Works matching DE "ELECTRONICS manufacturing"

Results: 160

Enhancing efficiency in PCB assembly for the leading global electronics manufacturing services firm: a TRIZ and Ant Colony Optimization approach.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 11/12, p. 5529, doi. 10.1007/s00170-024-14025-5

By:

Wang, Chia-Nan;
Nhieu, Nhat-Luong;
Viet, Tien-Anh Pham

Publication type:

Article

广州市黄埔区"十三五"空气质量变化趋势与VOCs 排放对臭氧污染的影响分析.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 10, p. 74, doi. 10.19289/j.1004-227x.2023.10.012

By:

刘成坚;
黄小欧;
刘赛红;
余宇帆

Publication type:

Article

Disruption management in a two-period three-tier electronics supply chain.

Published in:

Cogent Business & Management, 2016, v. 3, n. 1, p. 1, doi. 10.1080/23311975.2015.1137138

By:

Danusantoso, Johannes;
Moses, Scott A.;
Liu, Shaofeng

Publication type:

Article

Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints.

Published in:

Nondestructive Testing & Evaluation, 2024, v. 39, n. 6, p. 1599, doi. 10.1080/10589759.2023.2274007

By:

Fang, Tianyu;
An, Junshu;
Chen, Qi;
He, Yunze;
Wang, Hongjin;
Zhang, Xiaogang

Publication type:

Article

Is sustainable operations constrained to financial stress in China's manufacturers? The moderation effect of customer concentration.

Published in:

Journal of General Management, 2022, v. 48, n. 1, p. 80, doi. 10.1177/03063070211066428

By:

Liu, Tiansen;
Zhu, Yu;
Zhu, Yue;
Wang, Jiayu;
Xing, Xinpeng

Publication type:

Article

Night-shift work and risk of compromised visual acuity among the workers in an electronics manufacturing company.

Published in:

2018

By:

YU-CHENG LIN;
KUO-JUNG HO;
Lin, Yu-Cheng;
Ho, Kuo-Jung

Publication type:

journal article

The Key Factors of Selecting Electronics Manufacturing Service Suppliers - an Example of Company U in Taiwan.

Published in:

Management & Production Engineering Review (MPER), 2015, v. 6, n. 4, p. 4, doi. 10.1515/mper-2015-0031

By:

Chiu, Hui-Feng;
Lee, Tzong-Ru (Jiun-Shen);
Kao, Ching-Kuei

Publication type:

Article

IDENTIFICATION OF THE RELATIONSHIPS BETWEEN CRITICAL SUCCESS FACTORS, BARRIERS AND PRACTICES FOR LEAN IMPLEMENTATION IN A SMALL COMPANY.

Published in:

Brazilian Journal of Operations & Production Management, 2018, v. 15, n. 2, p. 232, doi. 10.14488/BJOPM.2018.v15.n2.a6

By:

Pereira, Laís;
Tortorella, Guilherme

Publication type:

Article

Optimization of the LCD optical film cutting problem.

Published in:

International Journal of Production Research, 2017, v. 55, n. 15, p. 4411, doi. 10.1080/00207543.2016.1256507

By:

Huang, Yeu-Shiang;
Wang, Shiang-An;
Fang, Chih-Chiang

Publication type:

Article

VISÃO BASEADA EM RECURSOS: UM ESTUDO DO POTENCIAL COMPETITIVO DO CLUSTER DE ELETROELETRÔNICOS DE SANTA RITA DO SAPUCAÍ.

Published in:

Gestão e Regionalidade, 2019, v. 35, n. 106, p. 216, doi. 10.13037/gr.vol35n106.5119

By:

de Faria, Aline Mariane;
de Miranda Oliveira Junior, Moacir

Publication type:

Article

A GA-based solution approach for balancing printed circuit board assembly lines.

Published in:

OR Spectrum, 2008, v. 30, n. 3, p. 469, doi. 10.1007/s00291-007-0101-8

By:

Kulak, Osman;
Yilmaz, Ihsan;
Günther, Hans-Otto

Publication type:

Article

Aplicaţii ale sistemelor Poka Yoke în producţia de componente electronice pentru industria auto.

Published in:

Quality - Access to Success, 2011, v. 12, n. 5, p. 27

By:

OPREAN, Constantin;
KIFOR, Claudiu Vasile;
MĂGDOIU, Alex

Publication type:

Article

El nearshoring en México y su relación con China, Corea del Sur y Japón.

