Works matching DE "MICROELECTRONIC packaging"
Results: 160
Chipmakers to compete with assembly houses for SiP.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 51
- Publication type:
- Article
System-on-a-chip challenged by stacked system-in-a-package technology*.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 48
- By:
- Publication type:
- Article
Advanced IC packaging: Markets and trends.
- Published in:
- Solid State Technology, 2001, v. 44, n. 4, p. 44
- By:
- Publication type:
- Article
Wafer-level packaging gains momentum.
- Published in:
- Solid State Technology, 1999, v. 42, n. 4, p. 45
- By:
- Publication type:
- Article
Assembly & packaging challenges.
- Published in:
- Solid State Technology, 1998, v. 41, n. 3, p. 90
- By:
- Publication type:
- Article
The coupling effects of thermal cycling and high current density on Sn58Bi solder joints.
- Published in:
- Journal of Materials Science, 2013, v. 48, n. 6, p. 2318, doi. 10.1007/s10853-012-7011-0
- By:
- Publication type:
- Article
Fracture behavior of Cu-cored solder joints.
- Published in:
- Journal of Materials Science, 2011, v. 46, n. 21, p. 6897, doi. 10.1007/s10853-011-5654-x
- By:
- Publication type:
- Article
Effect of anorthite and diopside on dielectric properties of Al<sub>2</sub>O<sub>3</sub>/glass composite based on high strength of LTCC substrate.
- Published in:
- Journal of Materials Science, 2008, v. 43, n. 12, p. 4009, doi. 10.1007/s10853-007-2231-4
- By:
- Publication type:
- Article
A comparison of impression and compression creep behavior of polycrystalline Sn.
- Published in:
- Journal of Materials Science, 2007, v. 42, n. 13, p. 5182, doi. 10.1007/s10853-006-0542-5
- By:
- Publication type:
- Article
Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging.
- Published in:
- Journal of Materials Science, 2007, v. 42, n. 2, p. 615, doi. 10.1007/s10853-006-1148-7
- By:
- Publication type:
- Article
Materials Technology for Environmentally Green Micro-electronic Packaging.
- Published in:
- Intel Technology Journal, 2008, v. 12, n. 1, p. 1, doi. 10.1535/itj.1201.01
- By:
- Publication type:
- Article
Future Package Technologies for Wireless Communication Systems.
- Published in:
- Intel Technology Journal, 2005, v. 9, n. 4, p. 353, doi. 10.1535/itj.0904.08
- By:
- Publication type:
- Article
Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies.
- Published in:
- Intel Technology Journal, 2005, v. 9, n. 4, p. 337, doi. 10.1535/itj.0904.07
- By:
- Publication type:
- Article
Pentium® 4 Processor High-Volume Land-Grid-Array Technology: Challenges and Future Trends.
- Published in:
- Intel Technology Journal, 2005, v. 9, n. 4, p. 325, doi. 10.1535/itj.0904.06
- By:
- Publication type:
- Article
Materials Technologies for Thermomechanical Management of Organic Packages.
- Published in:
- Intel Technology Journal, 2005, v. 9, n. 4, p. 309, doi. 10.1535/itj.0904.05
- By:
- Publication type:
- Article
Finding Solutions to the Challenges in Package Interconnect Reliability.
- Published in:
- Intel Technology Journal, 2005, v. 9, n. 4, p. 297, doi. 10.1535/itj.0904.04
- By:
- Publication type:
- Article
Advanced Package Technologies for High-Performance Systems.
- Published in:
- Intel Technology Journal, 2005, v. 9, n. 4, p. 259, doi. 10.1535/itj.0904.01
- By:
- Publication type:
- Article
Emerging Directions For Packaging Technologies.
- Published in:
- Intel Technology Journal, 2002, v. 6, n. 2, p. 62
- By:
- Publication type:
- Article
Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method.
- Published in:
- Mathematics (2227-7390), 2022, v. 10, n. 11, p. 1913, doi. 10.3390/math10111913
- By:
- Publication type:
- Article
Effect of carbon nanotubes and zinc oxide on electrical and mechanical properties of polyvinyl alcohol matrix composite by electrospinning method.
- Published in:
- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-79477-x
- By:
- Publication type:
- Article
High-Contrast Laser Marking of Microelectronic Packaging Modules.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2015, v. 10, n. 2, p. 175, doi. 10.2961/jlmn.2015.02.0013
- By:
- Publication type:
- Article
The PILATUS 1M detector.
- Published in:
- 2006
- By:
- Publication type:
- Other
On-Chip Passive Devices Technology: Component's Characteristics, Fabrication and Commercialization.
- Published in:
- International Review on Computers & Software, 2011, v. 6, n. 3, p. 434
- By:
- Publication type:
- Article
TRAINING CALENDAR.
- Published in:
- Electronic Device Failure Analysis, 2019, v. 21, n. 3, p. 44
- By:
- Publication type:
- Article
PLASMA FIB PROVIDES VITAL DELAYERING AND SITE SPECIFIC FAILURE ANALYSIS CAPABILITIES FOR LARGER-SCALE STRUCTURES.
