Works matching DE "COPPER plating"

Results: 505

Many Antwerp Hands: Collaborations in Netherlandish Art.

Published in:

2024

By:

Demchuk, Stefaniia

Publication type:

Book Review

Factors influencing damascene feature fill using copper PVD and electroplating.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 86

By:

Reid, Jan;
Mayer, Steve;
Broadbent, Eliot;
Klawuhn, Erich;
Ashtiani, Kaihan

Publication type:

Article

Mechanical characterization of functional Cu-GnP composite coatings for lubricant applications.

Published in:

Surface Engineering, 2022, v. 38, n. 1, p. 72, doi. 10.1080/02670844.2022.2040187

By:

Baiocco, Gabriele;
Menna, Erica;
Rubino, Gianluca;
Ucciardello, Nadia

Publication type:

Article

Effect of shot blasting on droplet contact angle of carbon aided phase change nanocomposites.

Published in:

Surface Engineering, 2021, v. 37, n. 8, p. 1002, doi. 10.1080/02670844.2021.1873898

By:

Ganesh Kumar, P.;
Prabakaran, R.;
Sakthivadivel, D.;
Thangapandian, N.;
Velraj, R.;
Kim, Sung Chul

Publication type:

Article

On the kinetics of copper electroless plating with hypophosphite reductant.

Published in:

Surface Engineering, 2016, v. 32, n. 5, p. 363, doi. 10.1179/1743294415Y.0000000066

By:

Martins, J. I.;
Nunes, M. C.

Publication type:

Article

Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes.

Published in:

Surface Engineering, 2015, v. 31, n. 6, p. 433, doi. 10.1179/1743294414Y.0000000400

By:

Sekar, R.;
Jagadesh, K. K.;
Ramesh Bapu, G. N. K.

Publication type:

Article

Electroless copper plating on particulate reinforcements and effects on mechanical properties of SiC<sub>p</sub>/Fe composite.

Published in:

Surface Engineering, 2015, v. 31, n. 3, p. 232, doi. 10.1179/1743294414Y.0000000370

By:

Zhang, Y.;
Zong, B. Y.;
Jin, J.;
Cao, X.

Publication type:

Article

New electroless copper plating bath using sodium hypophosphite as reductant.

Published in:

Surface Engineering, 2012, v. 28, n. 5, p. 377, doi. 10.1179/1743294411Y.0000000049

By:

Yuan, X L;
Gao, J;
Yang, Z F;
Wang, Z X;
Wang, Z L

Publication type:

Article

Surface characterisation of electroless copper plated polyester fibres.

Published in:

Surface Engineering, 2009, v. 25, n. 2, p. 101, doi. 10.1179/174329408X326489

By:

Guo, R. H.;
Jiang, S. Q.;
Yuen, C. W. M .;
Ng, M. C. F.

Publication type:

Article

Surface characterisation of daguerreotypes with the optical metrological technique of confocal microscopy.

Published in:

Surface Engineering, 2008, v. 24, n. 2, p. 138, doi. 10.1179/174329408X298175

By:

Ravines, P.;
Wiegandt, R.;
Wichern, C. M.

Publication type:

Article

Investigation on the microstructure, phase formation and properties of aluminium alloy coatings by stud spraying.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22256, doi. 10.1007/s10854-022-09004-z

By:

Zhao, Xilong;
Lu, Xinhong;
Wang, Kun;
He, Feng

Publication type:

Article

An accessible strategy for high-performance copper layer fabrication on polyphenylene oxide substrates via polydopamine functionalization and electroless deposition.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13012, doi. 10.1007/s10854-022-08243-4

By:

Liu, Hui-gen;
Feng, Zhe-sheng;
Wang, Kang;
Lian, Ji-qing;
Chen, Yuan-ming;
Yang, Meng-yao;
Wang, Yan

Publication type:

Article

A new transient liquid phase bonding method using magnesium foil to bond copper plates to aluminum nitride substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10486, doi. 10.1007/s10854-022-08035-w

By:

