Works matching DE "KIRKENDALL effect"

Results: 1595

Achieving Superplasticity in Ultrafine-Grained Mg-9Li Alloy via Dual-Phase Microstructure Optimization.

Published in:

Metals (2075-4701), 2025, v. 15, n. 5, p. 533, doi. 10.3390/met15050533

By:

Xu, Jiahao;
Gong, Xinyue;
Zhao, Wanxiang;
Sun, Chao;
Shan, Guibin;
Liu, Huan;
Song, Dan

Publication type:

Article

Study on Densification of Gd 2 Zr 2 O 7 -Based Ceramic Target for EB-PVD Application and Its Effect on Fracture Toughness.

Published in:

Coatings (2079-6412), 2025, v. 15, n. 5, p. 532, doi. 10.3390/coatings15050532

By:

Luo, Zhen;
Wang, Xingqi;
Liu, Yuyang;
Wang, Xingming

Publication type:

Article

Influencia del campo eléctrico de la frontera de grano sobre el borde de absorción en semiconductores policristalinos.

Published in:

Revista Cubana de Física, 2010, v. 27, n. 2B, p. 224

By:

Lukin, M. O'Reilly;
Iribarren, A.

Publication type:

Article

Heterogeneous Dual Hollow Spindles of Amorphous Fe2(MoO4)3@TiO2 as Anode Materials for Superior Lithium Storage: Heterogeneous Dual Hollow Spindles of Amorphous...: Q. Yang et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 2, p. 1029, doi. 10.1007/s11664-024-11619-3

By:

Yang, Qiuhe;
Hu, Zhenchun;
Yang, An;
Yuan, Y. F.

Publication type:

Article

Improving the Electrical and Mechanical Behavior of Printed Ag Microwires on Flexible Substrates by Applying High-Density Pulsed Electric Current.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 7858, doi. 10.1007/s11664-024-11482-2

By:

Weng, Guoqiang;
Sun, Quan;
Yang, Boxin;
Chen, Jianneng;
Lu, Yebo

Publication type:

Article

Hierarchical Cu2O/CuO/TiO2 composite films with high superhydrophobicity and strong adhesion.

Published in:

Surface Engineering, 2021, v. 37, n. 10, p. 1223, doi. 10.1080/02670844.2021.1873899

By:

Zeng, Chunyan;
Wang, Yong;
Gao, Chen;
Liu, Yi

Publication type:

Article

Analytical-experimental approach for accurate depth profile evaluation of diffusion zone in plasma nitrided iron.

Published in:

Surface Engineering, 2011, v. 27, n. 4, p. 259, doi. 10.1179/174329409X439069

By:

Hosseini, S R;
Ashrafizadeh, F;
Kermanpur, A

Publication type:

Article

Processing and microstructure of NiRuAl diffusion barrier coating on Ni-based superalloy.

Published in:

Surface Engineering, 2011, v. 27, n. 4, p. 253, doi. 10.1179/174329409X446359

By:

Wang, Y;
Guo, H-B;
Peng, L-Q;
Gong, S-K

Publication type:

Article

Chalcogen‐Expanded Unsaturated Silicon Clusters: Thia‐, Selena‐, and Tellurasiliconoids.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 70, p. 16599, doi. 10.1002/chem.202003180

By:

Poitiers, Nadine E.;
Huch, Volker;
Zimmer, Michael;
Scheschkewitz, David

Publication type:

Article

Electrolytic Formation of Crystalline Silicon/Germanium Alloy Nanotubes and Hollow Particles with Enhanced Lithium-Storage Properties.

