Works matching IS 10012028 AND DT 2024 AND VI 43 AND IP 11
1
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1412, doi. 10.14106/j.cnki.1001-2028.2024.0174
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2
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1406, doi. 10.14106/j.cnki.1001-2028.2024.0096
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3
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1399, doi. 10.14106/j.cnki.1001-2028.2024.0255
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4
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1390, doi. 10.14106/j.cnki.1001-2028.2024.0164
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5
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1383, doi. 10.14106/j.cnki.1001-2028.2024.0223
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6
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1378, doi. 10.14106/j.cnki.1001-2028.2024.0097
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- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1370, doi. 10.14106/j.cnki.1001-2028.2024.0326
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- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1361, doi. 10.14106/j.cnki.1001-2028.2024.0150
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- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1352, doi. 10.14106/j.cnki.1001-2028.2024.0009
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- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1345, doi. 10.14106/j.cnki.1001-2028.2024.0239
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11
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1311, doi. 10.14106/j.cnki.1001-2028.2024.0190
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12
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1318, doi. 10.14106/j.cnki.1001-2028.2024.0450
- 王 莉;
- 季静欣;
- 柯杰曦;
- 罗建强;
- 陈春梅;
- 周建文;
- 闫宋楷;
- 冯哲圣
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13
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1334, doi. 10.14106/j.cnki.1001-2028.2024.0169
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14
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1326, doi. 10.14106/j.cnki.1001-2028.2024.0322
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15
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1306, doi. 10.14106/j.cnki.1001-2028.2024.0307
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16
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1299, doi. 10.14106/j.cnki.1001-2028.2024.0112
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17
- Electronic Components & Materials, 2024, v. 43, n. 11, p. 1293, doi. 10.14106/j.cnki.1001-2028.2024.0189
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