Takakuwa, Satoshi;
Terasaki, Nobuyuki;
Kon, Naochika;
Ohashi, Touyou;
Nita, Nobuyasu;
Nagatomo, Yoshiyuki;
Kuromitsu, Yoshirou

Publication type:

Article

Highly stretchable, sensitive, and flexible strain sensors based on Ag@Cu/PDMS composites.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8104, doi. 10.1007/s10854-022-07960-0

By:

Zhang, Xiao Min;
Yang, Xiao-Li;
Wang, Bin

Publication type:

Article

Fabrication of silver plated copper powders to apply in flexible conductive films for strain sensor.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8096, doi. 10.1007/s10854-022-07959-7

By:

Zhang, Xiao Min;
Yang, Xiao-Li;
Wang, Bin

Publication type:

Article

Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22810, doi. 10.1007/s10854-020-04806-5

By:

Xu, Han;
Zhang, Xudong;
Chen, Wenjing;
Zou, Minming;
Hu, Xiaowu

Publication type:

Article

High thermal conductivity and low thermal expansion coefficient of isotropic graphite-reinforced aluminum matrix composites prepared by in situ curing of silicon aerogel.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 12, p. 9250, doi. 10.1007/s10854-020-03465-w

By:

Peng, Xuanyi;
Ying, Huang;
Sun, Xu;
Han, Xiaopeng;
Fan, Rui;
Liu, Xudong

Publication type:

Article

Mechanism of a catalytic silver(I)-complex: assisted electroless deposition of inductance coil on poly(ethylene terephthalate) film.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 11, p. 8165, doi. 10.1007/s10854-020-03289-8

By:

Wang, Yuefeng;
Hong, Yan;
Zhou, Guoyun;
Wang, Xinhai;
Song, Jianheng;
He, Wei;
Gao, Zhengping;
Zhang, Weihua;
Sun, Rui;
Sun, Yukai;
Ai, Kehua;
Li, Qinghua

Publication type:

Article

Memristors based on thermal copper oxide.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 10, p. 7445, doi. 10.1007/s10854-020-02963-1

By:

Ortega-Reyes, L.;
Ávila-García, A.

Publication type:

Article

Effect of metal buffer layer on the thermal interface performance of liquid metal alloy on copper plate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15766, doi. 10.1007/s10854-019-01962-1

By:

Yan, Huilong;
Ji, Yulong;
Yan, Jinliang

Publication type:

Article

Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni-P metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 8, p. 6937, doi. 10.1007/s10854-018-8680-5

By:

Pun, Kelvin P. L.;
Ali, Lafir;
Kohtoku, Makoto;
Cheung, Chee-Wah;
Chan, Alan H. S.;
Wong, C. P.

Publication type:

Article

Fabrication of copper-coated glass fabric composites through electroless plating process.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 798, doi. 10.1007/s10854-016-5592-0

By:

Chen, Huiyu;
Tai, Yu;
Xu, Chunju

Publication type:

Article

Fabrication of conductive soybean protein fiber for electromagnetic interference shielding through electroless copper plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 13300, doi. 10.1007/s10854-016-5479-0

By:

Zhao, Hang;
Hou, Lei;
Lan, Bijian;
Lu, Yinxiang

Publication type:

Article

Investigation of copper plated-through-holes in glass fiber reinforced epoxy substrates using AC impedance spectroscopy.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2563, doi. 10.1007/s10854-015-2723-y

By:

Ramachandran, Koushik;
Pruyn, Timothy;
Huang, Timothy;
Wang, Yushu;
Singh, Preet;
Jud Ready, W.;
Gerhardt, Rosario;
Sundaram, Venky;
Tummala, Rao

Publication type:

Article

Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 7, p. 2211, doi. 10.1007/s10854-013-1081-x

By:

Xue, Longlong;
liang, Qian;
Lu, Yinxiang

Publication type:

Article

An alternative process for electroless copper plating on polyester fabric.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 33, doi. 10.1007/s10854-008-9594-4

By:

Guo, R. H.;
Jiang, S. Q.;
Yuen, C. W. M.;
Ng, M. C. F.

