Works matching DE "PLASTIC embedment of electronic equipment"
Results: 159
Translational Neuroelectronics.
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- Advanced Functional Materials, 2020, v. 30, n. 29, p. 1, doi. 10.1002/adfm.201909165
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- Article
Solution-processed white graphene-reinforced ferroelectric polymer nanocomposites with improved thermal conductivity and dielectric properties for electronic encapsulation.
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- Journal of Polymer Research, 2017, v. 24, n. 2, p. 1, doi. 10.1007/s10965-017-1189-4
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- Article
Cycloaliphatic epoxy resin modified by two kinds of oligo-fluorosiloxanes for potential application in light-emitting diode (LED) encapsulation.
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- Journal of Polymer Research, 2012, v. 19, n. 8, p. 1, doi. 10.1007/s10965-012-9923-4
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- Article
Air and Water‐Stable n‐Type Doping and Encapsulation of Flexible MoS<sub>2</sub> Devices with SU8.
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- Advanced Electronic Materials, 2019, v. 5, n. 1, p. N.PAG, doi. 10.1002/aelm.201800492
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- Article
Accounting for data encapsulation in the measurement of object-oriented class cohesion.
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- Journal of Software: Evolution & Process, 2015, v. 27, n. 5, p. 373, doi. 10.1002/smr.1714
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- Article
Towards Production and Energy Coupling System Modeling and Simulation for Energy Optimization in the Process Industry.
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- Journal of Donghua University (English Edition), 2011, v. 28, n. 2, p. 128
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- Article
Converged Digital TV Services: The Role of Middleware and Future Directions of Interactive Television.
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- International Journal of Digital Multimedia Broadcasting, 2009, v. 2009, p. 1, doi. 10.1155/2009/643680
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- Publication type:
- Article
AL-FEC for Improved Mobile Reception of MPEG-2 DVB-T Transport Streams.
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- International Journal of Digital Multimedia Broadcasting, 2009, v. 2009, p. 1, doi. 10.1155/2009/614178
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- Article
Benefits of Sophisticated Motor & Drive Technologies.
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- Chemical Engineering, 2017, v. 124, n. 6, p. 26
- Publication type:
- Article
Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding.
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- Journal of Polymer Engineering, 2023, v. 43, n. 2, p. 179, doi. 10.1515/polyeng-2022-0150
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- Article
Low Substrate Temperature Encapsulation for Flexible Electrodes and Organic Photovoltaics.
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- Advanced Energy Materials, 2015, v. 5, n. 6, p. n/a, doi. 10.1002/aenm.201401442
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- Article
An orthogonal array based genetic algorithm for developing neural network based process models of fluid dispensing.
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- International Journal of Production Research, 2006, v. 44, n. 22, p. 4815, doi. 10.1080/00207540600620880
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- Article
Mejora de procesos para el desarrollo de dispositivos prostéticos de mano.
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- Ingenium, 2010, n. 21, p. 92
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- Publication type:
- Article
FSI ANALYSIS OF WIRE SWEEP IN ENCAPSULATION PROCESS OF PLASTIC BALL GRID ARRAY PACKAGING.
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- Journal of Thermal Science & Technology / Isı Bilimi ve Tekniği Dergisi, 2013, v. 33, n. 1, p. 101
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- Publication type:
- Article
Experimental Investigation of the Influence of an Encapsulation Layer on the Lightning Current Characteristics of YBCO Tapes.
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- Journal of Superconductivity & Novel Magnetism, 2017, v. 30, n. 6, p. 1413, doi. 10.1007/s10948-017-3990-z
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- Publication type:
- Article
FRACTURE MECHANICAL CHARACTERIZATION OF IC-DEVICE INTERFACES.
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- Quality & Reliability Engineering International, 1995, v. 11, n. 4, p. 299, doi. 10.1002/qre.4680110415
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- Article
Reports from DELTA.
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- Quality & Reliability Engineering International, 1994, v. 10, n. 3, p. 244
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- Article
FAILURE ANALYSIS OF MULTILEVEL METALLIZED LSI USING OPTICAL BEAM INDUCED CURRENT.
