Works matching DE "SURFACE mount technology"

Results: 198

The optimal configuration for various placement machines in PCB assembly lines.

Published in:

Annals of Operations Research, 2025, v. 349, n. 1, p. 365, doi. 10.1007/s10479-024-05828-6

By:

Chen, Tzu-Li;
Chen, James C.;
Chen, Yin-Yann;
Chang, Yu-Jie

Publication type:

Article

Evolving gas flow, measurement, and control technologies.

Published in:

Solid State Technology, 1999, v. 42, n. 10, p. 51

By:

Snow, Jim;
Tison, Stuart;
Plante, Walter

Publication type:

Article

Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 8066, doi. 10.1007/s11664-024-11420-2

By:

Shih, Meng-Kai;
Chen, Shi-Jie;
Lin, I. Hung;
Lou, Bai-Yao;
Ni, Tom

Publication type:

Article

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 337, doi. 10.1179/174329408X281821

By:

Hong, S. J.;
Park, B-H.;
Seo, D. S.;
Ryu, C.-R.

Publication type:

Article

Rheological characterization and jet printing performance of Sn–58Bi solder pastes.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 4575, doi. 10.1007/s10854-017-8408-y

By:

Li, Saipeng;
Wei, Mingzhen;
Hao, Jian;
Tian, Shuang;
Wang, Dapeng;
Zhou, Jian;
Xue, Feng

Publication type:

Article

Wettability of SACR- xNi solder alloy on Cu leading wire with no-clean flux.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 94, doi. 10.1007/s10854-016-5496-z

By:

Wang, Yaoli;
Fang, Zonghui;
Ma, Ning;
Zhang, Keke

Publication type:

Article

Effect of pulsed voltage on electrochemical migration of tin in electronics.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7997, doi. 10.1007/s10854-015-3454-9

By:

Verdingovas, Vadimas;
Jellesen, Morten;
Ambat, Rajan

Publication type:

Article

Assessing SMT and CLP approaches for workflow nets verification.

Published in:

International Journal on Software Tools for Technology Transfer, 2018, v. 20, n. 4, p. 467, doi. 10.1007/s10009-018-0486-5

By:

Bride, Hadrien;
Kouchnarenko, Olga;
Peureux, Fabien;
Voiron, Guillaume

Publication type:

Article

Design of a Digital Twin in Low-Volume, High-Mix Job Allocation and Scheduling for Achieving Mass Personalization.

Published in:

Systems, 2023, v. 11, n. 9, p. 454, doi. 10.3390/systems11090454

By:

Sit, Sheron K. H.;
Lee, Carman K. M.

Publication type:

Article

LABORATORY TEST OF SURFACE MOUNTED PERMANENT MAGNET BRUSHLESS MOTOR.

Published in:

Technical Transactions / Czasopismo Techniczne, 2016, v. 3-E, p. 185, doi. 10.4467/2353737XCT.16.276.6075

By:

KORKOSZ, MARIUSZ;
PODSKARBI, GRZEGORZ

Publication type:

Article

Orthogonal Fuzzy Rule-Based Systems: Selection of Optimum Rules.

Published in:

Neural Computing & Applications, 2000, v. 9, n. 1, p. 4, doi. 10.1007/s005210070029

By:

Lotfi, A.;
Howarth, M.;
Hull, J. B.

Publication type:

Article

Zeroing in on Component Reliability.

Published in:

EE: Evaluation Engineering, 2008, v. 47, n. 9, p. 40

By:

Adams, Tom

Publication type:

Article

Inline vs. Offline Device Programming.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 9, p. 46

By:

Briant, Mark

Publication type:

Article

3-D Techniques in SMT Test.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 2, p. 36

By:

Rice, Malachy;
Johnson, Stacy Kalisz;
Leinbach, Glen E.

Publication type:

Article

Structural and Magnetic Studies of Cu-Substituted Nanocrystalline Ni-Zn Ferrites Obtained Via Hexamine-Nitrate Combustion Route.

