Works matching DE "CIRCUIT board manufacturing"

Results: 127

qByte: An open-source isothermal fluorimeter for democratizing analysis of nucleic acids, proteins and cells.

Published in:

PLoS Biology, 2025, v. 23, n. 5, p. 1, doi. 10.1371/journal.pbio.3003199

By:

Quero, Francisco J.;
Aidelberg, Guy;
Vielfaure, Hortense;
de Kermadec, Yann Huon;
Cazaux, Severine;
Pandi, Amir;
Pascual-Garrigos, Ana;
Arce, Anibal;
Sakyi, Samuel;
Gaudenz, Urs;
Federici, Fernan;
Molloy, Jennifer C.;
Lindner, Ariel B.

Publication type:

Article

Effect of Hydroxyl Group Concentration Generated by Vacuum Ultraviolet Light on the Adhesion Between Epoxy Resin and Copper.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 11, p. 7044, doi. 10.1007/s11664-024-11379-0

By:

Endo, Shinichi;
Ishikawa, Yuki;
Shirakashi, Hina;
Saito, Takeyasu

Publication type:

Article

Reliability behavior of lead-free solder joints in electronic components.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 172, doi. 10.1007/s10854-012-0720-y

By:

Zhang, Liang;
Han, Ji-guang;
He, Cheng-wen;
Guo, Yong-huan

Publication type:

Article

DEVELOPMENT OF A MICROCONTROLLER DEVICE FOR REPRODUCING AUDIO INFORMATION.

Published in:

Eurasian Physical Technical Journal, 2023, v. 20, n. 3, p. 70, doi. 10.31489/2023No3/70-79

By:

A. K., Tussupbekova;
D. A., Afanasyev;
O. B., Seldyugaev;
V. A., Karabassov;
G. K., Alpyssova;
A. T., Abikenov;
E. V., Sheinmeier

Publication type:

Article

钼酸钠-钨酸钠复合添加剂对铜箔电解粗化的影响.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 19, p. 74, doi. 10.19289/j.1004-227x.2023.19.011

By:

冯宝鑫;
张杰;
白忠波;
彭肖林;
任伟伟;
蔡辉;
张菁丽;
刘二勇

Publication type:

Article

某印制电路板企业清洁生产评价体系构建与探讨.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1558, doi. 10.19289/j.1004-227x.2022.21.013

By:

陈妤;
魏喆;
叶茂盛;
李杨杨;
魏立安

Publication type:

Article

Effects of torrefaction and water washing on the properties and combustion reactivity of various wastes.

Published in:

International Journal of Energy Research, 2021, v. 45, n. 6, p. 8125, doi. 10.1002/er.5458

By:

Chen, Chia‐Yang;
Chen, Wei‐Hsin;
Ilham, Zul

Publication type:

Article

Transcriptome Analysis of Cyanide-Treated Rice Seedlings: Insights into Gene Functional Classifications.

Published in:

Life (2075-1729), 2022, v. 12, n. 11, p. 1701, doi. 10.3390/life12111701

By:

Li, Cheng-Zhi;
Lin, Yu-Juan;
Yu, Xiao-Zhang

Publication type:

Article

A TABU SEARCH FOR TIME MINIMIZATION IN PRINTED CIRCUIT BOARD ASSEMBLY.

Published in:

Academic Journal of Manufacturing Engineering, 2021, v. 19, n. 2, p. 5

By:

DODU, Cristina Elena;
ANCĂU, Mircea

Publication type:

Article

THE OPTIMIZATED STUDY ON PREPARATION PROCESS OF NANO TIRE PRESSURE SENSOR USED IN AUTO.

Published in:

Academic Journal of Manufacturing Engineering, 2017, v. 15, n. 1, p. 97

By:

LI Hongmei;
LIU Honghua

Publication type:

Article

A Low Cost Instantaneous Frequency Measurement System.

