Works matching DE "SEMICONDUCTOR industry"

Results: 2459

Higher-Order Singular BVP Emerging in the Semiconductor Industry: Analysis and Computation of Solutions.

Published in:

Journal of Applied & Computational Mechanics, 2025, v. 11, n. 3, p. 568, doi. 10.22055/jacm.2024.47592.4747

By:

Manini, Pratikshya;
Pandit, Biswajit;
Priyanka, B. R.;
Agarwal, Ravi P.

Publication type:

Article

The European Union. Taiwan, and the Silicon Shield argument: a conceptual assessment through the lens of grand theories.

Published in:

European Politics & Society, 2025, v. 26, n. 3, p. 537, doi. 10.1080/23745118.2024.2417028

By:

Weil, Steffi;
Gottwald, Joern Carsten;
Taube, Markus

Publication type:

Article

Frequency-comb-referenced multiwavelength interferometry for high-precision and high-speed 3D measurement in heterogeneous semiconductor packaging.

Published in:

Nanophotonics (21928606), 2025, v. 14, n. 10, p. 1563, doi. 10.1515/nanoph-2024-0578

By:

Park, Jun Hyung;
Kim, Dae Hee;
Chu, Huy Hoang;
Hahm, Ji Won;
Kang, Guseon;
Lee, Dongil;
Song, Seyong;
Kang, Mingu;
Kim, Seung-Woo;
Kim, Young-Jin

Publication type:

Article

Semiconductor supply chain resilience and disruption: insights, mitigation, and future directions.

Published in:

International Journal of Production Research, 2025, v. 63, n. 9, p. 3442, doi. 10.1080/00207543.2024.2387074

By:

Xiong, Wei;
Wu, David D.;
Yeung, Jeff H. Y.

Publication type:

Article

Improving Engineering Performance through Leadership, CE and Teamwork in a Malaysian Semiconductor Firm.

Published in:

Pertanika Journal of Social Sciences & Humanities, 2014, v. 22, n. 1, p. 307

By:

Kiat Ng, Poh;
Kian Siong Jee;
Jian Ai Yeow;
Mahadi, Masyitah

Publication type:

Article

Make or break China's foundry industry.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 34

By:

Addison, Craig

Publication type:

Article

Amkor knocks down back-end operation costs.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 24

By:

Burggraaf, Pieter

Publication type:

Article

WORLD NEWS.

Published in:: Solid State Technology, 2001, v. 44, n. 11, p. 16
Publication type:: Article

Where are they now?

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 32

By:

Xu, Arthur

Publication type:

Article

Asia Pacific outlook.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 42

By:

Vogler, Debra

Publication type:

Article

A relative newcomer, but statistics put New Mexico 10th in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S34

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Not like its neighbors, but Colorado is still 11th in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S42

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

From Motorola's historic lab to today: Arizona ranks 3rd in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S29

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Utah's wafer fabs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S26

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Fabs are good neighbors, too.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. S16
Publication type:: Article

Growing from Kilby's invention to today: Texas is 2nd in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S11

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Regional concentration of fabs totals approximately 10% of industry's capacity.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S7

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Challenge for the new millennium: Managing mask costs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 154

By:

Rygler, Kenneth A.

Publication type:

Article

Tough competition ahead from new Japanese wafer fabs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 36

By:

Nagahro, Yasuaki

Publication type:

Article

Tech Briefs.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 26
Publication type:: Article

B-to-B sees second monthly uptick.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 18
Publication type:: Article

China: The sleeping dragon stirs.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. S6
Publication type:: Article

ASIA PACIFIC.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 20
Publication type:: Article

EUROPE.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 20
Publication type:: Article

JAPAN.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 18
Publication type:: Article

USA.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 16
Publication type:: Article

Chip sales down for July; N.A. tool orders up third month in a row.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 16
Publication type:: Article

The coming world of nano- and pico-technology.

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

Asia's silicon foundries.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. S9

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Attendees challenged by economy.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 32
Publication type:: Article

New challenges, new solutions.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 22
Publication type:: Article

Is chipmaking skill still a differentiator?

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

How TSMC Fab 6 got up and running.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. S19

By:

Tsai, Nun-Sian

Publication type:

Article

In the age of 300mm silicon, tech standards are even more crucial.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 128

By:

Gehman, Bruce L.

Publication type:

Article

Singapore pours it on even in rough waters.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 38

By:

Sitathan, Tony

Publication type:

Article

Cycle time, 300mm in spotlight at automation conference.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 34

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Asia Pacific.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 24
Publication type:: Article

STATS steps up role of package modeling.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 30

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Japan.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 22
Publication type:: Article

SMIF Integration and mini-environments cause users most grief.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 20
Publication type:: Article

WORLDWIDE HIGHLIGHTS.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 18
Publication type:: Article

Partner for profit using the gainshare IP fee model.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 271

By:

Kibarian, John K.

Publication type:

Article

Europe.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 24
Publication type:: Article

New metrology challenges met by elastic probe technology.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 177

By:

Howland, William H.;
Hillard, Robert J.

Publication type:

Article

USA.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 18
Publication type:: Article

Economics will dictate the future.

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

PRODUCT PANORAMA.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 209
Publication type:: Article

Catalytic technology for PFC emissions control.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 189

By:

Brown, Roy S.;
Rossin, Joseph A.;
Aitchison, Kenneth

Publication type:

Article

Chipmakers to compete with assembly houses for SiP.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 51
Publication type:: Article

WORLD NEWS.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 24
Publication type:: Article