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- Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 239, doi. 10.1002/qre.4680080311
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- Publication type:
- Article
PLASTIC ENCAPSULATED ICs IN MILITARY EQUIPMENT RELIABILITY PREDICTION MODELLING.
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- Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 195, doi. 10.1002/qre.4680080307
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- Article
ENVIRONMENTAL TESTING AND COMPONENT RELIABILITY OBSERVATIONS OF TELECOMMUNICATIONS EQUIPMENT OPERATED IN TROPICAL CLIMATIC. CONDITIONS.
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- Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 189, doi. 10.1002/qre.4680080306
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- Article
HUMIDITY ACCELERATION FACTOR FOR PLASTIC PACKAGED ELECTRONIC DEVICES.
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- Quality & Reliability Engineering International, 1991, v. 7, n. 5, p. 365, doi. 10.1002/qre.4680070505
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- Article
A RAPID TECHNIQUE FOR ASSESSING THE MOISTURE INGRESS SUSCEPTIBILITY OF PLASTIC- ENCAPSULATED INTEGRATED CIRCUITS.
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- Quality & Reliability Engineering International, 1987, v. 3, n. 3, p. 185, doi. 10.1002/qre.4680030309
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- Article
Reliability Analysis Center (U.S.A.) Study of Effects of IC Quality.
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- Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 216, doi. 10.1002/qre.4680010320
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- Article
METHODS AND LIMITATIONS OF ASSESSING THE HERMETICITY OF SEMICONDUCTOR COMPONENT ENCAPSULATIONS.
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- Quality & Reliability Engineering International, 1985, v. 1, n. 1, p. 3, doi. 10.1002/qre.4680010103
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- Publication type:
- Article
Foldable and washable textile-based OLEDs with a multi-functional near-room-temperature encapsulation layer for smart e-textiles.
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- NPJ Flexible Electronics, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41528-021-00112-0
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- Article
Preparation of Nacre‐Like Polyimide/Montmorillonite Composite Films with Excellent Water Vapor Barrier Properties by Gravity‐Induced Deposition.
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- Advanced Materials Interfaces, 2021, v. 8, n. 3, p. 1, doi. 10.1002/admi.202001786
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- Publication type:
- Article
PbI<sub>2</sub>/CH<sub>3</sub>NH<sub>3</sub>Cl Mixed Precursor–Induced Micrometer‐Scale Grain Perovskite Film and Room‐Temperature Film Encapsulation toward High Efficiency and Stability of Planar Perovskite Solar Cells.
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- Advanced Materials Interfaces, 2018, v. 5, n. 15, p. 1, doi. 10.1002/admi.201800499
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- Publication type:
- Article
Bifunctional Hybrid Ni/Ni<sub>2</sub>P Nanoparticles Encapsulated by Graphitic Carbon Supported with N, S Modified 3D Carbon Framework for Highly Efficient Overall Water Splitting.
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- Advanced Materials Interfaces, 2018, v. 5, n. 15, p. 1, doi. 10.1002/admi.201800473
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- Article
Aerodynamic Characteristics and Design Guidelines of Push–Pull Ventilation Systems.
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- Annals of Occupational Hygiene, 2005, v. 49, n. 1, p. 1, doi. 10.1093/annhyg/meh065
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- Article
Encapsulated fiber Bragg grating sensor for high temperature measurements.
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- Optical Engineering, 2011, v. 50, n. 11, p. 114401, doi. 10.1117/1.3644534
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- Article
Adhesion of underfill and components in flip chip encapsulation.
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- Journal of Adhesion Science & Technology, 2002, v. 16, n. 2, p. 213, doi. 10.1163/156856102317293713
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- Publication type:
- Article
An architecture of small-scaled neuro-hardware using probabilistically coded pulse neurons.
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- Electrical Engineering in Japan, 2002, v. 139, n. 4, p. 48, doi. 10.1002/eej.1168
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- Publication type:
- Article
Determining the Thermal Resistance of Buried and/or Encapsulated Ducts.
