Works matching DE "SILICON nitride"

Results: 2204

Integrated Photonic Biosensors: Enabling Next-Generation Lab-on-a-Chip Platforms.

Published in:

Nanomaterials (2079-4991), 2025, v. 15, n. 10, p. 731, doi. 10.3390/nano15100731

By:

Butt, Muhammad A.;
Imran Akca, B.;
Mateos, Xavier

Publication type:

Article

Investigation of Gas Sensing Performance of CuO/Cu 2 O Thin Films as a Function of Au-NP Size for CO, CO 2 , and Hydrocarbons Mixtures.

Published in:

Nanomaterials (2079-4991), 2025, v. 15, n. 10, p. 705, doi. 10.3390/nano15100705

By:

Maier, Christian;
Egger, Larissa;
Köck, Anton;
Becker, Sören;
Niehaus, Jan Steffen;
Reichmann, Klaus

Publication type:

Article

Solid-State Nanopore Readout of Programmable DNA and Peptide Nanostructures for Scalable Digital Data Storage.

Published in:

Biosensors (2079-6374), 2025, v. 15, n. 5, p. 287, doi. 10.3390/bios15050287

By:

Zhao, Lihuan;
Wang, Jiajun;
Wu, Lin-Sheng;
Zhao, Xin

Publication type:

Article

Sputter films: Targeting SiN with pure Si and an S-Gun.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 26

By:

Vogler, Debra

Publication type:

Article

Solutions for the 100nm node with ultrathin silicon nitride gates.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 75

By:

Levy, Sagy;
Boom, Robin;
Lam, James;
Kepten, Avishai

Publication type:

Article

A low-temperature solution for silicon nitride deposition.

Published in:

Solid State Technology, 2000, v. 43, n. 4, p. 79

By:

Laxman, Ravi K.;
Anderson, Timothy D.;
Mestemacher, John A.

Publication type:

Article

Synthesis of MWCNTs/Si3N4 Nanocomposites Via Click Chemistry and Electromagnetic Wave-Absorption Properties.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 2, p. 1228, doi. 10.1007/s11664-024-11601-z

By:

Ji, Xiaoli;
Chen, Fan;
Liu, Jian;
Ma, Qianqian;
Qiao, Ruochen;
Xu, Zhihao

Publication type:

Article

Dispersion-Engineered SiN-Coated TeO2 Hybrid Waveguide for Nonlinear Applications.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5212, doi. 10.1007/s11664-024-11228-0

By:

Kanika;
Jaggi, Neena;
Saini, Than Singh

Publication type:

Article

Microstructure and properties of CPED thermal protective ceramic coating toughened by ZrO2 nanorods on Al–Si alloy.

Published in:

Surface Engineering, 2021, v. 37, n. 8, p. 1043, doi. 10.1080/02670844.2021.1908738

By:

Wang, Ping;
Ma, Qun;
Chen, Xiaomin;
Zhang, Chunqing

Publication type:

Article

Tribological Behaviour of Plasma and HVOF-sprayed NiCrSiBFe Coatings.

Published in:

Surface Engineering, 2020, v. 36, n. 7, p. 745, doi. 10.1080/02670844.2020.1730062

By:

Rukhande, Sanjay W.;
Rathod, W. S.

Publication type:

Article

Delamination of diamond-like carbon films on rough Si3N4 surfaces.

Published in:

Surface Engineering, 2020, v. 36, n. 7, p. 770, doi. 10.1080/02670844.2019.1688015

By:

Shu, Kun;
Zhang, Chuanwei;
Zheng, Dezhi;
Gu, Le;
Wang, Liqin

Publication type:

Article

Rapid Thermal Process for Crystallization Silicon Nitride Films.

Published in:

Surface Engineering, 2020, v. 36, n. 5, p. 456, doi. 10.1080/02670844.2018.1564199

By:

Meziani, Samir;
Moussi, Aberrahmane;
Mahiou, Linda;
Antoni, Frederic;
Outemzabet, Ratiba

Publication type:

Article

Comparative study on structure and properties of ZnO thin films prepared by RF magnetron sputtering using pure metallic Zn target and ZnO ceramic target.

