Works matching DE "INTERMETALLIC compounds"

Results: 4306

First-Principles Calculations of Plasmon-Induced Hot Carrier Properties of μ-Ag 3 Al.

Published in:

Nanomaterials (2079-4991), 2025, v. 15, n. 10, p. 761, doi. 10.3390/nano15100761

By:

Zhao, Zihan;
Ren, Hai;
Wang, Yucheng;
Ma, Xiangchao;
Jiang, Jiali;
Wei, Linfang;
Liu, Delian

Publication type:

Article

Effect of Laser Welding Parameters on Similar and Dissimilar Joints for Tab–Busbar Interconnects.

Published in:

Metals (2075-4701), 2025, v. 15, n. 5, p. 547, doi. 10.3390/met15050547

By:

Taboada, Mari Carmen;
Chludzinski, Mariane;
Gómez, Raul;
Aldanondo, Egoitz

Publication type:

Article

Realization of a Novel FeSiAlCuSn Multicomponent Alloy and Characterization of Intermetallic Phases Formed at Different Temperatures During Cooling.

Published in:

Metals (2075-4701), 2025, v. 15, n. 5, p. 479, doi. 10.3390/met15050479

By:

Padhamnath, Pradeep;
Kuśmierczyk, Filip;
Kopyściański, Mateusz;
Gondek, Łukasz;
Migas, Piotr;
Karbowniczek, Mirosław

Publication type:

Article

Microscopic Mechanisms of Plastic Deformation in Ti3Pt.

Published in:

Journal of Materials Science & Engineering (1673-2812), 2025, v. 43, n. 2, p. 187, doi. 10.14136/j.cnki.issn1673-2812.2025.02.003

By:

QI Xu;
YU Qian

Publication type:

Article

Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C.

Published in:

Materials (1996-1944), 2025, v. 18, n. 10, p. 2379, doi. 10.3390/ma18102379

By:

Wang, Chao-Hong;
Li, Yue-Han

Publication type:

Article

Сучасні методи нейтралізації неґативного впливу домішок Феруму на властивості заевтектичних Al–Si-стопів.

Published in:

Metallophysics & Advanced Technologies / Metallofizika i Novejsie Tehnologii, 2025, v. 47, n. 4, p. 377, doi. 10.15407/mfint.47.04.0377

By:

Цір, Т. Г.;
Шеневидько, К. Л.

Publication type:

Article

Special Issue on Development and Functionality of Titanium and Its Alloys as Structural, Biocompatible, and Energy Materials.

Published in:: Materials Transactions, 2025, v. 66, n. 5, p. 463
Publication type:: Article

THE REORDERING TRANSITION IN LAYER DISORDERED SOLIDS: RARE EARTH - TRANSITION METAL INTERMETALLIC ALLOYS.

Published in:

Revista Cubana de Física, 2015, v. 32, n. 2, p. 74

By:

PENTON-MADRIGAL, ARBELIO;
ESTEVEZ-RAMS, ERNESTO;
AZANZA-RICARDO, CRISTY;
LORA SERRANO, RAYMUNDO

Publication type:

Article

Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 1592, doi. 10.1007/s11664-025-11738-5

By:

Lee, Dong-Bok;
Seo, Young-Jin;
Yoon, Jeong-Won

Publication type:

Article

Microstructurally Adaptive Model for Evolution of Creep Due to Aging in SnAgCu Solder Alloys: Microstructurally Adaptive Model...: S. C. Chavali et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2404, doi. 10.1007/s11664-024-11701-w

By:

Chavali, Sri Chaitra;
Ganti, Sai Sanjit;
Singh, Yuvraj;
Subbarayan, Ganesh;
Dutta, Indranath;
Dayananda, Mysore

Publication type:

Article

Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2308, doi. 10.1007/s11664-024-11621-9

By:

Zhao, Yuwen;
Yang, Jiyou;
Xu, Liming;
Zhao, Yueqi;
Li, Kun;
Yang, Linmei

Publication type:

