Works matching DE "WARPAGE in electronic circuits"

Results: 33

Completely in situ and non-contact warpage assessment using 3D DIC with virtual patterning method.

Published in:

International Journal of Advanced Manufacturing Technology, 2019, v. 100, n. 9-12, p. 2803, doi. 10.1007/s00170-018-2834-8

By:

Kwak, Jae B.

Publication type:

Article

A reduction of protector cover warpage via topology optimization.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 98, n. 9-12, p. 2531, doi. 10.1007/s00170-018-2388-9

By:

Yasin, Saiful Bahri Mohd;
Mohd, Nur Fatiah;
Mahmud, Jamaluddin;
Whashilah, Nabihah Shaibol;
Razak, Zakaria

Publication type:

Article

Warpage and bending behavior of polymer-metal hybrids: experimental and numerical simulations.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 98, n. 1-4, p. 873, doi. 10.1007/s00170-018-2226-0

By:

Izadi, Omid;
Silani, Mohammad;
Mosaddegh, Peiman;
Farzin, Mahmoud

Publication type:

Article

Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 9-12, p. 3235, doi. 10.1007/s00170-018-1819-y

By:

Kang, Sungbum;
Ume, I. Charles

Publication type:

Article

Warpage and Shrinkage Analysis and Optimization of Rapid Tooling Molded thin Wall Component Using Modified Particle Swarm Algorithm.

Published in:

Journal of Advanced Manufacturing Systems, 2019, v. 18, n. 1, p. 85, doi. 10.1142/S0219686719500045

By:

Kumar, Sagar;
Singh, Amit Kumar

Publication type:

Article

Optimization on Parameter Settings in Determining Warpage Factors of a Side-Gated Thin Shallow Part Injection Molding for PP, ABS & PC+ABS Materials.

Published in:

International Review of Mechanical Engineering, 2012, v. 6, n. 4, p. 865

By:

Shuaib, N. A.;
Nasir, S. M.;
Fathullah, M.;
Shayfull, Z.;
Bahari, M. S.

Publication type:

Article

Modelling and optimization of injection molding process for PBT/PET parts using modified particle swarm algorithm.

Published in:

Indian Journal of Engineering & Materials Sciences, 2020, v. 27, n. 3, p. 603, doi. 10.56042/ijems.v27i3.45057

By:

Kumar, Sagar;
Singh, Amit Kumar;
Pathak, Vimal Kumar

Publication type:

Article

Vibration analysis of circular Janus MoSSe plates.

Published in:

Journal of Southeast University (English Edition), 2023, v. 39, n. 3, p. 225, doi. 10.3969/j.issn.1003-7985.2023.03.002

By:

Liu Xinjie;
Wang Lifeng

Publication type:

Article

Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.

Published in:

Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 3, p. 89, doi. 10.4071/imaps.1721531

By:

Hu Zhen;
Zhao Wei;
Gu Xiao;
Chen Dong;
Chen Haijie;
Xu Hong;
Kim Hwee Tan

Publication type:

Article

Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 13, doi. 10.4071/imaps.735566

By:

Suhir, Ephraim;
Sung Yi;
Hwang, Jennie S.;
Ghaffarian, Reza

Publication type:

Article

Process Optimization for 3-D IC Assembly.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 4, p. 219, doi. 10.4071/imaps.474

By:

Woychik, Charles G.;
Lee, Sangil;
McGrath, Scott;
Arkalgud, Sitaram

Publication type:

Article

Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 153, doi. 10.4071/imaps.464

By:

Takeshi Anzai;
Yoshinori Murakami;
Shinji Sato;
Hidekazu Tanisawa;
Kohei Hiyama;
Hiroki Takahashi;
Fumiki Kato;
Hiroshi Sato

Publication type:

Article

Challenges of Scalable 2.5D IC Assembly.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 123, doi. 10.4071/imaps.455

By:

Liang Wang;
Woychik, Charles G.;
Guilian Gao;
Villavicencio, Grant;
McGrath, Scott;
Hong Shen;
Arkalgud, Sitaram

Publication type:

Article

New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGA.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 3, p. 111, doi. 10.4071/imaps.452

By:

Woon-Seong Kwon;
Ramalingam, Suresh;
Xin Wu;
Madden, Liam;
Huang, C. Y.;
Hung-Hsien Chang;
Chi-Hsin Chiu;
Chiu, Steve;
Chen, Stephen

Publication type:

Article

Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 2, p. 104, doi. 10.4071/imaps.449

By:

Sungbum Kang;
Charles Ume, I.

Publication type:

Article

Assessment and Characterization of Stress Induced by Via-First TSV Technology.

Published in:

Journal of Microelectronic & Electronic Packaging, 2011, v. 8, n. 4, p. 129, doi. 10.4071/imaps.313

By:

Parès, G.;
De Crecy, F.;
Moreau, S.;
Maurice, C.;
Borbely, A.;
Mazuir, J.;
Chapelon, L. L.;
Sillon, N.

Publication type:

Article

Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD.

Published in:

2012

By:

Leu, Jihperng;
Chang, Chin-Cheng;
Chen, Alexander;
Lin, Mao-Hsing;
Huang, Kun-Feng

Publication type:

Other

Fabrication and Power Densities of Anode-Supported Solid Oxide Fuel Cells with Different Ni-YSZ Anode Functional Layer Thicknesses.