Published in:

Surface Engineering, 2020, v. 36, n. 1, p. 49, doi. 10.1080/02670844.2018.1555214

By:

Ye, Wei;
Fang, Kun

Publication type:

Article

Ultra-high-density silicon nanocone arrays with sharp tips by Ar+ sputtering at low temperature.

Published in:

Surface Engineering, 2019, v. 35, n. 1, p. 54, doi. 10.1080/02670844.2018.1454997

By:

Wang, Hongjun;
Li, Qintao;
Wu, Xiujuan

Publication type:

Article

Influences of different reinforcement particles on performances of electroless composites.

Published in:

Surface Engineering, 2017, v. 33, n. 5, p. 362, doi. 10.1080/02670844.2016.1230975

By:

Hu, J.;
Fang, L.;
Liao, X.-L.;
Shi, L.-T.

Publication type:

Article

Deposition of Ti-Si-N films on Al substrates by magnetron sputtering.

Published in:

Surface Engineering, 2013, v. 29, n. 10, p. 749, doi. 10.1179/1743294413Y.0000000178

By:

Pang, J.;
Bai, Y.;
Qin, F.;
Pan, L.;
Zhao, Y.;
Kang, R.

Publication type:

Article

Laser treatment of silicon at nitrogen ambient: thermal stress analysis.

Published in:

Surface Engineering, 2011, v. 27, n. 6, p. 436, doi. 10.1179/174329409X409495

By:

Yilbas, B S;
Arif, A F M;
Karatas, C

Publication type:

Article

Monitoring of plasma processing chamber using ion energy analyser and time series neural network.

Published in:

Surface Engineering, 2010, v. 26, n. 3, p. 224, doi. 10.1179/174329409X455449

By:

Kim, B.;
Kim, S.

Publication type:

Article

Study on nanomechanical and high temperature tribological behaviour of Ti2AlNb based alloys by plasma surface alloying.

Published in:

Surface Engineering, 2008, v. 24, n. 6, p. 464, doi. 10.1179/026708408X336373

By:

Wu, H. Y.;
Zhang, P. Z.;
Xu, Z.

Publication type:

Article

Prediction of radio frequency power effect on silicon nitride deposition using a genetic algorithm based neural network.

Published in:

Surface Engineering, 2006, v. 22, n. 1, p. 63, doi. 10.1179/174329406X84985

By:

Kim, B.;
Bae, J.;
Han, S. S.

Publication type:

Article

Tailored Si[sub 3]N[sub 4] Ceramic Substrates for CVD Diamond Coating.

Published in:

Surface Engineering, 2003, v. 19, n. 6, p. 410, doi. 10.1179/026708403225010136

By:

Amaral, M.;
Oliveira, F. J.;
Belmonte, M.;
Fernandes, A. J. S.;
Costa, F. M.;
Silva, R. F.

Publication type:

Article

Porous Si‐Cu3Si‐Cu Microsphere@C Core–Shell Composites with Enhanced Electrochemical Lithium Storage.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 27, p. 6006, doi. 10.1002/chem.201904995

By:

Pei, Shien;
Guo, Jianfeng;
He, Zhishun;
Huang, Liang‐ai;
Lu, Tongzhou;
Gong, Junjie;
Shao, Haibo;
Wang, Jianming

Publication type:

Article

A Novel High‐Pressure Tin Oxynitride Sn2N2O.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 10, p. 2187, doi. 10.1002/chem.201904529

By:

Bhat, Shrikant;
Wiehl, Leonore;
Haseen, Shariq;
Kroll, Peter;
Glazyrin, Konstantin;
Gollé‐Leidreiter, Philipp;
Kolb, Ute;
Farla, Robert;
Tseng, Jo‐Chi;
Ionescu, Emanuel;
Katsura, Tomoo;
Riedel, Ralf

Publication type:

Article

Solid Solutions of Grimm–Sommerfeld Analogous Nitride Semiconductors II‐IV‐N2 (II=Mg, Mn, Zn; IV=Si, Ge): Ammonothermal Synthesis and DFT Calculations.

