The optimal configuration for various placement machines in PCB assembly lines.
- Published in:
- Annals of Operations Research, 2025, v. 349, n. 1, p. 365, doi. 10.1007/s10479-024-05828-6
- By:
- Publication type:
- Article
Works matching DE "PRINTED circuits industry"
Results: 233
1
2
A complete PLC on a chip?
- Published in:
- Computing & Control Engineering, 2004, v. 15, n. 5, p. 39, doi. 10.1049/cce:20040508
- By:
- Publication type:
- Article
3
Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 12910, doi. 10.1007/s10854-018-9410-8
- By:
- Publication type:
- Article
4
Investigation of moisture uptake into printed circuit board laminate and solder mask materials.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 8, p. 6138, doi. 10.1007/s10854-016-6292-5
- By:
- Publication type:
- Article
5
Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 5106, doi. 10.1007/s10854-015-3037-9
- By:
- Publication type:
- Article
6
AUTOMATED TEMPERATURE AND HUMIDITY CONTROL AND MONITORING SYSTEM FOR IMPROVING THE PERFORMANCE IN DRYING SYSTEM.
- Published in:
- Eurasian Physical Technical Journal, 2023, v. 20, n. 2, p. 32, doi. 10.31489/2023No2/32-40
- By:
- Publication type:
- Article
7
某印制电路板企业清洁生产评价体系构建与探讨.
- Published in:
- Electroplating & Finishing, 2022, v. 41, n. 21, p. 1558, doi. 10.19289/j.1004-227x.2022.21.013
- By:
- Publication type:
- Article
8
HYBRID MULTI-AGENT AND IMMUNE ALGORITHM APPROACH TO HYBRID FLOW SHOPS SCHEDULING WITH SDST.
- Published in:
- Academic Journal of Manufacturing Engineering, 2020, v. 18, n. 3, p. 120
- By:
- Publication type:
- Article
9
Setup Time Reduction for Electronics Assembly: Combining Simple (SMED) and IT-Based Methods.
- Published in:
- Production & Operations Management, 2005, v. 14, n. 2, p. 205, doi. 10.1111/j.1937-5956.2005.tb00019.x
- By:
- Publication type:
- Article
10
Scheduling Hybrid Flowshops in Printed Circuit Board Assembly Lines.
- Published in:
- Production & Operations Management, 2002, v. 11, n. 2, p. 216, doi. 10.1111/j.1937-5956.2002.tb00492.x
- By:
- Publication type:
- Article
11
ELECTROCHEMICAL RECYCLING OF WASTE PRINTED CIRCUIT BOARDS IN BROMIDE MEDIA. PART I: PRELIMINARY LEACHING AND DISMANTLING TESTS.
- Published in:
- Studia Universitatis Babes-Bolyai, Chemia, 2017, v. 62, n. 3, p. 177, doi. 10.24193/subbchem.2017.3.14
- By:
- Publication type:
- Article
12
Estimating Emissions From Your Printed Circuit Board.
- Published in:
- EE: Evaluation Engineering, 2007, v. 46, n. 3, p. 70
- By:
- Publication type:
- Article
13
The Companies We Keep: Effects of Relational Embeddedness on Organizational Performance.
- Published in:
- Sociological Forum, 2011, v. 26, n. 3, p. 527, doi. 10.1111/j.1573-7861.2011.01261.x
- By:
- Publication type:
- Article
14
Effects of 2-aminothiazoline and benzotriazole on copper foil etching.
- Published in:
- Transactions of the Institute of Metal Finishing, 2025, v. 103, n. 3, p. 125, doi. 10.1080/00202967.2025.2485551
- By:
- Publication type:
- Article
15
Results from Applied Research Projects in the Surface Engineering and Printed Circuit Sectors.
- Published in:
- Transactions of the Institute of Metal Finishing, 2012, v. 90, n. 4, p. 172, doi. 10.1179/0020296712Z.00000000043
- Publication type:
- Article
16
Susonence - a new multi-partner project.
- Published in:
- Transactions of the Institute of Metal Finishing, 2012, v. 90, n. 2, p. 63, doi. 10.1179/174591911X13188464808911
- Publication type:
- Article
17
Recent progress in pulse reversal plating of copper for electronics applications.
- Published in:
- Transactions of the Institute of Metal Finishing, 2007, v. 85, n. 1, p. 40, doi. 10.1179/174591907X161973
- By:
- Publication type:
- Article
18
Application of Contactless Testing to PCBs with BGAs and Open Sockets.
- Published in:
- Journal of Electronic Testing, 2015, v. 31, n. 4, p. 339, doi. 10.1007/s10836-015-5535-3
- By:
- Publication type:
- Article
19
Parametric Optimization of Double-Sided Printed Circuit Board With Triple Modal Reservation Accounting Failures.
- Published in:
- Electrica, 2023, v. 23, n. 2, p. 338, doi. 10.5152/electrica.2023.22078
- By:
- Publication type:
- Article
20
Preparation and Characterization of Adsorbent from Waste Printed Circuit Boards.
- Published in:
- Journal of Solid Waste Technology & Management, 2015, v. 41, n. 4, p. 996
- By:
- Publication type:
- Article
21
Advances in Producing Functional Circuits on Biodegradable PCBs.
- Published in:
- Periodica Polytechnica: Electrical Engineering & Computer Science, 2016, v. 60, n. 4, p. 223, doi. 10.3311/PPee.9690
- By:
- Publication type:
- Article
22
Grouping of PCB assembly jobs in the case of flexible feeder units.
- Published in:
- Engineering Optimization, 2005, v. 37, n. 1, p. 29, doi. 10.1080/03052150412331271226
- By:
- Publication type:
- Article
23
CHIPS HAS PASSED Now Comes the Hard Work.
