doi. 10.1002/sdtp.10034

By:

Lai, Ming‐Hsiang;
Liu, Sheng‐Fa;
Huang, Ching‐Yu;
Chiou, Ji‐Yi;
Chiu, Yi‐Wen;
Liu, Yen‐Wei;
Niu, Yi‐Fan

Publication type:

Article

P-94: Ultra-thin Graphene Oxide/Polymer Multi-Layer Encapsulation for Flexible OLED Displays.

Published in:

SID Symposium Digest of Technical Papers, 2014, v. 45, n. 1, p. 1340, doi. 10.1002/j.2168-0159.2014.tb00353.x

By:

Lee, Wha‐Yong;
Yang, Seung‐Yeol;
Jeon, Jin‐Nam;
Cho, Young Jae;
Kwon, Yongwoo;
Kim, Yong‐Seog

Publication type:

Article

21.3: A 65-inch Amorphous Oxide Thin Film Transistors Active-Matrix Organic Light-Emitting Diode Television Using Side by Side and Fine Metal Mask Technology.

Published in:

2013

By:

Chen, Chia-Yu;
Lin, Li-Fong;
Lee, Jen-Yu;
Wu, Wen-Hao;
Wang, San-Chi;
Chiang, Yuan Ming;
Chen, Yu-Hung;
Chen, Chih-Cheng;
Chen, Chih-Lei;
Shih, Tsung-Hsiang;
Liu, Chun-Hsin;
Ting, Hung-Che;
Lu, Hsueh-Hsing;
Tsai, Lun;
Lin, Hong-Shen;
Chang, Lee-Hsun;
Lin, Yu-Hsin

Publication type:

Other