Published in:

Portes: Revista Mexicana de Estudios Sobre la Cuenca del Pacifico, 2024, p. 31, doi. 10.53897/RevPortes.2024.02.02

By:

Romero Aguilar, José Rafael

Publication type:

Article

Intelligent Optical Classification System for Electronic Components.

Published in:

Electronics & Electrical Engineering, 2010, n. 98, p. 10

By:

Lefkaditis, D.;
Tsirigotis, G.

Publication type:

Article

Application of ultrasonic iterative deconvolution technique to the case of internal defect detection in multi-layered PCB components.

Published in:

Insight: Non-Destructive Testing & Condition Monitoring, 2010, v. 52, n. 1, p. 27, doi. 10.1784/insi.2010.52.1.27

By:

Raišutis, R.;
Tumšys, O.;
Kažys, R.;
Mažeika, L.

Publication type:

Article

The prevalence and risk factors of work related musculoskeletal disorders among electronics manufacturing workers: a cross-sectional analytical study in China.

Published in:

BMC Public Health, 2023, v. 23, n. 1, p. 1, doi. 10.1186/s12889-022-14952-6

By:

Yang, Feng;
Di, Niu;
Guo, Wei-wei;
Ding, Wen-bin;
Jia, Ning;
Zhang, Hengdong;
Li, Dongxia;
Wang, Dayu;
Wang, Rugang;
Zhang, Danying;
Liu, Yongquan;
Shen, Bo;
Wang, Zhong-xu;
Yin, Yan

Publication type:

Article

Technology intensity and Indian manufacturing industries.

Published in:

International Journal of Technology Management & Sustainable Development, 2021, v. 20, n. 1, p. 79, doi. 10.1386/tmsd_00036_1

By:

Kaur, Kawaljeet;
Mehta, Swati

Publication type:

Article

DEMANDS OF SUPPLY.

Published in:

Journal of International Affairs, 2012, v. 66, n. 1, p. 151

By:

Hochenberry, Matthew

Publication type:

Article

COMPARATIVE ASSESSMENT BETWEEN A COUNTERFEITED AND A GENUINE POWER BJT.

Published in:

Journal of Science & Arts, 2020, v. 20, n. 3, p. 775, doi. 10.46939/J.Sci.Arts-20.3-c04

By:

MIRON-ALEXE, VIOREL

Publication type:

Article

Collective Cu-Cu Thermocompression Bonding Using Pillars.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 28, doi. 10.4071/imaps.741710

By:

Carroll, Robert;
La Tulipe, Douglas;
Coolbaugh, Douglas;
Geer, Robert

Publication type:

Article

Challenges of Scalable 2.5D IC Assembly.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 123, doi. 10.4071/imaps.455

By:

Liang Wang;
Woychik, Charles G.;
Guilian Gao;
Villavicencio, Grant;
McGrath, Scott;
Hong Shen;
Arkalgud, Sitaram

Publication type:

Article

INOVAÇÃO TECNOLÓGICA EM EMPRESAS INTENSIVAS NA UTILIZAÇÃO DE CONHECIMENTOS TÉCNICO E CIENTÍFICO: UM ESTUDO A PARTIR DA VISÃO BASEADA EM RECURSOS (VBR).

Published in:

Revista de Administração e Inovação (RAI), 2012, v. 9, n. 4, p. 202, doi. 10.5773/rai.v9i4.879

By:

Tumelero, Cleonir;
Aparecido dos Santos, Silvio;
Plonski, Guilherme Ary

Publication type:

Article

Team Performance in Hierarchical Versus Self-Managed Work Teams in Selected Electronics Manufacturing Company in Cebu.

Published in:

DLSU Business & Economics Review, 2021, v. 30, n. 2, p. 106

By:

Poe, Marlon O.;
Zamora, Liezl L.;
Quinain, Khael T.

Publication type:

Article

Team Performance in Hierarchical Versus Self-Managed Work Teams in Selected Electronics Manufacturing Company in Cebu.

Published in:

DLSU Business & Economics Review, 2019, v. 29, n. 1, p. 106

By:

Poe, Marlon O.;
Zamora, Liezl L.;
Quinain, Khael T.

Publication type:

Article

Screening Criteria for Selection of New Products in the Electronic Component Distribution Industry.

Published in:

International Journal of Performability Engineering, 2010, v. 6, n. 2, p. 159

By:

Chui, C. L.

Publication type:

Article

The 2022 Global 100.

