Works matching DE "MICROELECTRONICS
Results: 2049
Top-down and bottom-up legitimization of emerging industries: evidence from two Italian mechatronics clusters.
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- Regional Studies, 2022, v. 56, n. 4, p. 656, doi. 10.1080/00343404.2021.1962839
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Novel electrochemical approach to study corrosion mechanism of Al-Au wire-bond pad interconnections.
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- Corrosion Engineering, Science & Technology, 2013, v. 48, n. 6, p. 409, doi. 10.1179/1743278212Y.0000000067
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Polymer and Molecular Electronic Devices.
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- Innovation, 2006, v. 6, n. 1, p. 74
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Molecular Electronics -- The Ultimate Nano Research.
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- Innovation, 2005, v. 5, n. 2, p. 51
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Estructuras hexaquirales con coeficiente de Poisson negativo bajo carga uniaxial en el plano.
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- Ingeniería y Desarrollo, 2012, v. 30, n. 1, p. 45
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A Bio‐Based Allylphenol (Eugenol)‐Functionalized Fluorinated Maleimide with Low Dielectric Constant and Low Water Uptake.
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- Macromolecular Chemistry & Physics, 2018, v. 219, n. 20, p. N.PAG, doi. 10.1002/macp.201800252
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A New Four-Arm Organosiloxane with Thermopolymerizable Trifluorovinyl ether Groups: Synthesis and Conversion to the Polymer with both Low Dielectric Constant and Low Water Uptake.
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- Macromolecular Chemistry & Physics, 2017, v. 218, n. 13, p. n/a, doi. 10.1002/macp.201700010
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Tuning Block Polymer Structure, Properties, and Processability for the Design of Efficient Nanostructured Materials Systems.
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- Macromolecular Chemistry & Physics, 2017, v. 218, n. 5, p. n/a, doi. 10.1002/macp.201600513
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New Fluoropolymers Having Both Low Water Uptake and a Low Dielectric Constant.
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- Macromolecular Chemistry & Physics, 2015, v. 216, n. 23, p. 2302, doi. 10.1002/macp.201500394
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Flexible Memristor Constructed by 2D Cadmium Phosphorus Trichalcogenide for Artificial Synapse and Logic Operation.
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- Advanced Functional Materials, 2023, v. 33, n. 9, p. 1, doi. 10.1002/adfm.202211269
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Breathable and Skin‐Conformal Electronics with Hybrid Integration of Microfabricated Multifunctional Sensors and Kirigami‐Structured Nanofibrous Substrates.
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- Advanced Functional Materials, 2022, v. 32, n. 32, p. 1, doi. 10.1002/adfm.202202792
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Atomic‐Level Insight into the Formation of Subsurface Dislocation Layer and Its Effect on Mechanical Properties During Ultrafast Laser Micro/Nano Fabrication.
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- Advanced Functional Materials, 2022, v. 32, n. 15, p. 1, doi. 10.1002/adfm.202108802
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Freestanding Photoresist Film: A Versatile Template for Three‐Dimensional Micro‐ and Nanofabrication.
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- Advanced Functional Materials, 2020, v. 30, n. 42, p. 1, doi. 10.1002/adfm.202004129
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Soft Electronics Manufacturing Using Microcontact Printing.
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- Advanced Functional Materials, 2019, v. 29, n. 51, p. N.PAG, doi. 10.1002/adfm.201906551
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One‐Step Scalable Fabrication of Graphene‐Integrated Micro‐Supercapacitors with Remarkable Flexibility and Exceptional Performance Uniformity.
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- Advanced Functional Materials, 2019, v. 29, n. 50, p. N.PAG, doi. 10.1002/adfm.201902860
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Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD).
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- Advanced Functional Materials, 2019, v. 29, n. 5, p. N.PAG, doi. 10.1002/adfm.201806440
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Stamping of Flexible, Coplanar Micro-Supercapacitors Using MXene Inks.
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- Advanced Functional Materials, 2018, v. 28, n. 9, p. 1, doi. 10.1002/adfm.201705506
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Scanning electron acoustic microscopy for the evaluation of domain structures in BaTiO3 single crystal and ceramics.
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- Journal of Materials Science, 1998, v. 33, n. 18, p. 4543, doi. 10.1023/A:1004460504231
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The microstructure and microwave dielectric properties of zirconium titanate ceramics in the solid solution system ZrTiO4–Zr5Ti7O24.
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- Journal of Materials Science, 1997, v. 32, n. 7, p. 1693, doi. 10.1023/A:1018563630617
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Experimental study of neutron-induced soft errors in modern cardiac pacemakers.