Published in:

Journal of Superconductivity & Novel Magnetism, 2017, v. 30, n. 6, p. 1447, doi. 10.1007/s10948-016-3937-9

By:

Gawas, Satu;
Verenkar, V.;
Gawas, U.;
Pednekar, Rajesh;
Kothawale, M.

Publication type:

Article

A Review on VHF Power Electronics Converter and Design Issues.

Published in:

Engineering Letters, 2008, v. 16, n. 3, p. 288

By:

Yahaya, N. Z.;
Begam, K. M.;
Awan, M.

Publication type:

Article

SMT 32 International Conference attracts over 150 scientists from around the world in San Sebastian, Spain.

Published in:

Transactions of the Institute of Metal Finishing, 2018, v. 96, n. 5, p. 234, doi. 10.1080/00202967.2018.1502509

By:

García-Lecina, E.

Publication type:

Article

A multimodal fusion method for soldering quality online inspection.

Published in:

Journal of Intelligent Manufacturing, 2025, v. 36, n. 5, p. 3271, doi. 10.1007/s10845-024-02413-3

By:

Xie, Jian;
Guo, Yu;
Liu, Daoyuan;
Huang, Shaohua;
Zheng, Kaiwen;
Tao, Yaning

Publication type:

Article

Detection of stencil printing direction in printed circuit boards assembly using solder paste inspection data.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 1, p. 97, doi. 10.1007/s00170-024-14585-6

By:

Farrag, Abdelrahman;
Kim, Jaewoo;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Surrogate-based optimization framework for enhancing SMT process quality and productivity in electronics manufacturing services.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 136, n. 11, p. 5103, doi. 10.1007/s00170-025-15032-w

By:

Lee, Ching-Hung;
Lin, Kai-Xiang;
Chou, Che-Wei

Publication type:

Article

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 1/2, p. 745, doi. 10.1007/s00170-024-13767-6

By:

Kim, Jaewoo;
Zhang, Zhenxuan;
Won, Daehan;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 131, n. 12, p. 5897, doi. 10.1007/s00170-024-13343-y

By:

Terra, Nathália Mattos;
Santiago, Sandro Breval;
Vieira, Adalena Kennedy;
Vieira, Raimundo Kennedy

Publication type:

Article

A review on numerical approach of reflow soldering process for copper pillar technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 4325, doi. 10.1007/s00170-022-09724-w

By:

Lee, Jing Rou;
Aziz, Mohd Sharizal Abdul;
Ishak, Mohammad Hafifi Hafiz;
Khor, Chu Yee

Publication type:

Article

Assessing product quality from the production process logs.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 117, n. 5/6, p. 1615, doi. 10.1007/s00170-021-07764-2

By:

Duong, Le Toan;
Travé-Massuyès, Louise;
Subias, Audine;
Roa, Nathalie Barbosa

Publication type:

Article

Technical Papers: Development and Some Investigative Testing of Smart Structural FRP Devices with Embedded Fiber Optic Sensor for Health Monitoring of Civil Structures.

Published in:

Advances in Structural Engineering, 2010, v. 13, n. 5, p. 905, doi. 10.1260/1369-4332.13.5.905

By:

Corvaglia, P.;
Largo, A.;
Caponero, M.A.;
Maddaluno, G.

Publication type:

Article

Assessment of the Predictive Performance of Existing Analytical Models for Debonding of Near-Surface Mounted FRP Strips.

Published in:

Advances in Structural Engineering, 2010, v. 13, n. 2, p. 299, doi. 10.1260/1369-4332.13.2.299

By:

Vasquez, D.;
Seracino, R.

Publication type:

Article

Combined ON/OFF and conformal mapping method for magnet shape optimisation of SPMSM.