Published in:

Angewandte Chemie, 2016, v. 128, n. 26, p. 7553, doi. 10.1002/ange.201602653

By:

Xiao, Wei;
Zhou, Jing;
Yu, Le;
Wang, Dihua;
Lou, Xiong Wen (David)

Publication type:

Article

Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13757, doi. 10.1007/s10854-019-01758-3

By:

El-Daly, A. A.;
Zohdy, K. M.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12840, doi. 10.1007/s10854-019-01729-8

By:

Du, Yahong;
Wen, Ming;
Ji, Hongjun;
Li, Mingyu;
Liu, Zhi-Quan

Publication type:

Article

Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12860, doi. 10.1007/s10854-019-01601-9

By:

Du, Cheng-Jie;
Li, Xin;
Mei, Yun-Hui;
Lu, Guo-Quan

Publication type:

Article

Growth behavior of intermetallic compounds in Fe/Sn diffusion couples.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12639, doi. 10.1007/s10854-019-01627-z

By:

Wang, Xiyu;
Li, Deyu;
Li, Ning;
Wang, Rui

Publication type:

Article

Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9410, doi. 10.1007/s10854-019-01271-7

By:

Zhang, Xudong;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Qinglin;
Zhou, Liuru

Publication type:

Article

Influence of La3+ and V5+ doping on the polarization and impedance behaviour of BaBi2Nb2O9 nano-ceramics prepared by chemical route.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 7065, doi. 10.1007/s10854-019-01023-7

By:

Khatun, Julekha;
Adak, Mrinal K.;
Dhak, Prasanta;
Ghorai, Uttam K.;
Dhak, Debasis

Publication type:

Article

Surface grain boundary passivation via mixed antisolvent and PC61BM assistant for stable perovskite solar cells.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3511, doi. 10.1007/s10854-018-00628-8

By:

Mao, Hanying;
Huang, Yuelong;
Ma, Zhu;
Jin, Lifen;
Tian, Liuwen;
Li, Yuepeng;
Yu, Hua;
Peng, Changtao

Publication type:

Article

Investigation of charge transport mechanism in semiconducting La0.5Ca0.5Mn0.5Fe0.5O3 manganite prepared by sol-gel method.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 16, p. 13577, doi. 10.1007/s10854-018-9485-2

By:

Khan, Ayaz Arif;
Fayaz, Muhammad Umer;
Khan, Muhammad Nasir;
Iqbal, Mazhar;
Majeed, Asif;
Bilkees, Rehana;
Mukhtar, Surayya;
Javed, Muhammad

Publication type:

Article

Robust tuning of Kirkendall void density in circuit interconnections through substrate strain annealing.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8287, doi. 10.1007/s10854-018-8837-2

By:

Cai, Chongyang;
An, Rong;
Wang, Chunqing;
Tian, Yanhong;
Ji, Xiaoliang

Publication type:

Article

Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic compounds and the Kirkendall voids in the Cu-Sn system.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 22, p. 17014, doi. 10.1007/s10854-017-7624-9

By:

Baheti, Varun;
Kumar, Praveen;
Paul, Aloke

Publication type:

Article

Effect of annealing temperature on properties of molybdenum disulfide thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 21, p. 16148, doi. 10.1007/s10854-017-7515-0

By:

Kite, S.;
Chate, P.;
Garadkar, K.;
Sathe, D.

Publication type:

Article

Transgranular region preference of crack propagation along Bi-2212 crystal structure due to Au nanoparticle diffusion and modeling of new systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 12839, doi. 10.1007/s10854-017-7111-3

By:

Zalaoglu, Y.;
Akkurt, B.;
Oz, M.;
Yildirim, G.

Publication type:

Article

Enhanced grain size effect on electrical characteristics of fine-grained BaTiO ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 13229, doi. 10.1007/s10854-017-7158-1

By:

Shi, Yu;
Pu, Yongping;
Cui, Yongfei;
Luo, Yanjie

Publication type:

Article

Structural and electrical properties of lead reduced lanthanum modified BiFeO-PbTiO solid solution.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 1186, doi. 10.1007/s10854-016-5645-4

By:

Pradhan, S.;
Das, S.;
Bhuyan, S.;
Behera, C.;
P Choudhary, R.

Publication type:

Article

Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 13022, doi. 10.1007/s10854-016-5443-z

By:

Li, W.;
Jin, H.;
Yue, W.;
Tan, M.;
Zhang, X.

