If it ain't broken, you're very lucky.
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- Electronics Systems & Software, 2005, v. 3, n. 3, p. 12, doi. 10.1049/ess:20050301
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Works matching DE "ELECTRODIFFUSION"
Results: 670
1
2
On the Nernst-Planck equation.
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- Journal of Integrative Neuroscience, 2017, v. 16, n. 1, p. 73, doi. 10.3233/JIN-170008
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3
A comparison of computational models for the extracellular potential of neurons.
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- Journal of Integrative Neuroscience, 2017, v. 16, n. 1, p. 19, doi. 10.3233/JIN-170009
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4
Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10124-3
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5
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09646-z
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6
Formation mechanism and reliability of preferred growth full Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compound interconnect on (011) Cu single-crystal substrate.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25274, doi. 10.1007/s10854-022-09234-1
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7
Detrimental angle range between c axis of Sn crystal and electron flow for the electromigration reliability of ball grid array devices.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17877, doi. 10.1007/s10854-022-08651-6
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8
Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14240, doi. 10.1007/s10854-022-08352-0
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9
Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10297, doi. 10.1007/s10854-022-08018-x
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10
Long-term electrically stable silver nanowire composite transparent electrode under high current density.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 20919, doi. 10.1007/s10854-021-06386-4
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11
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17336, doi. 10.1007/s10854-021-06256-z
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12
Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22966, doi. 10.1007/s10854-020-04824-3
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13
The role of a nonconductive film (NCF) on Cu/Ni/Sn-Ag microbump interconnect reliability.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 18, p. 15530, doi. 10.1007/s10854-020-04115-x
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14
Electromigration behavior of Cu/Sn–58Bi–1Ag/Cu solder joints by ultrasonic soldering process.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 15, p. 11997, doi. 10.1007/s10854-020-03817-6
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15
Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 2967, doi. 10.1007/s10854-019-02840-6
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16
Phase separation mechanism and property changes in In–41Sn–9Zn under the current stressing.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11676, doi. 10.1007/s10854-019-01526-3
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17
Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7645, doi. 10.1007/s10854-019-01080-y
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18
Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 6224, doi. 10.1007/s10854-019-00925-w
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19
Effects of graphene oxide on the electromigration lifetime of lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2334, doi. 10.1007/s10854-018-0506-y
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20
Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn-58Bi solder.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1907, doi. 10.1007/s10854-018-0464-4
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21
Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 21157, doi. 10.1007/s10854-018-0264-x
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22
IMC growth behavior along c-axis of Sn grain under current stressing.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 13180, doi. 10.1007/s10854-018-9442-0
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23
Interfacial evolution in Sn-58Bi solder joints during liquid electromigration.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 8895, doi. 10.1007/s10854-018-8907-5
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24
Recrystallized grain rotation behavior in a Pb-free BGA solder joint under electron current stress.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6266, doi. 10.1007/s10854-018-8604-4
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25
Effects of Sn grain <italic>c-</italic>axis on electromigration in Cu reinforced composite solder joints.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 7, p. 5954, doi. 10.1007/s10854-018-8568-4
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26
Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 3182, doi. 10.1007/s10854-017-8252-0
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27
Effect of interfacial dissolution on electromigration failures at metals interface.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 20, p. 15149, doi. 10.1007/s10854-017-7391-7
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28
Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn-0.7Cu joint at low current density.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 17, p. 12630, doi. 10.1007/s10854-017-7087-z
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29
Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10785, doi. 10.1007/s10854-017-6952-0
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30
Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM).
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 12, p. 8717, doi. 10.1007/s10854-017-6596-0
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31
Electromigration reliability for AlO-reinforced Cu/Sn-58Bi/Cu composite solder joints.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 3, p. 3004, doi. 10.1007/s10854-016-5886-2
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32
Recent progress of Sn-Ag-Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 12729, doi. 10.1007/s10854-016-5407-3
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33
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11583, doi. 10.1007/s10854-016-5289-4
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34
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9748, doi. 10.1007/s10854-016-5038-8
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35
Ferroelectric and flexible barrier resistive switching of epitaxial BiFeO films studied by temperature-dependent current and capacitance spectroscopy.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 8, p. 7927, doi. 10.1007/s10854-016-4784-y
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36
Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 6835, doi. 10.1007/s10854-016-4635-x
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37
On the thickness of CuSn compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 7699, doi. 10.1007/s10854-016-4756-2
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38
Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3710, doi. 10.1007/s10854-015-4212-8
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39
Electromigration in reduced-height solder joints with Cu pillars.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3715, doi. 10.1007/s10854-015-4213-7
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40
Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 2, p. 1105, doi. 10.1007/s10854-015-3858-6
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41
Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 781, doi. 10.1007/s10854-015-3817-2
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42
Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 11, p. 8522, doi. 10.1007/s10854-015-3524-z
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43
Reliability and failure mechanism of copper pillar joints under current stressing.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7690, doi. 10.1007/s10854-015-3410-8
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44
Influence of the aggregated AgSn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 5129, doi. 10.1007/s10854-015-3040-1
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45
Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2674, doi. 10.1007/s10854-015-2736-6
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46
Size effect on tensile properties of Cu/Sn-9Zn/Cu solder interconnects under aging and current stressing.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2278, doi. 10.1007/s10854-015-2681-4
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47
Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 2, p. 933, doi. 10.1007/s10854-014-2485-y
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48
Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 211, doi. 10.1007/s10854-012-0714-9
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49
Electro-transport and structure of 1-2-3 HTSC single crystals with different plane defects topologies.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1255, doi. 10.1007/s10854-011-0582-8
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50
Formation and behavior of Kirkendall voids within intermetallic layers of solder joints.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 703, doi. 10.1007/s10854-011-0357-2
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