Published in:

Corporate Knights, 2022, v. 22, n. 1, p. 46

By:

Scott, Mike

Publication type:

Article

Letter: Dual-mode oxide thin film transistor shift register for external compensation in active-matrix organic light emitting diode displays.

Published in:

Journal of the Society for Information Display, 2014, v. 22, n. 6, p. 323, doi. 10.1002/jsid.252

By:

Song, Seok‐Jeong;
Nam, Hyoungsik

Publication type:

Article

Photoenergy: Progress in Si-Related Solar Cells for a Low Cost and High Efficiency.

Published in:

International Journal of Photoenergy, 2012, p. 1, doi. 10.1155/2012/486706

By:

Yi, J.;
Weber, Eicke R.;
Lan, C. W.;
Bremner, Stephen;
Kim, D. H.

Publication type:

Article

"K‐synthesis": Recent advancements in natural product synthesis enabled by unique methods and strategies development in Korea.

Published in:

Bulletin of the Korean Chemical Society, 2023, v. 44, n. 3, p. 172, doi. 10.1002/bkcs.12654

By:

Han, Sunkyu

Publication type:

Article

Nanometer Sized Direct Laser‐Induced Gold Printing for Precise 2D‐Electronic Device Fabrication.

Published in:

Small Methods, 2023, v. 7, n. 7, p. 1, doi. 10.1002/smtd.202201221

By:

Geladari, Olympia;
Eberle, Martin;
Maier, Andre;
Fetzer, Florian;
Chassé, Thomas;
Meixner, Alfred J.;
Scheele, Marcus;
Schnepf, Andreas;
Braun, Kai

Publication type:

Article

ohne Titel.

Published in:: Elektronik Industrie, 2024, p. 74
Publication type:: Article

KI als treibende Kraft.

Published in:

Elektronik Industrie, 2023, p. 76

By:

Gottwald, Dipl.- Ing. Petra

Publication type:

Article

Branchenbündnis begrüßt neue Unternehmen.

Published in:: Elektronik Industrie, 2023, p. 11
Publication type:: Article

Supply Risk Management: The Effect of Electronic Component's End-of-Life (EOL) on a Consumer Electronics Company.

Published in:

International Journal of Recent Advances in Organizational Behaviour & Decision Sciences, 2018, v. 4, n. 1, p. 1068

By:

Cañeda, Ed Henry N.;
Payao, Ronald B.

Publication type:

Article

Augmented Reality-Based BIM Data Compatibility Verification Method for FAB Digital Twin implementation.

Published in:

Buildings (2075-5309), 2023, v. 13, n. 11, p. 2683, doi. 10.3390/buildings13112683

By:

Song, Jinwoo;
Park, Sanghyeon;
Lee, Kyuhyup;
Bae, Jinhyun;
Kwon, Soonwook;
Cho, Chung-Suk;
Chung, Suwan

Publication type:

Article

Experimental Investigation of High-Viscosity Conductive Pastes and the Optimization of 3D Printing Parameters.

Published in:

Applied Sciences (2076-3417), 2023, v. 13, n. 4, p. 2389, doi. 10.3390/app13042389

By:

Zhang, Jinyu;
Wu, Shixiong;
Wang, Zedong;
Chen, Yuanfen;
You, Hui

Publication type:

Article

Influence of the Heat Transfer Process on the Electrical and Mechanical Properties of Flexible Silver Conductors on Textiles.

Published in:

Polymers (20734360), 2023, v. 15, n. 13, p. 2892, doi. 10.3390/polym15132892

By:

Raczyński, Tomasz;
Janczak, Daniel;
Szałapak, Jerzy;
Lepak-Kuc, Sandra;
Baraniecki, Dominik;
Muszyńska, Maria;
Kądziela, Aleksandra;
Wójkowska, Katarzyna;
Krzemiński, Jakub;
Jakubowska, Małgorzata

Publication type:

Article

A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance.

Published in:

Polymers (20734360), 2023, v. 15, n. 5, p. 1150, doi. 10.3390/polym15051150

By:

Wang, Zhenhe;
Wang, Dong;
Zhang, Chunbo;
Chen, Wei;
Meng, Qingjie;
Yuan, Hang;
Yang, Shiyong

Publication type:

Article

EFFECTS OF TRUST AND GOVERNANCE ON RELATIONAL RISK.