Publication type:

Article

Research on deep drawing process with electro-permanent magnetic blank holder for non-ferromagnetic materials.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 3/4, p. 1145, doi. 10.1007/s00170-024-13672-y

By:

He, Sicheng;
Sun, Yonggen;
Zhang, Hongsheng;
Zhang, Teng;
Zhang, Shangbin;
Zhang, Jiacheng;
Qin, Siji

Publication type:

Article

Characterizations of laser transmission welding of glass and copper using nanosecond pulsed laser.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 130, n. 5/6, p. 2755, doi. 10.1007/s00170-023-12838-4

By:

Nguyen, Hoai;
Lin, Chih-Kuang;
Tung, Pi-Cheng;
Ho, Jeng-Rong

Publication type:

Article

A study on the tribological behavior of water-based nanolubricant during corrugated rolling of copper plates.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 3/4, p. 1513, doi. 10.1007/s00170-023-12286-0

By:

Ma, Linan;
Lian, Junjie;
Ma, Xiaoguang;
Bai, Siyi;
Ma, Luhu;
Zhao, Jingwei

Publication type:

Article

Improving the stability of the friction stir channelling technology via a cooled copper backing plate.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 1/2, p. 525, doi. 10.1007/s00170-023-12211-5

By:

Vidal, Catarina;
Ferreira, Pedro M.;
Ferreira, Francisco B.;
Buinho, Miguel;
Silva, Tiago T.;
Santos, Telmo G.

Publication type:

Article

A simulation method for the optimization of cooling water slot structure in slab continuous casting mold combined with submerged entry nozzle.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 127, n. 7/8, p. 3221, doi. 10.1007/s00170-023-11671-z

By:

Om, Sang Chol;
Kim, Dong Gil;
Pak, Chung Il;
Kim, Hak Yong;
Kim, Il Un

Publication type:

Article

Investigation modes for production technology of wire from the Pd5Ni alloy for catchment gauzes of the chemical industry.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 11/12, p. 7229, doi. 10.1007/s00170-022-09821-w

By:

Konstantinov, Igor L.;
Sidelnikov, Sergey B.;
Lopatina, Ekaterina S.;
Arnautov, Aleksandr D.;
Rudnitskiy, Edvard A.;
Voroshilov, Denis S.;
Mansurov, Yulbarskhon N.;
Lopatin, Vladimir A.;
Yuryev, Pavel O.;
Dobrovenko, Mikhail P.;
Ber, Vladimir I.

Publication type:

Article

A three-dimensional stress model for the non-uniform mechanical behavior of a continuous casting mold.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 9/10, p. 6837, doi. 10.1007/s00170-022-09782-0

By:

Du, Fengming;
Li, Cong;
Liu, Shanshan;
Li, Chengdi;
Han, Xiaoguang;
Huang, Ruoxuan;
Shen, Yan;
Wang, Xudong

Publication type:

Article

Micro-EDM of 3D microstructure on micro-shaft based on the rotation of micro-shaft.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 5537, doi. 10.1007/s00170-022-09772-2

By:

Lian, Man-Qun;
Lei, Jian-Guo;
Wu, Xiao-Yu;
Luo, Feng;
Luo, He-Xi;
Xu, Bin

Publication type:

Article

Research on improving the discharge cutting efficiency of N-type high-resistance silicon based on electroless plating.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 9/10, p. 5839, doi. 10.1007/s00170-021-08240-7

By:

Chen, Zhibin;
Qiu, Mingbo;
Zhao, Jinchao;
Qin, Yan;
Guo, Chuangchaung;
Wan, Rong

Publication type:

Article

A numerical strategy to identify the FSW process optimal parameters of a butt-welded joint of quasi-pure copper plates: modeling and experimental validation.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 7/8, p. 2505, doi. 10.1007/s00170-021-07296-9

By:

Iordache, Monica Daniela;
Badulescu, Claudiu;
Diakhate, Malick;
Constantin, Marius Adrian;
Nitu, Eduard Laurentiu;
Demmouche, Younes;
Dhondt, Matthieu;
Negrea, Denis

Publication type:

