Works matching DE "ULTRA large scale integration of circuits"
Results: 22
Analysis and Application of Grey Relation and ANOVA in Chemical–Mechanical Polishing Process Parameters.
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- International Journal of Advanced Manufacturing Technology, 2003, v. 21, n. 1, p. 10, doi. 10.1007/s001700300001
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- Article
Impact of Level-Converter on Power-Saving Capability of Clustered Voltage Scaling.
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- Advances in Radio Science, 2005, v. 3, p. 311, doi. 10.5194/ars-3-311-2005
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- Article
Behavior of COPs (Pits) on Substrate Surface for ULSI Process Integrity.
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- Journal of Studies on Manufacturing, 2010, v. 1, n. 2/3, p. 85
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- Article
SILICON-ON-INSULATOR MESFETS AT THE 45NM NODE.
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- International Journal of High Speed Electronics & Systems, 2012, v. 21, n. 1, p. -1, doi. 10.1142/S0129156412500127
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- Publication type:
- Article
Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation.
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- Journal of Electronic Materials, 2010, v. 39, n. 10, p. 2255, doi. 10.1007/s11664-010-1311-4
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- Article
Thermal Stability Study of Cu(MoN<sub> x </sub>) Seed Layer on Barrierless Si.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3
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- Publication type:
- Article
Multi-Agent Approach for Facing Challenges in Ultra-Large Scale systems.
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- International Journal of Electrical & Computer Engineering (2088-8708), 2014, v. 4, n. 2, p. 151, doi. 10.11591/ijece.v4i2.4102
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- Article
System Tests Processes At the 65-nm Node.
- Published in:
- 2005
- Publication type:
- Product Review
Interconnect reliability analysis of ULSI using automated model generation algorithm.
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- International Journal of RF & Microwave Computer-Aided Engineering, 2016, v. 26, n. 6, p. 481, doi. 10.1002/mmce.20992
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- Article
IITC '99: Many options, many risks.
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- Solid State Technology, 1999, v. 42, n. 8, p. 24
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- Publication type:
- Article
At CMP-MIC, new models impose science on CMP.
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- Solid State Technology, 1999, v. 42, n. 5, p. 24
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- Publication type:
- Article
Report from DUMIC: Low-k still in development.
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- Solid State Technology, 1999, v. 42, n. 5, p. 22
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- Publication type:
- Article
Low-k dielectric costs for dual-damascene integration.
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- Solid State Technology, 1999, v. 42, n. 5, p. 43
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- Publication type:
- Article
Roadmapping over shifting terrain.
- Published in:
- 1999
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- Publication type:
- Editorial
Corrosion of electrodeposited copper by exposure to volatile organic compounds.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 666, doi. 10.1007/s10854-008-9783-1
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- Publication type:
- Article
Electrodeposition of Cu from acidic sulphate solutions in presence of Bis-(3-sulphopropyl)-disulphide (SPS).
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- Transactions of the Institute of Metal Finishing, 2006, v. 84, n. 2, p. 83, doi. 10.1179/174591906X99866
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- Publication type:
- Article
A neural computation to study the scaling capability of the undoped DG MOSFET.
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- Semiconductor Physics, Quantum Electronics & Optoelectronics, 2008, v. 11, n. 2, p. 196, doi. 10.15407/spqeo11.02.196
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- Publication type:
- Article
An efficient room-temperature silicon-based light-emitting diode.
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- Nature, 2001, v. 410, n. 6825, p. 192, doi. 10.1038/35065571
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- Publication type:
- Article
The role of plasma analytics in leading‐edge semiconductor technologies.
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- Contributions to Plasma Physics, 2018, v. 58, n. 5, p. 367, doi. 10.1002/ctpp.201700086
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- Publication type:
- Article
Atomic Layer Deposition of Silicon Nitride Thin Films: A Review of Recent Progress, Challenges, and Outlooks.
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- Materials (1996-1944), 2016, v. 9, n. 12, p. 1007, doi. 10.3390/ma9121007
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- Publication type:
- Article
Optimization Approaches for Designing Quantum Reversible Arithmetic Logic Unit.
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- International Journal of Theoretical Physics, 2016, v. 55, n. 3, p. 1423, doi. 10.1007/s10773-015-2782-0
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- Publication type:
- Article
Implementation of a Reuse Process for Liquid Crystal Displays Using an Eccentric-Form Tool.
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- International Journal of Molecular Sciences, 2009, v. 10, n. 9, p. 4178, doi. 10.3390/ijms10094178
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- Publication type:
- Article