Published in:

Fuel Cells, 2015, v. 15, n. 1, p. 90, doi. 10.1002/fuce.201400138

By:

Kagomiya, I.;
Kaneko, S.;
Kakimoto, K.;
Park, K.;
Cho, K. H.

Publication type:

Article

Multi-objective optimization of variable packing pressure profile and process parameters in plastic injection molding for minimizing warpage and cycle time.

Published in:

International Journal of Advanced Manufacturing Technology, 2017, v. 92, n. 9-12, p. 3991, doi. 10.1007/s00170-017-0456-1

By:

Kitayama, Satoshi;
Yokoyama, Masaki;
Takano, Masahiro;
Aiba, Shuji

Publication type:

Article

Study of the filling mechanism and parameter optimization method for vacuum casting.

Published in:

International Journal of Advanced Manufacturing Technology, 2016, v. 83, n. 5-8, p. 711, doi. 10.1007/s00170-015-7597-x

By:

Zhang, H.;
Hu, Q.

Publication type:

Article

A warpage optimization method for injection molding using artificial neural network with parametric sampling evaluation strategy.

Published in:

International Journal of Advanced Manufacturing Technology, 2013, v. 65, n. 1-4, p. 343, doi. 10.1007/s00170-012-4173-5

By:

Shi, Huizhuo;
Xie, Suming;
Wang, Xicheng

Publication type:

Article

Warpage Reduction for Power MOSFET Wafers.

Published in:

Electrica, 2021, v. 21, n. 2, p. 173, doi. 10.5152/electrica.2021.21019

By:

Kim Ho Yeap;
Nisar, Humaira;
Dakulagi, Veerendra

Publication type:

Article

Warpage Prediction in Injection Molding Using Artificial Neural Network.

Published in:

Journal of Soft Computing & Decision Support Systems, 2015, v. 2, n. 5, p. 7

By:

Mohamad Halimin, Nur Asyikin;
Zain, Azlan Mohd;
Azman, Muhammad Firdaus

Publication type:

Article

An Innovative Surrogate-Based Searching Method for Reducing Warpage and Cycle Time in Injection Molding.

Published in:

Advances in Polymer Technology, 2016, v. 35, n. 3, p. 288, doi. 10.1002/adv.21554

By:

Zhao, Jian;
Cheng, Gengdong

Publication type:

Article

Shrinkage and Warpage in the Permanent Shape of Sape-Memory Polyurethane Parts.

Published in:

Materiale Plastice, 2021, n. 4, p. 102, doi. 10.37358/MP.21.4.5536

By:

KATMER, SUKRAN;
KARATAS, CETIN

Publication type:

Article

Effects of Hydrothermal Environment on the Deformation of the Thin Bamboo Bundle Veneer Laminated Composites.

Published in:

Journal of Renewable Materials, 2023, v. 11, n. 3, p. 1499, doi. 10.32604/jrm.2022.025130

By:

Ge Wang;
Linbi Chen;
Haiying Zhou;
Shanyu Han;
Fuming Chen

Publication type:

Article

P-63: Effect of Glass Substrate Characteristics on Pattern Tolerance in Inverted Staggered Type TFT Array Fabrication.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 1372, doi. 10.1002/sdtp.10129

By:

Hayashi, Kazutaka;
Kato, Yasumasa;
Kunigita, Masaya

Publication type:

Article

Innovative parametric design for environmentally conscious adhesive dispensing process.

Published in:

Journal of Intelligent Manufacturing, 2015, v. 26, n. 1, p. 1, doi. 10.1007/s10845-013-0755-9

By:

Huang, Chien-Yi

Publication type:

Article

Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates.

Published in:

Polymers (20734360), 2015, v. 7, n. 6, p. 985, doi. 10.3390/polym7060985

By:

Cheolgyu Kim;
Tae-Ik Lee;
Min Sung Kim;
Taek-Soo Kim

Publication type:

Article

Warpage reduction through optimized process parameters and annealed process of injection-molded plastic parts.

Published in:

Journal of Mechanical Science & Technology, 2018, v. 32, n. 10, p. 4787, doi. 10.1007/s12206-018-0926-x

By:

Sudsawat, Supattarachai;
Sriseubsai, Wipoo

Publication type:

Article

Influence of processing parameters on warpage according to the Taguchi experiment.

Published in:

Journal of Mechanical Science & Technology, 2015, v. 29, n. 10, p. 4153, doi. 10.1007/s12206-015-0909-0

By:

Zheng, Guojian;
Guo, Wei;
Wang, Qian;
Guo, Xiangyu

Publication type:

Article

Simulation of Fused Deposition Modeling of Glass Fiber Reinforced ABS Impact Samples: The Effect of Fiber Ratio, Infill Rate, and Infill Pattern on Warpage and Residual Stresses.

Published in:

Hittite Journal of Science & Engineering, 2023, v. 10, n. 1, p. 21, doi. 10.17350/HJSE19030000287

By:

Ergene, Berkay;
Bolat, Cagin

Publication type:

Article

Influence of the Viscoelastic Properties of the Polyimide Dielectric Coating on the Wafer Warpage.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 9, p. 3255, doi. 10.1007/s11664-014-3255-6

By:

Zhu, Chunsheng;
Ning, Wenguo;
Xu, Gaowei;
Luo, Le

Publication type:

Article