Article

A 3D model coupled inverse algorithm for the non-uniform thermal behavior of a continuous casting mold.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 9-12, p. 2431, doi. 10.1007/s00170-020-05780-2

By:

Mi, Zetian;
Du, Fengming;
Wang, Jinlong;
Zhang, Pengchao;
Liu, Yu

Publication type:

Article

Investigation on the roll-to-plate microforming of riblet features with the consideration of grain size effect.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 7/8, p. 2055, doi. 10.1007/s00170-020-05687-y

By:

Xu, Zhutian;
Peng, Linfa;
Lai, Xinmin

Publication type:

Article

Arc discharge and pressure characteristics in pulsed plasma gas of PAW.

Published in:

International Journal of Advanced Manufacturing Technology, 2019, v. 102, n. 1-4, p. 695, doi. 10.1007/s00170-018-3198-9

By:

Chen, Shujun;
Yan, Zhaoyang;
Jiang, Fan

Publication type:

Article

Analysis of Microstructure and Mechanical Properties of Copper Friction Stir Welding Zone.

Published in:

Strength of Materials, 2024, v. 56, n. 3, p. 586, doi. 10.1007/s11223-024-00673-1

By:

Wang, H. F.;
Ji, L.

Publication type:

Article

Effect of a low-thermal-conductive coating on the dynamics of rewetting of overheated plate by falling liquid film.

Published in:

High Temperature, 2016, v. 54, n. 3, p. 370, doi. 10.1134/S0018151X16020139

By:

Pavlenko, A.;
Tsoi, A.;
Surtaev, A.;
Kuznetsov, D.;
Serdyukov, V.

Publication type:

Article

铜和陶瓷低温钎焊接头研究.

Published in:

Metal Working (1674-165X), 2025, n. 1, p. 27

By:

王发;
刘美川;
陈炫如;
李佳萍;
周嘉玲;
于学勇;
戴军

Publication type:

Article

铜/金刚石复合材料化学镀铜后的组织结构和焊接性.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 19, p. 1, doi. 10.19289/j.1004-227x.2023.19.001

By:

苗其超;
房国丽;
郝晋鹏;
张海龙

Publication type:

Article

KMnO<sub>4</sub>-NaOH 体系对环氧树脂基板表面的微蚀效果.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 18, p. 19, doi. 10.19289/j.1004-227x.2023.18.003

By:

赵文霞;
宋晅;
张彩芳;
朱皓;
程熠;
刘欣;
回凯宏;
李鑫巍;
赵伟;
陈怀军

Publication type:

Article

蚕丝织物化学镀铜/镍及其电磁屏蔽性能.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 5, p. 1, doi. 10.19289/j.1004-227x.2023.05.001

By:

陈扬杰;
钟良;
杜广;
党兴

Publication type:

Article

铜基引线框架电镀铜、银的显微结构及可焊性.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 3, p. 50, doi. 10.19289/j.1004-227x.2023.03.009

By:

王锋涛;
万海毅;
黄斌;
唐世辉;
宋佳骏;
黄重钦;
刘薇;
栾道成;
查五生

Publication type:

Article

添加剂对 ABS 化学镀铜的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1510, doi. 10.19289/j.1004-227x.2022.21.004

By:

程熠;
宋晅;
朱皓;
赵文霞;
回凯宏;
李鑫巍;
刘欣;
陈怀军

Publication type:

Article

非金属材料化学镀铜研究进展.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 11, p. 791, doi. 10.19289/j.1004-227x.2022.11.008

By:

鄢豪;
管英柱

Publication type:

Article

环氧树脂板化学镀铜前微蚀和激光活化工艺优化.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 7, p. 470, doi. 10.19289/j.1004-227x.2022.07.004

By:

黎思琦;
钟良;
杨志刚

Publication type:

Article

Experimental analysis of a pulse tube based new prototype for cells cryopreservation.

Published in:

International Journal of Energy Research, 2020, v. 44, n. 7, p. 5905, doi. 10.1002/er.5367

By:

Cipri, Katiuscia;
Cioccolanti, Luca;
Naldi, Roberto

Publication type:

Article