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- Journal of Interventional Cardiac Electrophysiology, 2012, v. 33, n. 1, p. 19, doi. 10.1007/s10840-011-9609-6
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Modeling and simulation of a parallel plate heat sink using computational fluid dynamics.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 51, n. 1-4, p. 415, doi. 10.1007/s00170-008-1867-9
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Development and ejection behavior of different material-based electrostatic ink-jet heads.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 48, n. 1-4, p. 165, doi. 10.1007/s00170-009-2255-9
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Some recent advances in multi-material micro- and nano-manufacturing.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 47, n. 1-4, p. 161, doi. 10.1007/s00170-009-2214-5
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Constrained scheduling of the inspection activities on semiconductor wafers grouped in families with sequence-dependent set-up times.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 46, n. 5-8, p. 695, doi. 10.1007/s00170-009-2112-x
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Simulation-based optimization of dispatching rules for semiconductor wafer fabrication system scheduling by the response surface methodology.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 41, n. 1/2, p. 110, doi. 10.1007/s00170-008-1462-0
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Modal analysis of multi-layer structure for chemical mechanical polishing process.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 37, n. 1/2, p. 83, doi. 10.1007/s00170-007-0960-9
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Studies of chipping mechanisms for dicing silicon wafers.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1206, doi. 10.1007/s00170-006-0800-3
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Optimal replenishment policies for deteriorating control wafers inventory.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 7/8, p. 736, doi. 10.1007/s00170-006-0750-9
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A simulated model for cycle time reduction by acquiring optimal lot size in semiconductor manufacturing.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 9/10, p. 1008, doi. 10.1007/s00170-006-0884-9
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Machining characteristics on the ultra-precision dicing of silicon wafer.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 33, n. 7/8, p. 662, doi. 10.1007/s00170-006-0499-1
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Precision measures for processes with multiple manufacturing lines.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 11/12, p. 1202, doi. 10.1007/s00170-005-0145-3
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An integrated system for setting the optimal parameters in IC chip-package wire bonding processes.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 3/4, p. 247, doi. 10.1007/s00170-005-0083-0
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A genetic algorithm approach to optimising component placement and retrieval sequence for chip shooter machines.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 28, n. 5/6, p. 556, doi. 10.1007/s00170-004-2390-2
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Yield improvement planning for the recycle processes of test wafers.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 11/12, p. 1228, doi. 10.1007/s00170-004-2316-z
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COSAR: commitment-oriented “sense and respond” system for microelectronic manufacturing.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 9/10, p. 999, doi. 10.1007/s00170-004-2275-4
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Downgrade decision for control/dummy wafers in a fab.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 5/6, p. 585, doi. 10.1007/s00170-003-2031-1
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Automatic optical inspection for detecting defects on printed circuit board inner layers.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 9/10, p. 940, doi. 10.1007/s00170-004-2299-9
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Potential for spin-based information processing in a thin-film molecular semiconductor.
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- Nature, 2013, v. 503, n. 7477, p. 504, doi. 10.1038/nature12597
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High-fidelity readout and control of a nuclear spin qubit in silicon.
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- Nature, 2013, v. 496, n. 7445, p. 334, doi. 10.1038/nature12011
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Magnetic ratchet for three-dimensional spintronic memory and logic.
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- Nature, 2013, v. 493, n. 7434, p. 647, doi. 10.1038/nature11733
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Quantum computation: Spinning towards scalable circuits.
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- Nature, 2012, v. 489, n. 7417, p. 505, doi. 10.1038/nature11488
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Multigate transistors as the future of classical metal-oxide-semiconductor field-effect transistors.
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- Nature, 2011, v. 479, n. 7373, p. 310, doi. 10.1038/nature10676
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Nanometre-scale electronics with III-V compound semiconductors.
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- Nature, 2011, v. 479, n. 7373, p. 317, doi. 10.1038/nature10677
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Novel Silica Hybrid Xerogels Prepared by Co-Condensation of TEOS and ClPhTEOS: A Chemical and Morphological Study.
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- Gels (2310-2861), 2022, v. 8, n. 10, p. N.PAG, doi. 10.3390/gels8100677
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Analytical study of high absorption region of the absorption edge of a-Si:H using nonlinear regression method.
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- Iraqi Journal of Physics, 2018, v. 16, n. 37, p. 88, doi. 10.20723/ijp.16.37.88-97
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全芳香族可溶性聚酰亚胺的 合成与应用研究进展.
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- Plastics Science & Technology / Suliao Ke-Ji, 2022, v. 50, n. 5, p. 123, doi. 10.15925/j.cnki.issn1005-3360.2022.05.025
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Identification of Important Parameters for Laser Photoresist Removal Process Through the Use of Adaptive Neuro-Fuzzy Inference System (ANFIS) Methodology.
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- International Journal of Laser Science: Fundamental Theory & Analytical Methods, 2021, v. 2, n. 3/4, p. 181
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Entre o local e o internacional: Jota Soares e a cultura cinematográfica no Recife.
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- Imagofagia, 2019, n. 20, p. 371
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Nanoelectronics Based on Carbon Nanotubes: Technological Challenges and Recent Developments.
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- Fullerenes, Nanotubes & Carbon Nanostructures, 2005, v. 13, p. 255, doi. 10.1081/FST-200039292
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AMPS-1D Modeling of a-Si:H n + -i-n + Structure: the Validity of Space Charge Limited Current Analysis.
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- Turkish Journal of Physics, 2004, v. 28, n. 1, p. 31
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