Publication type:

Article

Improved output power and low forward voltage for GaN-based light emitting diodes with an annealed ITO transparent conducting layer.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6265, doi. 10.1007/s10854-016-4558-6

By:

Lin, Yen-Sheng;
Li, Ching;
Chang, Yu-Cheng;
Tseng, Chun-Lung;
Shen, Ching-Hsing

Publication type:

Article

Effect of sintering temperature on the dielectric and varistor properties of SnO-ZnSnO composite ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2242, doi. 10.1007/s10854-015-4017-9

By:

Liu, Huan-Huan;
Li, Li-Ben;
Zang, Guo-Zhong;
Wang, Xiao-Fei;
Zuo, Zheng-Wei

Publication type:

Article

Oxygen diffusion in germanium: interconnecting point defect parameters with bulk properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7378, doi. 10.1007/s10854-015-3367-7

By:

Chroneos, A.;
Vovk, R.

Publication type:

Article

Effect of alloying Cu substrate on microstructure and coarsening behavior of CuSn grains of soldered joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2782, doi. 10.1007/s10854-015-2759-z

By:

Yu, Xiao;
Hu, Xiaowu;
Li, Yulong;
Zhang, Ruhua

Publication type:

Article

Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 936, doi. 10.1007/s10854-013-1667-3

By:

Hu, Xiaowu;
Ke, Zunrong

Publication type:

Article

Microstructure and dielectric properties of CaBiCuTiO ( x = 0, 0.05, 0.10, 0.15 and 0.20) ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 817, doi. 10.1007/s10854-013-1651-y

By:

Xu, L.;
Cheng, T.;
Wang, R.;
Xiao, H.;
Liu, G.;
Yang, C.

Publication type:

Article

Interdiffusion study in the Pd-Pt system.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 8, p. 2833, doi. 10.1007/s10854-013-1179-1

By:

Baheti, Varun;
Ravi, Raju;
Paul, Aloke

Publication type:

Article

Study on important diffusion parameters of binary NiSn phase.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 7, p. 2558, doi. 10.1007/s10854-013-1133-2

By:

Ghosh, C.

Publication type:

Article

Diffusion and growth mechanism of phases in the Pd-Sn system.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2306, doi. 10.1007/s10854-012-0832-4

By:

Ravi, Raju;
Paul, Aloke

Publication type:

Article

Two-step sintering and electrical properties of sol-gel derived 0.94(BiNa)TiO-0.06BaTiO lead-free ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 12, p. 1841, doi. 10.1007/s10854-011-0371-4

By:

Meng, Weiqing;
Zuo, Ruzhong;
Su, Shi;
Wang, Xiaohui;
Li, Longtu

Publication type:

Article

Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1308, doi. 10.1007/s10854-011-0305-1

By:

Han-Byul Kang;
Jee-Hwan Bae;
Jeong-Won Yoon;
Seung-Boo Jung;
Jongwoo Park;
Cheol-Woong Yang

Publication type:

Article

Growth mechanism of phases, Kirkendall voids, marker plane position, and indication of the relative mobilities of the species in the interdiffusion zone.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 833, doi. 10.1007/s10854-010-0220-x

By:

Paul, A.

Publication type:

Article

Formation and behavior of Kirkendall voids within intermetallic layers of solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 703, doi. 10.1007/s10854-011-0357-2

By:

Doosoo Kim;
Jong-hyeon Chang;
Jungil Park;
Pak, James Jungo

Publication type:

Article

Spectroscopic studies of O-vacancy defects in transition metal oxides.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, p. 263, doi. 10.1007/s10854-007-9192-x

By:

Lucovsky, G.;
Lüning, J.;
Fleming, L.;
Ulrich, M. D.;
Rowe, J. E.;
Seo, H.;
Lee, S.;
Lysaght, P.;
Bersuker, G.

Publication type:

Article

Comparative Analysis of Foundation Systems in Expansive Soil: A Three-Dimensional Model Approach to Moisture Diffusion and Volume Changes.