Published in:

Progress in Electromagnetics Research M, 2017, v. 59, p. 171, doi. 10.2528/pierm17060512

By:

Hossam Badran;
Mohammad Deeb

Publication type:

Article

COMPACT RECONFIGURABLE HMSIW BANDPASS FILTER LOADED BY CSRR.

Published in:

Progress in Electromagnetics Research Letters, 2013, v. 40, p. 191, doi. 10.2528/pierl13032115

By:

Zhu-Dan Wang;
Feng Wei;
Li Zhang;
Xiaowei Shi

Publication type:

Article

Wetting metamorphosis of hydrophobic fluoropolymer coatings submerged in water and ultrasonically vibrated.

Published in:

Journal of Coatings Technology & Research, 2020, v. 17, n. 3, p. 633, doi. 10.1007/s11998-019-00250-1

By:

Trapuzzano, Matthew;
Crane, Nathan B.;
Guldiken, Rasim;
Tejada-Martínez, Andrés

Publication type:

Article

Approaching Board Test Nonintrusively.

Published in:

EE: Evaluation Engineering, 2009, v. 48, n. 12, p. 23

By:

Sguigna, Alan

Publication type:

Article

Making Test Lean Again.

Published in:

EE: Evaluation Engineering, 2009, v. 48, n. 3, p. 32

By:

VanNewkirk, John

Publication type:

Article

AOI-AXI Duo Improves Product Yield.

Published in:

EE: Evaluation Engineering, 2009, v. 48, n. 3, p. 60

By:

Upton, David

Publication type:

Article

Implementing Change On the Test Floor.

Published in:

EE: Evaluation Engineering, 2007, v. 46, n. 5, p. 16

By:

VanNewkirk, John

Publication type:

Article

Laser Printing Circuit Boards and Electronics.

Published in:

Journal of Imaging Science & Technology, 2012, v. 56, n. 4, p. 1, doi. 10.2352/J.ImagingSci.Technol.2012.56.4.040503

By:

Jones, Jason;
Büttner, Dustin;
Chudasama, Rupesh;
Wimpenny, David;
Krüger, Klaus

Publication type:

Article

Fabrication of Fluxgate Sensor Heads by Milling with a Circuit Board Plotter and Influence of Core Annealing Conditions on Sensor Performance.

Published in:

Journal of Superconductivity & Novel Magnetism, 2017, v. 30, n. 11, p. 3257, doi. 10.1007/s10948-016-3681-1

By:

Can, Hava;
Svec, Peter;
Bydzovsky, Jan;
Aktaş, Bekir;
Sözeri, Hüseyin;
Topal, Uğur

Publication type:

Article

Study of microvia filling process based on multi-physical coupling.

Published in:

Transactions of the Institute of Metal Finishing, 2018, v. 96, n. 2, p. 86, doi. 10.1080/00202967.2018.1426174

By:

Ji, Linxian;
Nie, Hexian;
Su, Shidong;
Chen, Yuanming;
He, Wei;
Ai, Kehua

Publication type:

Article

COPPER RECOVERY FROM WASTE PRINTED CIRCUIT BOARDS AND THE CORRELATION OF Cu, Pb, Zn BY IONIC LIQUID.

Published in:

Environment Protection Engineering, 2017, v. 43, n. 4, p. 55, doi. 10.5277/epe170405

By:

FEIFAN LI;
MENGJUN CHEN

Publication type:

Article

Next-generation printed circuit boards manufacturing: an innovative numerical investigation using electroforming process.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 7, p. 4169, doi. 10.1007/s00170-025-15412-2

By:

Boutana, Ilhem;
Mekideche, Mohamed Rachid;
Boultif, Oussama;
Zait, Abdessalam

Publication type:

Article

Parametric Optimization of Double-Sided Printed Circuit Board With Triple Modal Reservation Accounting Failures.

Published in:

Electrica, 2023, v. 23, n. 2, p. 338, doi. 10.5152/electrica.2023.22078

By:

Medvedev, Artem V.;
Gazizov, Talgat R.

Publication type:

Article

Additional Pulses in the Time Response of a Modal Filter on a Double-Sided Printed Circuit Board.

