Works matching DE "TIN alloys"
Results: 859
Corrosion insight of iron and bismuth added Sn–1Ag–0.5Cu lead-free solder alloy.
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- Corrosion Engineering, Science & Technology, 2020, v. 55, n. 1, p. 35, doi. 10.1080/1478422X.2019.1666458
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Revealing the Intrinsic Uneven Electrochemical Reactions of Li Metal Anode in Ah‐Level Laminated Pouch Cells.
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- Advanced Functional Materials, 2023, v. 33, n. 6, p. 1, doi. 10.1002/adfm.202210669
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Sn Alloying to Inhibit Hydrogen Evolution of Zn Metal Anode in Rechargeable Aqueous Batteries.
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- Advanced Functional Materials, 2022, v. 32, n. 1, p. 1, doi. 10.1002/adfm.202108533
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Efficient Stress Dissipation in Well‐Aligned Pyramidal SbSn Alloy Nanoarrays for Robust Sodium Storage.
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- Advanced Functional Materials, 2021, v. 31, n. 37, p. 1, doi. 10.1002/adfm.202104798
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Novel Electron Transport Layer Material for Perovskite Solar Cells with Over 22% Efficiency and Long‐Term Stability.
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- Advanced Functional Materials, 2020, v. 30, n. 45, p. 1, doi. 10.1002/adfm.202004933
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Role of Charge Density Wave in Monatomic Assembly in Transition Metal Dichalcogenides.
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- Advanced Functional Materials, 2019, v. 29, n. 15, p. N.PAG, doi. 10.1002/adfm.201900367
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Radiocarbon Dating of Interdune Paleo-Wetland Deposits to Constrain the Age of Mid-to-Late Holocene Microlithic Artifacts from the Zhongba site, Southwestern Qinghai-Tibet Plateau.
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- Geoarchaeology, 2014, v. 29, n. 1, p. 33, doi. 10.1002/gea.21459
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Synthesis of the O-(2-chloropyridin-5-ylmethyl)oxime of 20-hydroxyecdysone.
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- Chemistry of Natural Compounds, 2012, v. 47, n. 6, p. 944, doi. 10.1007/s10600-012-0110-y
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Avoiding inelastic strains in solder joint interconnections of space electronics.
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- ZAMM -- Journal of Applied Mathematics & Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 2023, v. 103, n. 2, p. 1, doi. 10.1002/zamm.202200097
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铸态下Sn-Bi二元共晶焊料合金的组织特征及其力学性能变化.
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- Nonferrous Metals Engineering, 2024, v. 14, n. 7, p. 52
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Effect of P Content on the Microstructure and Mechanical Properties of Cu-P-Sn-Ag Quaternary Alloy Solder.
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- Nonferrous Metals Engineering, 2023, v. 13, n. 10, p. 22, doi. 10.3969/j.issn.2095-1744.2023.10.004
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高应变速率下无铅锡基焊料的力学性能.
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- Nonferrous Metals Engineering, 2022, v. 12, n. 11, p. 30, doi. 10.3969/j.issn.2095-1744.2022.11.05
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- Article
Interfacial Microstructure and Bonding Area of Snbased Alloy-GG25 Gray Iron Bimetallic Material Using Flux, Sn, and Sn-Zn Interlayer Compound Casting.
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- Engineering, Technology & Applied Science Research, 2022, v. 12, n. 2, p. 8416, doi. 10.48084/etasr.4804
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Fischer-Tropsch Synthesis: Cd, In and Sn Effects on a 15%Co/Al2O3 Catalyst.
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- Catalysts (2073-4344), 2019, v. 9, n. 10, p. 862, doi. 10.3390/catal9100862
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Effect of Tin in the Bulk of Platinum–Tin Alloys for Ethane Dehydrogenation.
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- Topics in Catalysis, 2020, v. 63, n. 7/8, p. 700, doi. 10.1007/s11244-020-01297-w
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SYNTHESIS OF SODIUM STANNATE USING ALKALINE PRESSURE LEACHING PROCESS.
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- Rasayan Journal of Chemistry, 2024, v. 17, n. 1, p. 230, doi. 10.31788/RJC.2024.1718674
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SRUCTURAL HARDENING MECHANISM OF LEAD-CADMIUM-BISMUTH (TIN-SILVER) ALLOYS FOR BATTERY GRIDS.
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- Journal of Science & Arts, 2014, v. 14, n. 4, p. 331
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ELECTRODEPOSITION, CHARACTERIZATION AND CORROSION INVESTIGATIONS OF GALVANIC TIN-ZINC LAYERS FROM PYROPHOSPHATE BATHS.
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- Military Technical Courier / Vojnotehnicki Glasnik, 2016, v. 64, n. 3, p. 649, doi. 10.5937/vojtehg64-10578
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Tin recovery and solidification of sludge from mirror grinding.
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- Waste Forum, 2022, n. 3, p. 153
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Copper Spinodal Alloys for Aerospace.
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- Advanced Materials & Processes, 2006, v. 164, n. 6, p. 44
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Cu-Ni-Sn bearing alloy has lubricity, resists corrosion.
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- Advanced Materials & Processes, 2004, v. 162, n. 3, p. 11
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Tin `worms' chew up, spit out germanium.
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- Advanced Materials & Processes, 1998, v. 153, n. 6, p. 4
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- Article
The Effects of Individual Addition of Sn, Nd, and Ca on the Microstructure, Mechanical Properties, and Corrosion Behavior of the Mg–Li–Al Alloy.
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- International Journal of Metalcasting, 2023, v. 17, n. 3, p. 1580, doi. 10.1007/s40962-022-00869-8
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Structure–Property Correlation of Al–Mg–Si Alloys Micro-alloyed with Sn.