- Published in:
- STEPS: Science, Technology, Engineering & Policy Studies, 2022, n. 7, p. 62
- By:
- Publication type:
- Article
24
A Low Profile, Broadband Linearly and Circularly Polarized Cavity Backed Antenna Using Halved-Dual Mode SIW Cavity.
- Published in:
- Applied Computational Electromagnetics Society Journal, 2016, v. 31, n. 8, p. 953
- By:
- Publication type:
- Article
25
A Single-Channel Non-Orthogonal I/Q RF Sensor for Non-Contact Monitoring of Vital Signs.
- Published in:
- Applied Computational Electromagnetics Society Journal, 2016, v. 31, n. 6, p. 603
- By:
- Publication type:
- Article
26
Susceptibility of a Simple Transmission Line Inside an Enclosure Against Normal Incident Plane Wave.
- Published in:
- Applied Computational Electromagnetics Society Journal, 2014, v. 29, n. 5, p. 428
- By:
- Publication type:
- Article
27
Using the Fuzzy DEMATEL to Determine Environmental Performance: A Case of Printed Circuit Board Industry in Taiwan.
- Published in:
- PLoS ONE, 2015, v. 10, n. 6, p. 1, doi. 10.1371/journal.pone.0129153
- By:
- Publication type:
- Article
28
Mathematical methods for physical layout of printed circuit boards: an overview.
- Published in:
- OR Spectrum, 2008, v. 30, n. 3, p. 453, doi. 10.1007/s00291-007-0080-9
- By:
- Publication type:
- Article
29
A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice.
- Published in:
- International Journal of Electrical Engineering Education, 2017, v. 54, n. 3, p. 208, doi. 10.1177/0020720916673650
- By:
- Publication type:
- Article
30
Particle size distribution and water recovery under the natural hydrophobic response flotation of printed circuit board comminution fines.
- Published in:
- Minerals & Metallurgical Processing, 2013, v. 30, n. 2, p. 85
- By:
- Publication type:
- Article
31
BY THE NUMBERS.
- Published in:
- EE: Evaluation Engineering, 2019, v. 58, n. 6, p. 2
- Publication type:
- Article
32
BY THE NUMBERS.
- Published in:
- 2019
- Publication type:
- Chart/Diagram/Graph
33
Tools from software to X-ray systems round out PCB test and inspection.
- Published in:
- EE: Evaluation Engineering, 2018, v. 57, n. 2, p. 12
- By:
- Publication type:
- Article
34
Designer adaptation in the changing PCB industry.
- Published in:
- EE: Evaluation Engineering, 2017, v. 56, n. 11, p. 20
- By:
- Publication type:
- Article
35
The evolution of Industry 4.0, through the eyes of the PCB manufacturer.
- Published in:
- EE: Evaluation Engineering, 2017, v. 56, n. 7, p. 20
- By:
- Publication type:
- Article
36
Systems and software address testability.
- Published in:
- EE: Evaluation Engineering, 2016, v. 55, n. 3, p. 14
- By:
- Publication type:
- Article
37
IPC sees moderate domestic PCB production growth through 2017.
- Published in:
- EE: Evaluation Engineering, 2016, v. 55, n. 2, p. 4
- Publication type:
- Article
38
Maintaining high-speed signal integrity.
- Published in:
- EE: Evaluation Engineering, 2015, v. 54, n. 9, p. 26
- By:
- Publication type:
- Article
39
EE INDUSTRY UPDATE.
- Published in:
- EE: Evaluation Engineering, 2014, v. 53, n. 12, p. 6
- Publication type:
- Article
40
EE INDUSTRY UPDATE.
- Published in:
- EE: Evaluation Engineering, 2014, v. 53, n. 11, p. 6
- Publication type:
- Article
41
JTAG and Embedded Test Complement ATE.
- Published in:
- EE: Evaluation Engineering, 2014, v. 53, n. 3, p. 14
- By:
- Publication type:
- Article
42
Ecologically clean solder based on Sn-Ag-Cu.
- Published in:
- Welding International, 2011, v. 25, n. 7, p. 531, doi. 10.1080/09507116.2011.554256
- By:
- Publication type:
- Article
43
Printed circuit board joining technology for notebook PC and HDD.
- Published in:
- Welding International, 2008, v. 22, n. 1, p. 44, doi. 10.1080/09507110801936127
- By:
- Publication type:
- Article
44
Power loss and radiated field from microwave microstrip floating lines in resonance.
- Published in:
- Canadian Journal of Physics, 2004, v. 82, n. 12, p. 1053, doi. 10.1139/P04-050
- By:
- Publication type:
- Article
45
No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics.
- Published in:
- Journal of Electronic Materials, 2019, v. 48, n. 2, p. 1207, doi. 10.1007/s11664-018-06862-4
- By:
- Publication type:
- Article
46
Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 4, p. 1116, doi. 10.1007/s11664-014-3609-0
- By:
- Publication type:
- Article
47
Reliability Testing of WLCSP Lead-Free Solder Joints.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1032, doi. 10.1007/BF02692564
- By:
- Publication type:
- Article
48
Designing a yield-based skip-lot sampling plan for lot acceptance determination.
- Published in:
- Journal of the Operational Research Society, 2022, v. 73, n. 3, p. 653, doi. 10.1080/01605682.2020.1854630
- By:
- Publication type:
- Article
49
An efficient genetic algorithm for setup time minimization in PCB assembly.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 973, doi. 10.1007/s00170-014-6510-3
- By:
- Publication type:
- Article
50
Interaction of cemented carbide micro-drills and printed circuit boards during micro-drilling.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 1305, doi. 10.1007/s00170-014-6520-1
- By:
- Publication type:
- Article