Published in:

Electrica, 2022, v. 22, n. 1, p. 7, doi. 10.5152/electrica.2021.21079

By:

Samoylichenko, Maria A.;
Gazizov, Talgat R.

Publication type:

Article

A Novel Double-layer Low-profile Multiband Frequency Selective Surface for 4G Mobile Communication System.

Published in:

Applied Computational Electromagnetics Society Journal, 2022, v. 37, n. 4, p. 420, doi. 10.13052/2022.ACES.J.370407

By:

Balta, Şakir;
Kartal, Mesut

Publication type:

Article

A metalized-hole PCB as a strain gauge.

Published in:

Instruments & Experimental Techniques, 2016, v. 59, n. 6, p. 879, doi. 10.1134/S0020441216060051

By:

Medvedev, A.

Publication type:

Article

A Nonparametric Scheme for Monitoring a Process Output with a Block Effect.

Published in:

International Journal of Quality, Statistics & Reliability, 2012, p. 1, doi. 10.1155/2012/287582

By:

Bakir, Saad T.

Publication type:

Article

A note on a motion control problem for a placement machine.

Published in:

OR Spectrum, 2008, v. 30, n. 3, p. 535, doi. 10.1007/s00291-007-0088-1

By:

Coene, Sofie;
Hop, Nguyen;
Klundert, Joris;
Spieksma, Frits

Publication type:

Article

A Branch-and-price algorithm for placement routing for a multi-head beam-type component placement tool.

Published in:

OR Spectrum, 2008, v. 30, n. 3, p. 515, doi. 10.1007/s00291-007-0085-4

By:

Sun, Dong-Seok;
Lee, Tae-Eog

Publication type:

Article

A GA-based solution approach for balancing printed circuit board assembly lines.

Published in:

OR Spectrum, 2008, v. 30, n. 3, p. 469, doi. 10.1007/s00291-007-0101-8

By:

Kulak, Osman;
Yilmaz, Ihsan;
Günther, Hans-Otto

Publication type:

Article

Selecting the nozzle assortment for a Gantry-type placement machine.

Published in:

OR Spectrum, 2008, v. 30, n. 3, p. 493, doi. 10.1007/s00291-007-0108-1

By:

Raduly-Baka, Csaba;
Knuutila, Timo;
Johnsson, Mika;
Nevalainen, Olli

Publication type:

Article

Mathematical methods for physical layout of printed circuit boards: an overview.

Published in:

OR Spectrum, 2008, v. 30, n. 3, p. 453, doi. 10.1007/s00291-007-0080-9

By:

Abboud, Nadine;
Grötschel, Martin;
Koch, Thorsten

Publication type:

Article

A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice.

Published in:

International Journal of Electrical Engineering Education, 2017, v. 54, n. 3, p. 208, doi. 10.1177/0020720916673650

By:

Kim, Ernest M.;
Schubert Jr., Thomas F.

Publication type:

Article

Margin analysis emerges as imperative validation technique.

Published in:

EE: Evaluation Engineering, 2014, v. 53, n. 8, p. 28

By:

Caffee, Tim

Publication type:

Article

In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1568, doi. 10.1007/s11664-021-09390-w

By:

Cornet, L.;
Yedra, L.;
Héripré, É.;
Aubin, V.;
Schmitt, J.-H.;
Giorgi, M.-L.

Publication type:

Article

Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6086, doi. 10.1007/s11664-016-4965-8

By:

Han, Jing;
Tan, Shihai;
Guo, Fu

Publication type:

Article

Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 3, p. 611, doi. 10.1007/s11664-011-1799-2

By:

Hannigan, K.;
Reid, M.;
Collins, M.N.;
Dalton, E.;
Xu, C.;
Wright, B.;
Demirkan, K.;
Opila, R.L.;
Reents, W.D.;
Franey, J.P.;
Fleming, D.A.;
Punch, J.

Publication type:

Article

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z

By:

Weiqiang Wang;
Choubey, Anupam;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Recovery and utilisation of non-metallic fraction from waste printed circuit boards in polypropylene composites.

