Title: Investigation of microstructure evolution and mechanical properties of 2024 Al/Al<sub>2</sub>O<sub>3</sub> ceramic joints.
Authors: Li, Yuxiang; Chen, Chao; Li, Haijun; Wu, Jinliang; He, Linzhe; Yi, Ruixiang
Abstract: Low-temperature solder was used to join 2024 Al and Al2O3 ceramic by an ultrasonic-assisted soldering process. Strong bonding between solder alloy and Al2O3 ceramic could be obtained when the reactive wetting happened. Al2O3 was formed during the reactive wetting process, and it is supposed to determine the joining strength of 2024 Al/Al2O3 ceramic joints. The increase of product Al2O3 strengthened the bonding of solder and Al2O3 ceramic. To improve the mechanical behaviour of 2024 Al/Al2O3 ceramic joints, SHBF160 glass powder was added to solder to strengthen the bonding between solder and Al2O3. The shear strength of 2024 Al/Al2O3 ceramic joint increased to 69 MPa owing to the positive reinforcement of glass powder.
Subjects: POWDERED glass; SOLDER & soldering; MICROSTRUCTURE; ALUMINUM alloys; SHEAR strength; ALUMINUM composites; ALUMINUM oxide
Publication: Science & Technology of Welding & Joining, 2022, Vol 27, Issue 2, p114
ISSN: 1362-1718
Publication type: Academic Journal
DOI: 10.1080/13621718.2021.2014743

Investigation of microstructure evolution and mechanical properties of 2024 Al/Al<sub>2</sub>O<sub>3</sub> ceramic joints.

Li, Yuxiang; Chen, Chao; Li, Haijun; Wu, Jinliang; He, Linzhe; Yi, Ruixiang