Works matching DE "ELECTRONIC packaging materials"
1
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2430, doi. 10.1007/s10854-015-4042-8
- Suhir, E.;
- Ghaffarian, R.;
- Nicolics, J.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4889, doi. 10.1007/s10854-014-2249-8
- Zhu, Xuewei;
- Wang, Richu;
- Peng, Chaoqun;
- Liu, Wenshui;
- Peng, Jian
- Article
3
- Materials Science & Technology, 2013, v. 29, n. 3, p. 326, doi. 10.1179/1743284712Y.0000000152
- Article
4
- International Journal for Computational Methods in Engineering Science & Mechanics, 2018, v. 19, n. 2, p. 61, doi. 10.1080/15502287.2018.1430074
- S., Saravanan;
- S., Prabhu;
- R., Muthukumar;
- S., Gowtham Raj;
- S., Arun Veerabagu
- Article
5
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2631, doi. 10.1007/s11664-012-2145-z
- Shnawah, Dhafer;
- Said, Suhana;
- Sabri, Mohd;
- Badruddin, Irfan;
- Che, Fa
- Article
6
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2508, doi. 10.1007/s11664-012-2179-2
- Han, Sungwon;
- Osterman, Michael;
- Meschter, Stephan;
- Pecht, Michael
- Article
