From Japan: Simplified interconnect processing for cost-sensitive chips.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 99
- By:
- Publication type:
- Article
Works matching DE "METALLIZING"
Results: 74
1
2
High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 3, p. 1785, doi. 10.1007/s10854-017-8087-8
- By:
- Publication type:
- Article
3
An ultra-light and high electromagnetic shielding effectiveness material based on melamine foam with its skeleton metallized.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 2, p. 1159, doi. 10.1007/s10854-014-2520-z
- By:
- Publication type:
- Article
4
Gold/silicon nanocomposites: synthesis, characterization, and application in detection of dopamine.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 6, p. 690, doi. 10.1007/s10854-010-0197-5
- By:
- Publication type:
- Article
5
Relation between surface preconditioning and metal deposition in direct galvanic metallization of insulating surfaces.
- Published in:
- Journal of Solid State Electrochemistry, 2004, v. 8, n. 3, p. 201, doi. 10.1007/s10008-003-0426-4
- By:
- Publication type:
- Article
6
PECULIARITIES OF STRUCTURE OF COATINGS OF Fe-Cr-Al SYSTEM FLUX-CORED WIRE PRODUCED UNDER CONDITIONS OF SUPERSONIC ELECTRIC ARC METALLIZATION.
- Published in:
- Paton Welding Journal, 2014, n. 2, p. 31, doi. 10.15407/tpwj2014.02.04
- By:
- Publication type:
- Article
7
On the theory of high-TC superconductivity of doped cuprates.
- Published in:
- Condensed Matter Physics, 2018, v. 21, n. 3, p. 1, doi. 10.5488/CMP.21.33704
- By:
- Publication type:
- Article
8
High current handling capacity multilayer inductors for RF and microwave circuits.
- Published in:
- International Journal of RF & Microwave Computer-Aided Engineering, 2000, v. 10, n. 2, p. 139, doi. 10.1002/(SICI)1099-047X(200003)10:2<139::AID-MMCE7>3.0.CO;2-M
- By:
- Publication type:
- Article
9
Study of steel production with the use of hot-briquetted iron in the cold charge.
- Published in:
- Metallurgist, 2007, v. 51, n. 3-4, p. 148, doi. 10.1007/s11015-007-0027-z
- By:
- Publication type:
- Article
10
Experimental study of coal based direct reduction in iron ore/coal composite pellets in a one layer bed under nonisothermal, asymmetric heating.
- Published in:
- Ironmaking & Steelmaking, 2006, v. 33, n. 1, p. 24, doi. 10.1179/174328106X80064
- By:
- Publication type:
- Article
11
Metallization and Biopatterning on Ultra-Flexible Substrates via Dextran Sacrificial Layers.
- Published in:
- PLoS ONE, 2014, v. 9, n. 8, p. 1, doi. 10.1371/journal.pone.0106091
- By:
- Publication type:
- Article
12
A three-electrode electric arc metallising gun – innovation project.
- Published in:
- Welding International, 2016, v. 30, n. 7, p. 560, doi. 10.1080/09507116.2015.1099893
- By:
- Publication type:
- Article
13
Effect of the discharge velocity of the heterophase flow on the physical–mechanical properties of the electric metallizing flow.
- Published in:
- Welding International, 2014, v. 28, n. 6, p. 491, doi. 10.1080/09507116.2013.840040
- By:
- Publication type:
- Article
14
Metal–carbothermal methods of reducing the degree of oxidation of dispersed metal in electric arc metallizing.
- Published in:
- Welding International, 2013, v. 27, n. 5, p. 423, doi. 10.1080/09507116.2012.715930
- By:
- Publication type:
- Article
15
Composite gallium soldering pastes for low-temperature diffusion soldering of cermet sections.
- Published in:
- Welding International, 2012, v. 26, n. 1, p. 51, doi. 10.1080/09507116.2011.592714
- By:
- Publication type:
- Article
16
A model of heating a flux-cored wire in arc metallizing and analysis of the structure of the coating.