Published in:

Geotechnical & Geological Engineering, 2024, v. 42, n. 8, p. 7935, doi. 10.1007/s10706-024-02959-2

By:

Alnmr, Ammar;
Ray, Richard;
Alzawi, Mounzer Omran

Publication type:

Article

Non-quadratic defect energy: A comparison of gradient plasticity simulations to discrete dislocation dynamics results.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2016, v. 16, n. 1, p. 301, doi. 10.1002/pamm.201610139

By:

Bayerschen, Eric;
Stricker, Markus;
Weygand, Daniel;
Böhlke, Thomas

Publication type:

Article

Large Strain Gradient Plasticity Theory with a Discontinuous Grain Boundary Yield Condition.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2016, v. 16, n. 1, p. 329, doi. 10.1002/pamm.201610153

By:

Erdle, Hannes;
Bayerschen, Eric;
Böhlke, Thomas

Publication type:

Article

Micromechanical Simulation of the Hall-Petch Effect with a Crystal Gradient Theory including a Grain Boundary Yield Criterion.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2013, v. 13, n. 1, p. 15, doi. 10.1002/pamm.201310005

By:

Wulfinghoff, Stephan;
Bayerschen, Eric;
Böhlke, Thomas

Publication type:

Article

The role of hippocampal subfield volume and fornix microstructure in episodic memory across the lifespan.

Published in:

Hippocampus, 2019, v. 29, n. 12, p. 1206, doi. 10.1002/hipo.23133

By:

Foster, Chris M.;
Kennedy, Kristen M.;
Hoagey, David A.;
Rodrigue, Karen M.

Publication type:

Article

Hindered diffusion of heavy metal cations in the adsorption rate on activated carbon fiber.

Published in:

Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2023, v. 196, p. 556, doi. 10.1016/j.cherd.2023.07.005

By:

Valdez-García, Genesis Derith;
Leyva-Ramos, Roberto

Publication type:

Article

Spouted fluidised bed reactor for kinetic measurements of the reduction of Fe2O3 in a CO/ CO2 atmosphere part II: An extended random pore model for solid-state diffusion.

Published in:

Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2023, v. 194, p. 597, doi. 10.1016/j.cherd.2023.04.054

By:

Zhang, Zili;
Wong, Jasper J.;
Scott, Stuart A.;
Fennell, Paul S.

Publication type:

Article

Highly accurate and numerical tractable coupling of nanoparticle nucleation, growth and fluid flow.

Published in:

Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2023, v. 190, p. 814, doi. 10.1016/j.cherd.2022.12.029

By:

Bänsch, Eberhard;
Pflug, Lukas;
Schikarski, Tobias

Publication type:

Article

Optimization of the cathode porosity via mechanochemical synthesis with carbon black.

Published in:

Journal of Solid State Electrochemistry, 2021, v. 25, n. 3, p. 1029, doi. 10.1007/s10008-020-04877-8

By:

Kosova, Nina V.;
Podgornova, Olga A.;
Volfkovich, Yury M.;
Sosenkin, Valentin E.

Publication type:

Article

One-pot electrosynthesis and physicochemical properties of multifunctional material based on graphene oxide, poly-o-phenylenediamine, and silicotungstic acid.

Published in:

Journal of Solid State Electrochemistry, 2021, v. 25, n. 3, p. 859, doi. 10.1007/s10008-020-04859-w

By:

Pisarevskaya, E. Yu.;
Klyuev, A. L.;
Averin, A. A.;
Gorbunov, A. M.;
Efimov, O. N.

Publication type:

Article

Grain boundary passivation studied by in situ scanning tunneling microscopy on microcrystalline copper.

Published in:

Journal of Solid State Electrochemistry, 2015, v. 19, n. 12, p. 3501, doi. 10.1007/s10008-015-2787-x

By:

Chen, Hu;
Maurice, Vincent;
Klein, Lorena;
Lapeire, Linsey;
Verbeken, Kim;
Terryn, Herman;
Marcus, Philippe

Publication type:

Article