Published in:

IET Electric Power Applications (Wiley-Blackwell), 2018, v. 12, n. 9, p. 1365, doi. 10.1049/iet-epa.2018.5166

By:

Mirahki, Hooshang;
Moallem, Mehdi;
Ebrahimi, Mohammad;
Fahimi, Babak

Publication type:

Article

Magnetising fixture design for optimal magnetisation orientation of ring-type magnet in surface-mounted permanent magnet motor.

Published in:

IET Electric Power Applications (Wiley-Blackwell), 2018, v. 12, n. 9, p. 1344, doi. 10.1049/iet-epa.2018.5229

By:

Sunghoon Lim;
Kazuhiro Izui;
Shinji Nishiwaki;
Jung-Pyo Hong;
Seungjae Min

Publication type:

Article

Analysis of cogging torque caused by manufacturing tolerances of surface-mounted permanent magnet synchronous motor for electric power steering.

Published in:

IET Electric Power Applications (Wiley-Blackwell), 2016, v. 10, n. 8, p. 691, doi. 10.1049/iet-epa.2015.0641

By:

Ji-Min Kim;
Myung-Hwan Yoon;
Jung-Pyo Hong;
Sung-Il Kim

Publication type:

Article

Rapid fault cause identification in surface mount technology processes based on factory-wide data analysis.

Published in:

International Journal of Distributed Sensor Networks, 2019, v. 15, n. 2, p. 1, doi. 10.1177/1550147719832802

By:

Kim, Dongil;
Koo, Jeongin;
Kim, Hyein;
Kang, Seokho;
Lee, Sang Hyun;
Kang, Jeong Tae

Publication type:

Article

Process under control for automotive applications.

Published in:

EE: Evaluation Engineering, 2016, v. 55, n. 11, p. 20

By:

Ghirelli, Alberto

Publication type:

Article

Strain measurement in micro-electronic packages using the digital image correlation method.

Published in:

Welding International, 2011, v. 25, n. 11, p. 844, doi. 10.1080/09507116.2011.590654

By:

Ikeda, Toru;
Kanno, Toshifumi;
Shishido, Nobuyuki;
Miyazaki, Noriyuki;
Tanaka, Hiroyuki;
Hatao, Takuya

Publication type:

Article

Statistical Analysis of Thermal Treatment Effect of SMD Ni-RTD Batch Sensors and Its Direct Application Without Packaging for a Contact Thermometer.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1481, doi. 10.1007/s11664-022-09440-x

By:

Chavez-Urbiola, I. R.;
Sánchez-Fraga, R.;
Mejia, I.;
Leon-Gil, J. A.;
Ponce-Hernández, J.;
Velarde-Díaz, L. D.;
Alcantar-Peña, Jesús J.

Publication type:

Article

Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 3, p. 2073, doi. 10.1007/s11664-017-6014-7

By:

Lin, Jian;
Lei, Yongping;
Fu, Hanguang;
Guo, Fu

Publication type:

Article

Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2628, doi. 10.1007/s11664-009-0923-z

By:

Snugovsky, Polina;
Bagheri, Zohreh;
Hamilton, Craig

Publication type:

Article

The Effect of Ag Content on the Formation of Ag<sub>3</sub>Sn Plates in Sn-Ag-Cu Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2074, doi. 10.1007/s11664-006-0316-5

By:

Huann-Wu Chiang;
Chang, Kennedy;
Jun-Yuan Chen

Publication type:

Article

Reliability Testing of WLCSP Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1032, doi. 10.1007/BF02692564

By:

Huann-Wu Chiang;
Jun-Yuan Chen;
Ming-Chuan Chen;
Lee, Jeffrey C. B.;
Shiau, Gary

Publication type:

Article

Interfacial Reaction Study on a Solder Joint with Sn-4Ag-0.5Cu Solder Ball and Sn-7Zn-Al (30 ppm) Solder Paste in a Lead-Free Wafer Level Chip Scale Package.

Published in:

Journal of Electronic Materials, 2004, v. 33, n. 12, p. 1550, doi. 10.1007/s11664-004-0097-7

By:

Huann-Wu Chiang;
Jun-Yuan Chen;
Lee, Jeffrey C. B.;
Li, S. M.

