Works matching IS 1537-0755 AND VI 25 AND IP 4 AND DT 2023
2
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 46
- Article
3
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 57, doi. 10.31399/asm.edfa.2023-4.p057
- Endrinal, Lesly;
- Szu Huat Goh
- Article
8
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 52
- Article
11
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 53
- Article
13
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 42
- Article
15
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 36
- Article
16
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 36
- Article
17
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 28, doi. 10.31399/asm.edfa.2023-4.p028
- Vickers, James;
- Freeman, Blake;
- Leslie, Neel
- Article
18
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 20, doi. 10.31399/asm.edfa.2023-4.p020
- Sharma, D.;
- Tedaldi, M.;
- Wouters, L.;
- Hantschel, T.;
- Hole, Patrick;
- Humphris, A. D. L.;
- Celano, U.
- Article
19
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 12, doi. 10.31399/asm.edfa.2023-4.p012
- DiBattista, Michael;
- Silverman, Scott;
- Mulholland, Matthew M.
- Article
20
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 4, doi. 10.31399/asm.edfa.2023-4.p004
- Fowler, Joseph W.;
- Levine, Zachary H.;
- Szypryt, Paul;
- Swetz, Daniel S.
- Article
21
- Electronic Device Failure Analysis, 2023, v. 25, n. 4, p. 2
- Article