Published in:

Chemistry - A European Journal, 2019, v. 25, n. 69, p. 15887, doi. 10.1002/chem.201903897

By:

Mallmann, Mathias;
Niklaus, Robin;
Rackl, Tobias;
Benz, Maximilian;
Chau, Thanh G.;
Johrendt, Dirk;
Minár, Ján;
Schnick, Wolfgang

Publication type:

Article

Processing, phase analysis and microwave dielectric properties of Sr5−xBixTi1+xNb4−xO17 (x = 4, 3) ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18432, doi. 10.1007/s10854-019-02197-w

By:

Manan, Abdul;
Khan, Arshad;
Ullah, Atta;
Ahmad, Arbab Safeer;
Wazir, Arshad Hussain;
Iqbal, Javed;
Ullah, Mati

Publication type:

Article

Enhanced photoelectrochemical cathodic protection performance of g-C3N4 caused by the co-modification with N defects and C deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15267, doi. 10.1007/s10854-019-01899-5

By:

Zhang, Qingji;
Jing, Jiangping;
Chen, Zhuoyuan;
Sun, Mengmeng;
Li, Jiarun;
Li, Yan;
Xu, Likun

Publication type:

Article

Avoidance of boron rich layer formation in the industrial boron spin-on dopant diffused n-type silicon solar cell without additional oxidation process.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 23, p. 20081, doi. 10.1007/s10854-018-0139-1

By:

Yang, Ning;
Li, Shizheng;
Yang, Jinlin;
Li, Hongbo;
Ye, Xiaojun;
Liu, Cui;
Yuan, Xiao

Publication type:

Article

Reduction of leakage current at the SiNx/GaN interface in GaN Schottky diodes.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19353, doi. 10.1007/s10854-018-0064-3

By:

Kolli, Sowmya;
Sunkara, Mahendra;
Alphenaar, Bruce

Publication type:

Article

Thermal-cycling-induced surface roughening and structural change of a metal layer bonded to silicon nitride by active metal brazing.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 16, p. 12168, doi. 10.1007/s10854-017-7031-2

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Iwakiri, Shoji;
Hirao, Kiyoshi

Publication type:

Article

Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8278, doi. 10.1007/s10854-017-6541-2

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Hirao, Kiyoshi;
Iwakiri, Shoji

Publication type:

Article

Erratum to: Size-controlled Si quantum dots embedded in B-doped SiN/SiN superlatice for Si quantum dot solar cells.

Published in:

2017

By:

Chen, Xiaobo;
Yang, Wen;
Yang, Peizhi;
Yuan, Junbao;
Zhao, Fei;
Hao, Jiabo;
Tang, Yu

Publication type:

Erratum

Improvements of epitaxial quality and stress state of GaN grown on SiC by in situ SiN interlayer.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10003, doi. 10.1007/s10854-016-5071-7

By:

Huang, Zhen;
Zhang, Yuantao;
Deng, Gaoqiang;
Li, Baozhu;
Cui, Shuang;
Liang, Hongwei;
Chang, Yuchun;
Song, Junfeng;
Zhang, Baolin;
Du, Guotong

Publication type:

Article

Temperature dependence of Raman spectra of graphene on copper foil substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3888, doi. 10.1007/s10854-015-4238-y

By:

Wang, Weihui;
Peng, Qing;
Dai, Yiquan;
Qian, Zhengfang;
Liu, Sheng

Publication type:

Article

Dielectric substrate effect on the temperature-dependent electrical properties of pentacene films.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2579, doi. 10.1007/s10854-015-2726-8

By:

Lin, Yow-Jon;
Tsao, Hou-Yen;
Liu, Day-Shan

Publication type:

Article

Effects of temperature and strain rate on fracture properties of amorphous silicon nitride.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 9, p. 1346, doi. 10.1007/s10854-011-0311-3

By:

Ningbo Liao;
Xi Tao;
Miao Zhang;
Wei Xue

Publication type:

Article

SEM and specific contact resistance analysis of screen-printed Ag contacts formed by fire-through process on the shallow emitters of silicon solar cell.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 10, p. 1026, doi. 10.1007/s10854-008-9815-x

By:

Vinod, P. N.