- Published in:
- Welding International, 2010, v. 24, n. 7, p. 546, doi. 10.1080/09507110903569115
- By:
- Publication type:
- Article
17
Formation technology of through metallized holes to sources of high-power GaN/SiC high electron mobility transistors.
- Published in:
- Semiconductors, 2012, v. 46, n. 9, p. 1216, doi. 10.1134/S1063782612090175
- By:
- Publication type:
- Article
18
Protonic metallization of the monoclinic phase in VO films.
- Published in:
- Semiconductors, 2011, v. 45, n. 9, p. 1153, doi. 10.1134/S1063782611090089
- By:
- Publication type:
- Article
19
Autokatalityczne metalizowanie materiałów polimerowych.
- Published in:
- Polimery, 2011, v. 56, n. 7/8, p. 541
- By:
- Publication type:
- Article
20
Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate.
- Published in:
- Journal of Electronic Materials, 2017, v. 46, n. 8, p. 4891, doi. 10.1007/s11664-017-5477-x
- By:
- Publication type:
- Article
21
Cyclic Thermal Stress-Induced Degradation of Cu Metallization on SiN Substrate at −40°C to 300°C.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 1, p. 482, doi. 10.1007/s11664-014-3357-1
- By:
- Publication type:
- Article
22
Improved Thermal Stability Observed in Ni-Based Ohmic Contacts to n-Type SiC for High-Temperature Applications.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 4, p. 400, doi. 10.1007/s11664-010-1449-0
- By:
- Publication type:
- Article
23
Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 213, doi. 10.1007/s11664-010-1447-2
- By:
- Publication type:
- Article
24
Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 239, doi. 10.1007/s11664-010-1439-2
- By:
- Publication type:
- Article
25
Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2528, doi. 10.1007/s11664-010-1376-0
- By:
- Publication type:
- Article
26
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1624, doi. 10.1007/s11664-008-0515-3
- By:
- Publication type:
- Article
27
Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1648, doi. 10.1007/s11664-008-0503-7
- By:
- Publication type:
- Article
28
Nanometer-thin pure boron CVD layers as material barrier to Au or Cu metallization of Si.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 7123, doi. 10.1007/s10854-021-05422-7
- By:
- Publication type:
- Article
29
Investigation of asymmetrical coupled microstrip lines with finite metallization thickness.
- Published in:
- Microwave & Optical Technology Letters, 2001, v. 28, n. 1, p. 45, doi. 10.1002/1098-2760(20010105)28:1<45::AID-MOP13>3.0.CO;2-8
- By:
- Publication type:
- Article
30
Near-infrared spectroscopy of a nitrogen-loud quasar SDSS J1707+6443.
- Published in:
- Astronomy & Astrophysics / Astronomie et Astrophysique, 2012, v. 543, n. 2, p. A143-1, doi. 10.1051/0004-6361/201118477
- By:
- Publication type:
- Article
31
Modeling of Transient Currents in Polyethylene Terephtalate.
- Published in:
- International Journal of Polymer Analysis & Characterization, 2007, v. 12, n. 5, p. 359, doi. 10.1080/10236660701485019
- By:
- Publication type:
- Article
32
Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength.
- Published in:
- Applied Physics A: Materials Science & Processing, 2017, v. 123, n. 12, p. 1, doi. 10.1007/s00339-017-1374-7
- By:
- Publication type:
- Article
33
Inherent diode isolation in programmable metallization cell resistive memory elements.
- Published in:
- Applied Physics A: Materials Science & Processing, 2011, v. 102, n. 4, p. 817, doi. 10.1007/s00339-011-6292-5
- By:
- Publication type:
- Article
34
MATHEMATICAL DETERMINATIONS CONCERNING THE EXTENSION OF THE ELECTRIC FIELD INFLUENCE RANGE ON THE LAYERS COATED BY METALLIZATION.
- Published in:
- Metalurgia, 2013, v. 65, n. 7, p. 52
- By:
- Publication type:
- Article
35
METALLIZING ENGINEERING'S FORFEITURE DOCTRINE AFTER THE AMERICA INVENTS ACT.