Article

Study on Material Properties and Copper-to-Copper Wire Bonding of Cu-Pt-Au-Pd Fine Micro-Alloyed Wires.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 8048, doi. 10.1007/s11664-024-11456-4

By:

Chang, Yi-Tze;
Hung, Fei-Yi;
Wu, Bo-Ding

Publication type:

Article

Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6471, doi. 10.1007/s11664-024-11360-x

By:

Lin, Bo-Yi;
Lin, Ting-Chun;
Kao, Chin-Li;
Hsiao, Shih-Chieh;
Tseng, Pei-Hsuan;
Kuo, Jui-Chao

Publication type:

Article

Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z

By:

Zhao, W. T.;
Ren, J.;
Huang, M. L.

Publication type:

Article

Effect of Sn Orientation on Electromigration Failure in CuSn Solders.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6424, doi. 10.1007/s11664-024-11301-8

By:

Pham, Andrew Minh;
Haq, Fariha;
Sadasiva, Subramanya;
Li, Guangxu;
Koslowski, Marisol

Publication type:

Article

The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5460, doi. 10.1007/s11664-024-11264-w

By:

Bi, Yinghao;
Guo, Weiqi;
Wang, Shaobin;
Zhang, Weiwei;
Wu, Ping

Publication type:

Article

Insight on the Electronic, Elastic and Thermal Properties of Au-Al Intermetallic Compounds Based on First-Principles Calculations.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 7, p. 3809, doi. 10.1007/s11664-024-11121-w

By:

Lu, Jinkang;
Zhan, Mingyi;
Yu, Jie;
Yu, Xue;
Duan, Yonghua;
Chen, Song;
Xu, Mingli;
Lu, Wenting

Publication type:

Article

Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3049, doi. 10.1007/s11664-024-11029-5

By:

Tu, Wenbin;
Wang, Hanbing;
Wang, Shanlin;
Chen, Yuhua;
Wei, Mingwei;
Zhang, Timing;
Xie, Jilin

Publication type:

Article

Effect of Cu Particles on the Properties of Sn-Bi-Pb Low-Melting-Point Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3035, doi. 10.1007/s11664-024-11009-9

By:

Niu, Chengchao;
Song, Zhuofei

Publication type:

Article

Laser cladding Al/Ni composite coating and its tribology performance.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 266, doi. 10.1177/02670844241309306

By:

Zhang, Guangliang;
Ren, Zhichao;
Hou, Yuanyuan;
Zheng, Hongyu

Publication type:

Article

Development of reflective co-sputtered nanostructured metallic films.

Published in:

Surface Engineering, 2021, v. 37, n. 3, p. 400, doi. 10.1080/02670844.2020.1781376

By:

Prajwal, K.;
Priyanka, G. L.;
Hasan, Mohammed Adnan;
Carmel Mary Esther, A.;
Sridhara, N.;
Rajendra, A.;
Arya, S. B.;
Dey, Arjun

Publication type:

Article

Effect of annealing temperature on the thermal stability of FeCrNiMnMoxSi0.5B0.5 coatings.

Published in:

Surface Engineering, 2019, v. 35, n. 11, p. 962, doi. 10.1080/02670844.2019.1587141

By:

Zhu, Ying;
Guo, Xiong Ya;
Liu, Cheng Wen;
Zhou, Fang;
Liu, Bin Qi

Publication type:

Article

Surface mechanical coating of Cu plate by Cu Al powders.

Published in:

Surface Engineering, 2018, v. 34, n. 12, p. 926, doi. 10.1080/02670844.2018.1430010

By:

Farahbakhsh, Iman;
Mashimo, Tsutomu

Publication type:

Article

Processing and properties of CuAl 2 intermetallic coatings.

Published in:

Surface Engineering, 2017, v. 33, n. 3, p. 186, doi. 10.1080/02670844.2016.1220733

By:

Abbasi, M.;
Verdian, M. M.

