高温高应变下 Cu / Ta 界面扩散行为的 分子动力学模拟.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1274, doi. 10.14106/j.cnki.1001-2028.2024.1525
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Works matching IS 10012028 AND DT 2024 AND VI 43 AND IP 10
Results: 15
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第一性原理研究 Ba<sub>3</sub> (PS<sub>4</sub> )<sub>2</sub>, YPS<sub>4</sub>, Pb<sub>3</sub> (PS<sub>4</sub> )<sub>2</sub> 和 BiPS4 的电子结构与双折射性质.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1284, doi. 10.14106/j.cnki.1001-2028.2024.0023
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3
一种绝对值忆阻 Hopfield 神经网络的动力学分析 与其实现.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1264, doi. 10.14106/j.cnki.1001-2028.2024.1584
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- Article
4
温度循环条件下塑封器件铜线键合寿命 预测方法研究.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1257, doi. 10.14106/j.cnki.1001-2028.2024.1631
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- Article
5
一种低静态电流快速瞬态响应的线性稳压器.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1250, doi. 10.14106/j.cnki.1001-2028.2024.0149
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- Article
6
F 波段宽带分谐波混频器设计.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1241, doi. 10.14106/j.cnki.1001-2028.2024.0349
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- Article
7
可嵌入式金属化玻璃基微流道热沉设计与优化.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1235, doi. 10.14106/j.cnki.1001-2028.2024.0467
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- Article
8
低浓度 CeO<sub>2</sub> / SiO<sub>2</sub> 复合磨料对硅片 CMP 性能的影响.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1227, doi. 10.14106/j.cnki.1001-2028.2023.0066
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9
Dy<sub>2</sub> O<sub>3</sub> 掺杂抗还原纳米 BaTiO<sub>3</sub> 基陶瓷性能研究.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1221, doi. 10.14106/j.cnki.1001-2028.2024.0465
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10
Ce <sup>4+</sup> 掺杂调节晶格畸变优化 Bi <sub>4</sub> Ti <sub>2. 95</sub> W<sub>0. 05</sub> O<sub>12</sub> 陶瓷 的电学性能.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1214, doi. 10.14106/j.cnki.1001-2028.2024.0299
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- Article
11
用于巡检机器人拔插作业的柔性触觉末端.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1207, doi. 10.14106/j.cnki.1001-2028.2024.0063
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- Article
12
基于 PEDOT 柔性纳米管的超级电容器储能特性研究.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1199, doi. 10.14106/j.cnki.1001-2028.2024.0365
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13
军用高精度惯性微系统集成技术展望.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1181, doi. 10.14106/j.cnki.1001-2028.2024.0417
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14
太赫兹波化合物半导体材料研究进展.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1167, doi. 10.14106/j.cnki.1001-2028.2024.0085
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15
三维集成电子封装中 TGV 技术及其器件应用进展.
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- Electronic Components & Materials, 2024, v. 43, n. 10, p. 1190, doi. 10.14106/j.cnki.1001-2028.2024.0145
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- Article