- Published in:
- Electronic Device Failure Analysis, 2016, v. 18, n. 1, p. 30, doi. 10.31399/asm.edfa.2016-1.p030
- By:
- Publication type:
- Article
Finite Element Analysis of the Effect of Fin Geometry on Thermal Performance of Heat Sinks in Microelectronics.
- Published in:
- Journal of Applied Sciences & Environmental Management, 2019, v. 23, n. 11, p. 2059, doi. 10.4314/jasem.v23i11.24
- By:
- Publication type:
- Article
Electromagnetic properties of Si-C-N based ceramics and composites.
- Published in:
- International Materials Reviews, 2014, v. 59, n. 6, p. 326, doi. 10.1179/1743280414Y.0000000037
- Publication type:
- Article
THE DAWN OF NANO-SCALE SYSTEM- ON- PACKAGE.
- Published in:
- Microwave Journal, 2009, v. 52, n. 2, p. 24
- By:
- Publication type:
- Article
THE INFLUENCE OF THE PACKAGE ENVIRONMENT ON THE FUNCTIONING AND RELIABILITY OF CAPACITIVE RF-MEMS SWITCHES.
- Published in:
- Microwave Journal, 2005, v. 48, n. 12, p. 102
- By:
- Publication type:
- Article
COMING EVENTS.
- Published in:
- 2004
- Publication type:
- Proceeding
Three-Dimensional Simulation of Microchip Encapsulation Process.
- Published in:
- Polymer Engineering & Science, 2000, v. 40, n. 3, p. 776, doi. 10.1002/pen.11207
- By:
- Publication type:
- Article
Design and Evaluation of a Cyanate Ester Containing Oxaspirocyclic Structure for Electronic Packaging.
- Published in:
- Advances in Polymer Technology, 2022, p. 1, doi. 10.1155/2022/8218905
- By:
- Publication type:
- Article
Research on Machinability of Laser Modified AlN Substrates.
- Published in:
- China Mechanical Engineering, 2021, v. 32, n. 23, p. 2817, doi. 10.3969/j.issn.1004-132X.2021.23.005
- By:
- Publication type:
- Article
可调控热膨胀力学超材料设计制备与表征评测研究进展.
- Published in:
- Acta Materiae Compositae Sinica, 2024, v. 41, n. 9, p. 4589, doi. 10.13801/j.cnki.fhclxb.20240826.002
- By:
- Publication type:
- Article
Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation.
- Published in:
- Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00764-8
- By:
- Publication type:
- Article
Effect of packaging conditions and temperature on viability of microencapsulated bifidobacteria during storage.
- Published in:
- Journal of the Science of Food & Agriculture, 2004, v. 84, n. 2, p. 134, doi. 10.1002/jsfa.1616
- By:
- Publication type:
- Article
Ultrasoft and High Magnetic Moment CoFe Films Directly Electrodeposited from a B-Reducer Contained Solution.
- Published in:
- Research Letters in Physical Chemistry, 2008, p. 1, doi. 10.1155/2008/342976
- By:
- Publication type:
- Article
Investigation of packaging adhesive properties by molecular dynamics and experiments.
- Published in:
- Journal of Applied Polymer Science, 2021, v. 138, n. 1, p. 1, doi. 10.1002/app.49613
- By:
- Publication type:
- Article
Materials Science and Engineering Ph.D.
- Published in:
- Journal of the Idaho Academy of Science, 2011, v. 47, n. 4, p. 4
- By:
- Publication type:
- Article
Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging.
- Published in:
- Materials Science (0137-1339), 2007, v. 25, n. 1, p. 45
- By:
- Publication type:
- Article
Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 356, doi. 10.1007/s11664-008-0587-0
- By:
- Publication type:
- Article
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 365, doi. 10.1007/s11664-008-0555-8
- By:
- Publication type:
- Article
Thermal Stability Study of Cu(MoN<sub> x </sub>) Seed Layer on Barrierless Si.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3
- By:
- Publication type:
- Article
Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6
- By:
- Publication type:
- Article
Impression Creep Characterization of 90Pb-10Sn Microelectronic Solder Balls at Subsolvus and Supersolvus Temperatures.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1040, doi. 10.1007/s11664-005-0093-6
- By:
- Publication type:
- Article
Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5% Ag-0.5% Cu Solder and Cu Metallization in Microelectronic Packaging.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 143, doi. 10.1007/s11664-005-0225-z
- By:
- Publication type:
- Article
Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 74, doi. 10.1007/s10854-008-9610-8
- By:
- Publication type:
- Article
Experiments and analysis for accurate controlling of an ultra-microvolume adhesive droplet in dispensing.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 5/6, p. 2271, doi. 10.1007/s00170-023-12097-3
- By:
- Publication type:
- Article
OPTIMISATION OF A MICROELECTRONIC ASSEMBLY PACKAGE USING RESPONSE SURFACE METHODOLOGY.
- Published in:
- Nigerian Journal of Technology, 2020, v. 39, n. 4, p. 1058, doi. 10.4314/njt.v39i4.12
- By:
- Publication type:
- Article
Nanoindentation of Graphene Reinforced Epoxy Resin as a Conductive Ink for Microelectronic Packaging Application.
- Published in:
- International Journal of Nanoelectronics & Materials, 2020, v. 13, p. 407
- By:
- Publication type:
- Article