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- International Journal of Metalcasting, 2022, v. 16, n. 2, p. 924, doi. 10.1007/s40962-021-00652-1
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The Need for a New Approach to Soldering in High Pressure Die Casting.
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- International Journal of Metalcasting, 2021, v. 15, n. 2, p. 391, doi. 10.1007/s40962-020-00504-4
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Influence of TiN Additions on the Microstructure of a Lightweight Fe–Mn–Al Steel.
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- International Journal of Metalcasting, 2020, v. 14, n. 2, p. 342, doi. 10.1007/s40962-019-00373-6
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Effect of Molten Metal Temperature on Mold Filling in Evaporative Pattern Casting.
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- International Journal of Metalcasting, 2019, v. 13, n. 3, p. 611, doi. 10.1007/s40962-019-00310-7
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Determination on the Effect of Tin Content on Microstructure, Hardness, Optimum Aging Temperature and Aging Time for Spinodal Bronze Alloys Cast in Metal Mold.
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- International Journal of Metalcasting, 2017, v. 11, n. 2, p. 189, doi. 10.1007/s40962-016-0034-6
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XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film.
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- Advances in Materials Science & Engineering, 2015, v. 2015, p. 1, doi. 10.1155/2015/257231
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Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging.
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- Advances in Materials Science & Engineering, 2015, v. 2015, p. 1, doi. 10.1155/2015/639028
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Transmission electron microscopy investigation and interpretation of the morphology and interfacial structure of the ε'-Mg<sub>54</sub>Ag<sub>17</sub> precipitates in an Mg-Sn-Mn-Ag-Zn alloy.
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- Journal of Applied Crystallography, 2014, v. 47, n. 5, p. 1676, doi. 10.1107/S1600576714018913
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Transmission electron microscopy analysis of the crystallography of precipitates in Mg-Sn alloys aged at high temperatures.
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- Journal of Applied Crystallography, 2014, v. 47, n. 5, p. 1729, doi. 10.1107/S160057671401958X
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The characterization of crystalline particle growth in TiNi thin films.
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- Journal of Applied Crystallography, 2004, v. 37, n. 6, p. 1007, doi. 10.1107/S0021889804022332
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Crystallization kinetics of glassy Se-Te-Sn alloys.
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- Canadian Journal of Physics, 2015, v. 93, n. 8, p. 898, doi. 10.1139/cjp-2014-0186
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Influence of heat treatment on stress-strai behaviour and lattice parameters of Sn-In alloy.
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- Materials Science & Technology, 2011, v. 27, n. 6, p. 1020, doi. 10.1179/026708310X12701149768098
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Thermal contact at solder/substrate interfaces during solidification.
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- Materials Science & Technology, 2009, v. 25, n. 6, p. 707, doi. 10.1179/174328408X332807
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A new understanding of melt overheating treatment of Sn–20 wt-%Sb from viewpoint of TI-LLST.
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- Materials Science & Technology, 2009, v. 25, n. 1, p. 35, doi. 10.1179/174328408X265668
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Modelling and simulation of equiaxed dendritic structures permeability for Pb–Sn alloys.
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- Materials Science & Technology, 2008, v. 24, n. 12, p. 1444, doi. 10.1179/174328407X236931
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Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders.
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- Materials Science & Technology, 2008, v. 24, n. 7, p. 803, doi. 10.1179/174328408X307274
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Effect of Zn addition on steady state creep characteristics of Sn–3·3Ag solder alloy.
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- Materials Science & Technology, 2008, v. 24, n. 4, p. 488, doi. 10.1179/174328408X278457
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Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy.
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- Materials Science & Technology, 2005, v. 21, n. 7, p. 861, doi. 10.1179/174328405X46079
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Morphological development of solidification structures under forced fluid flow: experimental observation.
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- Materials Science & Technology, 2003, v. 19, n. 5, p. 1, doi. 10.1179/026708303225002118
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A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics.
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- Journal of Materials Science, 2022, v. 57, n. 19, p. 8597, doi. 10.1007/s10853-022-07187-8
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Microstructure, mechanical properties, and cytotoxicity of low Young's modulus Ti–Nb–Fe–Sn alloys.
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- Journal of Materials Science, 2022, v. 57, n. 9, p. 5634, doi. 10.1007/s10853-022-06984-5
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Combined effect of Sn addition and pre-ageing on natural secondary and artificial ageing of Al–Mg–Si alloys.
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- Journal of Materials Science, 2022, v. 57, n. 3, p. 2149, doi. 10.1007/s10853-021-06654-y
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High-temperature-tolerable superconducting Nb-alloy and its application to Pb- and Cd-free superconducting joints between NbTi and Nb<sub>3</sub>Sn wires.
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- Journal of Materials Science, 2021, v. 56, n. 36, p. 20197, doi. 10.1007/s10853-021-06585-8
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Increasing shear strength of Au–Sn bonded joint through nano-grained interfacial reaction products.
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- Journal of Materials Science, 2021, v. 56, n. 11, p. 7050, doi. 10.1007/s10853-020-05623-1
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Joining of SiO<sub>2</sub> glass and 316L stainless steel using Bi–Ag-based active solders.
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- Journal of Materials Science, 2021, v. 56, n. 4, p. 3444, doi. 10.1007/s10853-020-05426-4
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Study on the superior lithium storage performance of carbon/Sn–Mo oxide composite as lithium-ion battery anode.
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- Journal of Materials Science, 2020, v. 55, n. 29, p. 14373, doi. 10.1007/s10853-020-04902-1
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Performance of an Al–0.08Sn–0.08Ga–xMg alloy as an anode for Al–air batteries in alkaline electrolytes.
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- Journal of Materials Science, 2020, v. 55, n. 25, p. 11477, doi. 10.1007/s10853-020-04711-6
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