Publication type:

Article

Minimizing the number of pickups on a multi-head placement machine.

Published in:

Journal of the Operational Research Society, 2007, v. 58, n. 1, p. 115, doi. 10.1057/palgrave.jors.2602136

By:

Knuutila, T.;
Pyöttiälä, S.;
Nevalainen, O. S.

Publication type:

Article

Multi Variant Surface Mounted Metal-Organic Frameworks.

Published in:

Advanced Functional Materials, 2013, v. 23, n. 30, p. 3790, doi. 10.1002/adfm.201202996

By:

Liu, Bo;
Tu, Min;
Zacher, Denise;
Fischer, Roland A.

Publication type:

Article

Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2

By:

Bashir, Muhammad Nasir;
Haseeb, A. S. M. A.;
Naher, Sumsun;
Ali, Muhammad Mahmood;
Ali Bashir, Mohamed Bashir;
Zaidi, Asad A.;
Jamshaid, Muhammad;
Javed, Iqra

Publication type:

Article

Determining the RF resistance and Q-factor of air-core inductors.

Published in:

Microwave & Optical Technology Letters, 2001, v. 29, n. 2, p. 89, doi. 10.1002/mop.1093

By:

Gross, Shay;
Weller, Thomas

Publication type:

Article

Broadband array using surface-mounted monopole concept.

Published in:

Microwave & Optical Technology Letters, 1998, v. 19, n. 6, p. 455, doi. 10.1002/(SICI)1098-2760(19981220)19:6<455::AID-MOP19>3.0.CO;2-W

By:

Desclos, L.;
Floc'h, J. M.

Publication type:

Article

Surface-mounted monopole antenna.

Published in:

Microwave & Optical Technology Letters, 1997, v. 16, n. 6, p. 349, doi. 10.1002/(SICI)1098-2760(19971220)16:6<349::AID-MOP8>3.0.CO;2-K

By:

Floc'h, J. M.;
Desclos, L.

Publication type:

Article

A novel placement method for mini-scale passive components in surface mount technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 5/6, p. 1475, doi. 10.1007/s00170-021-07147-7

By:

He, Jingxi;
Cen, Yuqiao;
Li, Yuanyuan;
Alelaumi, Shrouq M.;
Won, Daehan

Publication type:

Article

Three-dimensional CFD simulation of the stencil printing performance of solder paste.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 9/10, p. 3351, doi. 10.1007/s00170-020-05636-9

By:

Rusdi, M. S.;
Abdullah, M. Z.;
Ishak, M. H. H.;
Aziz, M. S. Abdul;
Abdullah, M. K.;
Rethinasamy, P.;
Jalar, A.

Publication type:

Article

Surface mount adhesive: in search of a perfect dot.

Published in:

International Journal of Advanced Manufacturing Technology, 2017, v. 90, n. 5-8, p. 2083, doi. 10.1007/s00170-016-9549-5

By:

Toh, Beng;
Yeoh, Hak;
Teoh, Wen;
Chin, Loy

Publication type:

Article

PCB assembly optimization in a single gantry high-speed rotary-head collect-and-place machine.

Published in:

International Journal of Advanced Manufacturing Technology, 2017, v. 88, n. 9-12, p. 2819, doi. 10.1007/s00170-016-8942-4

By:

Li, Debiao;
Yoon, Sang

Publication type:

Article

An efficient genetic algorithm for setup time minimization in PCB assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 973, doi. 10.1007/s00170-014-6510-3

By:

García-Nájera, Abel;
Brizuela, Carlos;
Martínez-Pérez, Israel

Publication type:

Article

Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders.

Published in:

Metals (2075-4701), 2022, v. 12, n. 1, p. 121, doi. 10.3390/met12010121

By:

Dušek, Karel;
Bušek, David;
Veselý, Petr;
Pražanová, Anna;
Plaček, Martin;
Re, Julia Del

Publication type:

Article