Publication type:

Article

Hardness-load modelling applied to multilayer galvanised coatings.

Published in:

Surface Engineering, 2016, v. 32, n. 3, p. 194, doi. 10.1080/02670844.2015.1116802

By:

Benarioua, Y.;
Mejias, A.;
Roudet, F.;
Iost, A.;
Chicot, D.

Publication type:

Article

Coating formation, fracture mode and cavitation performance of Fe40Al deposited by cold gas spraying.

Published in:

Surface Engineering, 2015, v. 31, n. 11, p. 853, doi. 10.1179/1743294414Y.0000000420

By:

Cinca, N.;
List, A.;
Gärtner, F.;
Guilemany, J. M.;
Klassen, T.

Publication type:

Article

Wear and electrochemical behaviour of Mg-Al intermetallic coating.

Published in:

Surface Engineering, 2014, v. 30, n. 12, p. 933, doi. 10.1179/1743294414Y.0000000257

By:

Li, Y.-G.;
Wei, Y.-H.;
Hou, L.-F.;
Guo, C.-L.;
Han, P.-J.

Publication type:

Article

Effect of La on intermetallic layer of galvalume.

Published in:

Surface Engineering, 2013, v. 29, n. 5, p. 390, doi. 10.1179/1743294413Y.0000000128

By:

Lai, X F;
Peng, H P;
Wang, J H;
Wu, C J;
Tu, H;
Liu, Y;
Su, X P

Publication type:

Article

Manganese enriched diffusion layers on NiAl alloy.

Published in:

Surface Engineering, 2006, v. 22, n. 3, p. 197, doi. 10.1179/174329406X108825

By:

Bartuška, P.;
Lašek, J.;
Paidar, V.

Publication type:

Article

Pulsed plasma nitrided Nb alloyed Mo3Si intermetallic alloy.

Published in:

Surface Engineering, 2005, v. 21, n. 2, p. 139, doi. 10.1179/174329405X40894

By:

Martínez, H.;
Rosales, I.

Publication type:

Article

ALUMINIUM ENRICHED DIFFUSION LAYERS ON NiAl alloy.

Published in:

Surface Engineering, 2003, v. 19, n. 3, p. 185

By:

Bartuška, P.;
Lašek, J.;
Paidar, V.

Publication type:

Article

Structural Complexity in the Apparently Simple Crystal Structure of Be2Ru.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 33, p. 1, doi. 10.1002/chem.202300578

By:

Agnarelli, Laura;
Prots, Yurii;
Ormeci, Alim;
Ramlau, Reiner;
Krnel, Mitja;
Svanidze, Eteri;
König, Markus;
Schmidt, Marcus;
Burkhardt, Ulrich;
Leithe‐Jasper, Andreas;
Grin, Yuri

Publication type:

Article

Intermetallic Compound TiM (M=Co, Fe) with a Layered Structure Prepared by Deoxidizing Ilmenite‐type Oxides in Molten LiCl‐CaH2 Mixtures.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 32, p. 1, doi. 10.1002/chem.202300194

By:

Kobayashi, Yasukazu;
Nagaura, Tomota;
Alowasheeir, Azhar;
Tada, Shohei;
Yamauchi, Yusuke

Publication type:

Article

C−H and Si−H Activation Reactions at Ru/Ga Complexes: A Combined Experimental and Theoretical Case Study on the Ru−Ga Bond.

Published in:

Chemistry - A European Journal, 2022, v. 28, n. 54, p. 1, doi. 10.1002/chem.202200887

By:

Muhr, Maximilian;
Bühler, Raphael;
Liang, Hao;
Gilch, Jonas;
Jandl, Christian;
Kahlal, Samia;
Saillard, Jean‐Yves;
Gemel, Christian;
Fischer, Roland A.