Published in:

Academy of Management Journal, 1997, v. 40, n. 2, p. 308, doi. 10.2307/256885

By:

NOOTEBOOM, BART;
BERGER, HANS;
NOORDERHAVEN, NIELS G.

Publication type:

Article

Potentials of using real-time data to increase the update frequency of production planning and control strategies in MTO: a discrete event simulation study.

Published in:

Flexible Services & Manufacturing Journal, 2024, v. 36, n. 3, p. 760, doi. 10.1007/s10696-024-09550-0

By:

Woschank, M.;
Dallasega, P.;
König, A.;
Hoffelner, M.

Publication type:

Article

The domestic content of Mexico's maquiladora exports: A long-run perspective.

Published in:

Journal of International Trade & Economic Development, 2018, v. 27, n. 2, p. 200, doi. 10.1080/09638199.2017.1353125

By:

Castillo, Juan Carlos;
de Vries, Gaaitzen

Publication type:

Article

8 英寸SiC 晶圆制备与外延应用.

Published in:

Journal of Synthetic Crystals, 2024, v. 53, n. 10, p. 1712

By:

韩景瑞;
李锡光;
李咏梅;
王垚浩;
张清纯;
李达;
施建新;
闫鸿磊;
韩跃斌;
丁雄杰

Publication type:

Article

Low‐Temperature Processible Highly Conducting Pastes for Printed Electronics Applications.

Published in:

Advanced Engineering Materials, 2022, v. 24, n. 9, p. 1, doi. 10.1002/adem.202101752

By:

Scenev, Vitalij;
Szalapak, Jerzy;
Werft, Lukas;
Hoelck, Ole;
Jakubowska, Malgorzata;
von Krshiwoblozki, Malte;
Kallmayer, Christine;
Schneider-Ramelow, Martin

Publication type:

Article

Additive Manufacturing of Electronics from Silver Nanopowders Sintered on 3D Printed Low-Temperature Substrates.

Published in:

Advanced Engineering Materials, 2021, v. 23, n. 4, p. 1, doi. 10.1002/adem.202001085

By:

Wałpuski, Bartłomiej;
Słoma, Marcin

Publication type:

Article

Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography.

Published in:

Advanced Engineering Materials, 2020, v. 22, n. 4, p. 1, doi. 10.1002/adem.201901250

By:

Lin, Yu-Chung;
Liu, Xiaoyang;
Chou, Kang Wei;
Tsai, Esther H. R.;
Zhao, Chonghang;
Holler, Mirko;
Diaz, Ana;
Petrash, Stanislas;
Chen-Wiegart, Yu-chen Karen

Publication type:

Article

Eutectic Additive Influence in the Li2O–B2O3 System on the Sintering Process and Properties of Li2MgTi3O8 Ceramics.

Published in:

Glass & Ceramics, 2024, v. 80, n. 11/12, p. 455, doi. 10.1007/s10717-024-00633-w

By:

Stolyarov, V. D.;
Shubabko, O. E.;
Vershinin, D. I.

Publication type:

Article

Li2Zn3Ti4O12 Low-Temperature Co-Fired Ceramic with Li2O–B2O3–SiO2 Additive.

Published in:

Glass & Ceramics, 2020, v. 77, n. 1/2, p. 43, doi. 10.1007/s10717-020-00234-3

By:

Vershinin, D. I.;
Khusainov, I. N.;
Makarov, N. A.

Publication type:

Article

A Novel Improved Grey Incidence Model for Evaluating the Performance of Supply Chain Resilience.

Published in:

Discrete Dynamics in Nature & Society, 2023, p. 1, doi. 10.1155/2023/2812467

By:

Huang, Feipeng

Publication type:

Article

Design and Synthesis of Functional Silane-Based Silicone Resin and Application in Low-Temperature Curing Silver Conductive Inks.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 6, p. 1137, doi. 10.3390/nano13061137

By:

Tang, Zhiqiang;
Liu, Yanxia;
Zhang, Yagang;
Sun, Zicai;
Huang, Weidong;
Chen, Zhikai;
Jiang, Xiaoli;
Zhao, Lin

Publication type:

Article

PCB Defect Detection Methods: A Review of Existing Methods and Potential Enhancements.

Published in:

Journal of Engineering Science & Technology Review, 2024, v. 17, n. 1, p. 156, doi. 10.25103/jestr.171.19

By:

Singh, Khushi;
Kharche, Shubhangi;
Chauhan, Aakash;
Salvi, Pranali

Publication type:

Article