Publication type:

Article

Optical properties of undoped and oxygen doped CuCl films on silicon substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, p. 76, doi. 10.1007/s10854-007-9448-5

By:

Danieluk, Dominik;
Bradley, Ann L.;
Mitra, Anirban;
O'Reilly, Lisa;
Lucas, Olibanji F.;
Cowley, Aidan;
McNally, Patrick J.;
Foy, Barry;
McGlynn, Enda

Publication type:

Article

Optical characterisation of silicon nitride thin films grown by novel remote plasma sputter deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, p. 285, doi. 10.1007/s10854-007-9513-0

By:

Claudio, Gianfranco;
Calnan, Sonya;
Bass, Kevin;
Boreland, Matt

Publication type:

Article

Tunneling currents through ultra thin HfO2/Al2O3/HfO2 triple layer gate dielectrics for advanced MIS devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 902, doi. 10.1007/s10854-008-9679-0

By:

Tyagi, Hitender Kumar;
George, P. J.

Publication type:

Article

Influence of a SiN mask on GaN layer by metalorganic chemical vapor deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 471, doi. 10.1007/s10854-007-9365-7

By:

Deok Kyu Kim

Publication type:

Article

Modeling vacancy injection from the silicon/silicon-nitride interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 4, p. 323, doi. 10.1007/s10854-007-9321-6

By:

Hasanuzzaman, Mohammad;
Haddara, Yaser M.

Publication type:

Article

Deposition of luminescent a-SiN x :H Films with SiH4–N2 gas mixture by VHF–PECVD using novel impedance matching method.

Published in:

Journal of Materials Science: Materials in Electronics, 2007, v. 18, p. 29, doi. 10.1007/s10854-007-9181-0

By:

Kobayashi, S.;
Ohrui, N.;
Chao, Y. C.;
Aoki, T.;
Kobayashi, H.;
Asakawa, T.

Publication type:

Article

Synthesis and mechanical properties of 40 wt%BAS/Si3N4 ceramic composites.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 12, p. 895, doi. 10.1023/A:1024479107007

By:

Feng Ye;
Sheng Chen;
Iwasa, M.

Publication type:

Article

Nano-opto-mechanical characterization of neuron membrane mechanics under cellular growth and differentiation.

Published in:

Biomedical Microdevices, 2008, v. 10, n. 5, p. 611, doi. 10.1007/s10544-008-9172-9

By:

Ashwini Gopal;
Zhiquan Luo;
Jae Lee;
Karthik Kumar;
Bin Li;
Kazunori Hoshino;
Christine Schmidt;
Paul Ho;
Xiaojing Zhang

Publication type:

Article

Macroscopic damage modeling for silicon nitride.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2015, v. 15, n. 1, p. 147, doi. 10.1002/pamm.201510064

By:

Ruck, Johannes;
Othmani, Yamen;
Lube, Tanja;
Khader, Iyas;
Kailer, Andreas;
Böhlke, Thomas

Publication type:

Article

Study of the separation of yeast by microsieves: In situ 3D characterization of the cake using confocal laser scanning microscopy.

Published in:

Food & Bioproducts Processing: Transactions of the Institution of Chemical Engineers Part C, 2014, v. 92, n. 2, p. 178, doi. 10.1016/j.fbp.2013.12.012

By:

Hassan, Ines Ben;
Lafforgue, Christine;
Ayadi, Abdelmonem;
Schmitz, Philippe

Publication type:

Article

Estimation Technique for the Edge Chipping Resistance of Brittle Materials.

Published in:

Strength of Materials, 2023, v. 55, n. 2, p. 302, doi. 10.1007/s11223-023-00525-4

By:

Galenko, V. Y.;
Khvorostyanyi, V. V.

Publication type:

Article

Influence of Yag Concentration and Pressing Time on Wear of Si3N4 Based Ceramics.

Published in:

Strength of Materials, 2021, v. 53, n. 6, p. 950, doi. 10.1007/s11223-022-00363-w

By:

Brusilová, A.;
Gábrišová, Z.;
Švec, P.;
Schrek, A.

Publication type:

Article

Fracture of Ceramics with Different Conical Indenters: Edge Chipping.

Published in:

Strength of Materials, 2016, v. 48, n. 5, p. 610, doi. 10.1007/s11223-016-9804-x

By:

Gogotsi, G.

Publication type:

Article

Investigation on the Microcracking of Ceramic Materials Using the Acoustic Emission Method.

Published in:

Strength of Materials, 2014, v. 46, n. 1, p. 71, doi. 10.1007/s11223-014-9517-y

By:

Drozdov, A.

Publication type:

Article