Publication type:

Article

Finely Controlled Platinum Nanoparticles over ZnO Nanorods for Selective Hydrogenation of 3‐Nitrostyrene to 3‐Vinylaniline.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 41, p. 8990, doi. 10.1002/chem.202001329

By:

Gao, Tongtong;
Shi, Wen;
Zhang, Ying;
Zhang, Liyun;
Zhang, Bingsen;
Liu, Zhong‐Wen

Publication type:

Article

YAlC: A Bonding Chameleon with Heteropolyacetylene Features.

Published in:

Angewandte Chemie, 2015, v. 127, n. 33, p. 9742, doi. 10.1002/ange.201501356

By:

Kotyrba, Martin R.;
Cuervo ‐ Reyes, Eduardo;
Nesper, Reinhard

Publication type:

Article

Highly Enantioselective Adsorption of Small Prochiral Molecules on a Chiral Intermetallic Compound.

Published in:

Angewandte Chemie, 2015, v. 127, n. 13, p. 3974, doi. 10.1002/ange.201410107

By:

Prinz, Jan;
Gröning, Oliver;
Brune, Harald;
Widmer, Roland

Publication type:

Article

Temperature-Dependent Electron Shuffle in Molecular Group 13/15 Intermetallic Complexes.

Published in:

Angewandte Chemie, 2014, v. 126, n. 43, p. 11771, doi. 10.1002/ange.201406304

By:

Ganesamoorthy, Chelladurai;
Bläser, Dieter;
Wölper, Christoph;
Schulz, Stephan

Publication type:

Article

The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18878, doi. 10.1007/s10854-019-02244-6

By:

Sun, Fenglian;
Yin, Zuozhu

Publication type:

Article

Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18828, doi. 10.1007/s10854-019-02239-3

By:

Liu, Zhiyuan;
Ma, Haoran;
Shang, Shengyan;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18524, doi. 10.1007/s10854-019-02206-y

By:

Wang, Z.;
Zhang, Q. K.;
Chen, Y. X.;
Song, Z. L.

Publication type:

Article

Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 18211, doi. 10.1007/s10854-019-02175-2

By:

Yang, Li;
Xiong, Yifeng;
Zhang, Yaocheng;
Jiang, Wei;
Wei, Di

Publication type:

Article

Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17583, doi. 10.1007/s10854-019-02107-0

By:

Jiang, Nan;
Zhang, Liang;
Liu, Zhi-quan;
Sun, Lei;
Xiong, Ming-yue;
Zhao, Meng;
Xu, Kai-kai

Publication type:

Article

Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15964, doi. 10.1007/s10854-019-01966-x

By:

Zhu, Zhidan;
Ma, Haoran;
Shang, Shengyan;
Ma, Haitao;
Wang, Yunpeng;
Li, Xiaogan

Publication type:

Article

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13090, doi. 10.1007/s10854-019-01672-8

By:

Chang, Che-Wei;
Lin, Kwang-Lung

Publication type:

Article

Growth behavior of intermetallic compounds in Fe/Sn diffusion couples.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12639, doi. 10.1007/s10854-019-01627-z

By:

Wang, Xiyu;
Li, Deyu;
Li, Ning;
Wang, Rui

Publication type:

Article

Effects of substrate annealing on wettability and intermetallic compound formation in Sn–3.0Cu/Cu systems.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12087, doi. 10.1007/s10854-019-01566-9

By:

Mookam, Niwat;
Kanlayasiri, Kannachai

Publication type:

Article

Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu solder with minor Zn additions.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 11914, doi. 10.1007/s10854-019-01532-5

By:

Leong, Y. M.;
Haseeb, A. S. M. A.;
Nishikawa, Hiroshi;
Mokhtari, Omid

Publication type:

Article

Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11552, doi. 10.1007/s10854-019-01512-9

By:

Wang, Haozhong;
Hu, Xiaowu;
Li, Qinglin;
Qu, Min

Publication type:

Article

Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10550, doi. 10.1007/s10854-019-01399-6

By:

Park, Hwan-Pil;
Seo, Gwancheol;
Kim, Sungcheol;
Ahn, Key-one;
Kim, Young-Ho

Publication type:

Article