- Published in:
- Stanford Technology Law Review, 2013, p. 657
- By:
- Publication type:
- Article
36
Application of Nd:YAG Laser in Electroless Metallization of Polymer Composites.
- Published in:
- Materials & Manufacturing Processes, 2014, v. 29, n. 9, p. 1111, doi. 10.1080/10426914.2014.912316
- By:
- Publication type:
- Article
37
The nitridoborate nitrides Mg<sub>3</sub>[BN<sub>2</sub>]N and Ca<sub>3</sub>[BN<sub>2</sub>]N - electronic structure and chemical bonding.
- Published in:
- Zeitschrift für Naturforschung B: A Journal of Chemical Sciences, 2017, v. 72, n. 6, p. 433, doi. 10.1515/znb-2017-0035
- By:
- Publication type:
- Article
38
Properties of Al, (AuGe)–GaAs contacts fabricated by combining ion-beam treatment and metallization.
- Published in:
- Technical Physics, 1997, v. 42, n. 2, p. 232, doi. 10.1134/1.1258631
- By:
- Publication type:
- Article
39
Specific features of implosion of metallized fiber arrays.
- Published in:
- Plasma Physics Reports, 2017, v. 43, n. 2, p. 141, doi. 10.1134/S1063780X17020106
- By:
- Publication type:
- Article
40
Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass.
- Published in:
- Journal of Adhesion Science & Technology, 2003, v. 17, n. 15, p. 2085, doi. 10.1163/156856103322584227
- By:
- Publication type:
- Article
41
Al/PET adhesion: role of an excimer laser pretreatment of PET prior to aluminum thermal evaporation.
- Published in:
- Journal of Adhesion Science & Technology, 2003, v. 17, n. 3, p. 353, doi. 10.1163/156856103762864660
- By:
- Publication type:
- Article
42
Reliability Assessment of Metallized Film Capacitors using Reduced Degradation Test Sample.
- Published in:
- Quality & Reliability Engineering International, 2013, v. 29, n. 2, p. 259, doi. 10.1002/qre.1307
- By:
- Publication type:
- Article
43
Laser acoustic method for the inspection of flaws in metals and the metallized coatings of dielectrics.
- Published in:
- Russian Journal of Nondestructive Testing, 2011, v. 47, n. 2, p. 118, doi. 10.1134/S1061830911020069
- By:
- Publication type:
- Article
44
Application of high-speed gas-flame technology for hardening the surfaces of machines and robots of automatic gas-flame spraying.
- Published in:
- Physical Sciences & Technology, 2021, v. 8, n. 1/2, p. 47, doi. 10.26577/phst.2021.v8.i1.06
- By:
- Publication type:
- Article
45
Phase transformations in metallization systems under conditions of nonstationary thermal action.
- Published in:
- Technical Physics Letters, 2014, v. 40, n. 9, p. 787, doi. 10.1134/S1063785014090302
- By:
- Publication type:
- Article
46
Diagnostics of degradation processes induced by pulsed electric signals at the aluminum-silicon interface.
- Published in:
- Technical Physics Letters, 2006, v. 32, n. 3, p. 240, doi. 10.1134/S1063785006030199
- By:
- Publication type:
- Article
47
Degradation Processes in the Aluminum–Silicon System Induced by Pulsed Electric Signals.
- Published in:
- Technical Physics Letters, 2001, v. 27, n. 10, p. 834, doi. 10.1134/1.1414449
- By:
- Publication type:
- Article
48
High-efficiency rear-passivated screen- printed silicon solar cells.
- Published in:
- Photovoltaics International, 2011, n. 13, p. 77
- By:
- Publication type:
- Article
49
Cell Processing: Tool Order News Focus.
- Published in:
- Photovoltaics International, 2009, n. 4, p. 56
- Publication type:
- Article
50
Significance of Nano Grain Sized Pt (100 Å) Along with Ti-W/Al-Cu Multi Level Metallisation to VLSI Substrate.
- Published in:
- Journal of Active & Passive Electronic Devices, 2010, v. 5, n. 3/4, p. 221
- By:
- Publication type:
- Article