Works matching IS 10063471 AND DT 2022 AND VI 28 AND IP 6

Results: 13

蚀刻引线框架用的弱碱性无氰镀银工艺的研究.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210455

By:

赵健伟;
朱海锋;
于晓辉;
袁桂云;
孙志

Publication type:

Article

酸性镀铜添加剂开发及应用技术.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210453

By:

邹浩斌;
谭超力;
熊伟;
席道林;
刘彬云

Publication type:

Article

孔雀石绿对金属钴超填充和成核过程的影响.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210452

By:

马晓川;
李亚强;
杨培霞;
张锦秋;
安茂忠

Publication type:

Article

数值模拟方法在周期换向脉冲电镀通孔中的应用.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210451

By:

张远航;
安茂忠;
杨培霞;
张锦秋

Publication type:

Article

醇硫基丙烷磺酸钠对电解高性能锂电铜箔的影响.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210450

By:

杨森;
王文昌;
张然;
秦水平;
吴敏娴;
光崎尚利;
陈智栋

Publication type:

Article

高深径比通孔脉冲电镀添加剂及电镀参数的优化.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210449

By:

杨凯;
陈际达;
陈世金;
许伟廉;
郭茂桂;
廖金超;
吴熷坤

Publication type:

Article

电沉积铜箔的微观组织结构——三维电结晶模式中的电结晶机理探讨.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210448

By:

刘仁志;
谢平令;
王翀

Publication type:

Article

钴互连化学机械抛光浆料中的界面腐蚀行为研究.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210447

By:

秦凯旋;
常鹏飞;
黄钰林;
李明;
杭弢

Publication type:

Article

玻璃通孔三维互连镀铜填充技术发展现状.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210446

By:

纪执敬;
凌惠琴;
吴培林;
余瑞益;
于大全;
李明

Publication type:

Article

酸性溶液中苯并三氮唑和3-巯基-1-丙烷磺酸钠在铜电极表面的电化学SERS研究.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210445

By:

沈银飞;
陈艳丽;
王笙戌;
朱晔;
王文昌;
吴敏娴;
陈智栋

Publication type:

Article

低电压电沉积类金刚石碳膜的研究.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210444

By:

王历;
吴敏娴;
李珺;
陈艳丽;
王文昌;
陈智栋

Publication type:

Article

芯片钴互连及其超填充电镀技术的研究进展.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210443

By:

魏丽君;
周紫晗;
吴蕴雯;
李明;
王溯

Publication type:

Article

Sn-Ag-Cu 三元合金焊料电沉积中添加剂的影响研究.

Published in:

Journal of Electrochemistry, 2022, v. 28, n. 6, p. 1, doi. 10.13208/j.electrochem.210441

By:

缪桦;
李明瑞;
邹文中;
周国云;
王守绪;
叶晓菁;
朱凯

Publication type:

Article