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- ASHRAE Transactions, 2013, v. 119, n. 2, p. 1
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- Article
Measuring the Flex Life of Conductive Yarns in Narrow Fabric.
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- Micromachines, 2023, v. 14, n. 4, p. 781, doi. 10.3390/mi14040781
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- Article
The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects.
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- Micromachines, 2018, v. 9, n. 12, p. 645, doi. 10.3390/mi9120645
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- Article
Tunnel Encapsulation Technology for Durability Improvement in Stretchable Electronics Fabrication.
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- Micromachines, 2018, v. 9, n. 10, p. 519, doi. 10.3390/mi9100519
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- Publication type:
- Article
Encapsulation of Piezoelectric Transducers for Sensory Augmentation and Substitution with Wearable Haptic Devices.
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- Micromachines, 2017, v. 8, n. 9, p. 270, doi. 10.3390/mi8090270
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- Publication type:
- Article
Thermal and Electromagnetic Combined Optimization Design of Dry Type Air Core Reactor.
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- Energies (19961073), 2017, v. 10, n. 12, p. 1989, doi. 10.3390/en10121989
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- Publication type:
- Article
UNIFIED COHESION MEASURES FOR ASPECT-ORIENTED SYSTEMS.
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- International Journal of Software Engineering & Knowledge Engineering, 2011, v. 21, n. 1, p. 143, doi. 10.1142/S0218194011005128
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- Article
On the Construction of Public Key Encryption with Sender Recovery.
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- International Journal of Foundations of Computer Science, 2015, v. 26, n. 1, p. 1, doi. 10.1142/S012905411550001X
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- Publication type:
- Article
Novel bi-transition metallic encapsulated naphthalene-like Si<sub>20</sub> prismatic cage: A DFT investigation.
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- Journal of Computational Chemistry, 2009, v. 30, n. 7, p. 1103, doi. 10.1002/jcc.21137
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- Publication type:
- Article
Cyanate Ester-Based Encapsulation Material for High-Temperature Applications.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 9, p. 2803, doi. 10.1007/s11664-013-2665-1
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- Publication type:
- Article
Izvlečki.
- Published in:
- 2011
- Publication type:
- Abstract
Thermoplastic encapsulations of a sensor platform by high‐temperature injection molding up to 360°C.
- Published in:
- Polymer Engineering & Science, 2019, v. 59, n. 7, p. 1315, doi. 10.1002/pen.25114
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- Publication type:
- Article
The preparation of organic light-emitting diode encapsulation barrier layer by low-temperature plasma-enhanced chemical vapor deposition: a study on the $$\hbox {SiO}_\mathrm{x}\hbox {N}_\mathrm{y}$$ film parameter optimization.
- Published in:
- Journal of Intelligent Manufacturing, 2016, v. 27, n. 3, p. 581, doi. 10.1007/s10845-014-0893-8
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- Article
A comparison of the strength of autohesion of plasma treated amorphous and semi-crystalline PEEK films.
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- Polymers for Advanced Technologies, 2011, v. 22, n. 12, p. 2496, doi. 10.1002/pat.1791
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- Publication type:
- Article
A knowledge encapsulation approach to ontology modularization.
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- Knowledge & Information Systems, 2011, v. 26, n. 2, p. 249, doi. 10.1007/s10115-009-0279-y
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- Publication type:
- Article
Pharmacokinetic modeling of paclitaxel encapsulation in Cremophor EL micelles.
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- Cancer Chemotherapy & Pharmacology, 2001, v. 47, n. 4, p. 309, doi. 10.1007/s002800000215
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- Publication type:
- Article
Effectiveness of methods of eliminating encapsulation during extrusion of rubber mixtures.
- Published in:
- Chemical & Petroleum Engineering, 2009, v. 45, n. 1/2, p. 7, doi. 10.1007/s10556-009-9134-y
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- Publication type:
- Article
Numerical modeling of the performance of thermoelectric module with polydimethylsiloxane encapsulation.
- Published in:
- International Journal of Energy Research, 2018, v. 42, n. 3, p. 1287, doi. 10.1002/er.3928
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- Publication type:
- Article