Published in:

Plastics, Rubber & Composites, 2015, v. 44, n. 8, p. 314, doi. 10.1179/1743289815Y.0000000021

By:

Biswal, M.;
Jada, N.;
Mohanty, S.;
Nayak, S. K.

Publication type:

Article

Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards.

Published in:

Polymers for Advanced Technologies, 2016, v. 27, n. 12, p. 1577, doi. 10.1002/pat.3833

By:

Wang, Wenqing;
Meyer, Jacob;
Zeng, Qingxuan;
Li, Mingyu;
Vaezian, Bita;
Economy, James

Publication type:

Article

Label-/tag-free traceability of electronic PCB in SMD assembly based on individual inherent surface patterns.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 98, n. 9-12, p. 3081, doi. 10.1007/s00170-018-2492-x

By:

Wigger, Benedikt;
Meissner, Thomas;
Winkler, Marcel;
Foerste, Alexander;
Jetter, Volker;
Buchholz, Andreas;
Zimmermann, André

Publication type:

Article

A scheduling problem for PCB assembly: a case with multiple lines.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 43, n. 11/12, p. 1189, doi. 10.1007/s00170-008-1797-6

By:

Wu, Yongzhong;
Ji, Ping

Publication type:

Article

Optimization of PCB component placements for the collect-and-place machines.

Published in:

International Journal of Advanced Manufacturing Technology, 2008, v. 37, n. 7/8, p. 828, doi. 10.1007/s00170-007-1014-z

By:

Ho, William;
Ping Ji;
Dey, Prasanta Kumar

Publication type:

Article

Design of miniaturised band-notch ultra-wideband monopole-slot antenna by modified half-mode substrate-integrated waveguide.

Published in:

IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2013, v. 7, n. 1, p. 26, doi. 10.1049/iet-map.2012.0325

By:

Ali-Akbari, Elnaz;
Azarmanesh, Mohammad-Naghi;
Soltani, Saber

Publication type:

Article

Inspection for Circuit Board Assembly.

Published in:

Management Science, 1997, v. 43, n. 9, p. 1198, doi. 10.1287/mnsc.43.9.1198

By:

Chevalier, Phillipe B.;
Wein, Lawrence M.

Publication type:

Article

Estimating printed circuit board assembly times using neural networks.

Published in:

International Journal of Production Research, 2010, v. 48, n. 8, p. 2201, doi. 10.1080/00207540802572574

By:

Vainio, Frans;
Maier, Michael;
Knuutila, Timo;
Alhoniemi, Esa;
Johnsson, Mika;
Nevalainen, Olli S.

Publication type:

Article

Integrated simulation tool for quality support in the low-volume high-complexity electronics manufacturing domain.

Published in:

International Journal of Production Research, 2010, v. 48, n. 1, p. 45, doi. 10.1080/00207540802427886

By:

Huertas Quintero, Lina A.M.;
West, Andrew A.;
Velandia, Diana M. Segura;
Conway, Paul P.;
Wilson, Anthony

Publication type:

Article

Burn-in Test Detection Method for Electronic Products based on VFSA--ELM.

Published in:

Journal of Engineering Science & Technology Review, 2018, v. 11, n. 4, p. 40, doi. 10.25103/jestr.114.05

By:

Yanming Lee;
Hong-yi Zhang;
Jiangshui Hong;
Weiqi Lee;
Jimmi Rosa

Publication type:

Article

Mobile Handset Antenna with Reduced Chassis Influence.

Published in:

Journal of Electromagnetic Waves & Applications, 2011, v. 25, n. 2/3, p. 295, doi. 10.1163/156939311794362920

By:

Ma, H. Q.

Publication type:

Article

SEU reliability evaluation of 3D ICs.

Published in:

Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 4, p. 362, doi. 10.1049/el.2014.3968

By:

Huiyun Li;
Xiaobo Hu;
Cuiping Shao;
Jianbin Zhou;
Guoqing Xu

Publication type:

Article