Works matching DE "PLASTIC embedment of electronic equipment"

Results: 151

Redox-Triggered Self-Rolling Robust Hydrogel Tubes for Cell Encapsulation.

Published in:

Macromolecular Rapid Communications, 2014, v. 35, n. 3, p. 344, doi. 10.1002/marc.201300784

By:

Liu, Lu;
Wang, Ning;
Han, Yanjiao;
Li, Yongmao;
Liu, Wenguang

Publication type:

Article

A graphical peak analysis method for characterizing impurities in SiC, GaN and diamond from temperature-dependent majority-carrier concentration.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 720, doi. 10.1007/s10854-007-9390-6

By:

Matsuura, Hideharu

Publication type:

Article

Numerical modeling of the performance of thermoelectric module with polydimethylsiloxane encapsulation.

Published in:

International Journal of Energy Research, 2018, v. 42, n. 3, p. 1287, doi. 10.1002/er.3928

By:

Shi, Yaoguang;
Wang, Yancheng;
Mei, Deqing;
Chen, Zichen

Publication type:

Article

Air and Water‐Stable n‐Type Doping and Encapsulation of Flexible MoS<sub>2</sub> Devices with SU8.

Published in:

Advanced Electronic Materials, 2019, v. 5, n. 1, p. N.PAG, doi. 10.1002/aelm.201800492

By:

Kung, Yen‐Cheng;
Hosseini, Nahid;
Dumcenco, Dumitru;
Fantner, Georg E.;
Kis, Andras

Publication type:

Article

Coaxial-Structured Weavable and Wearable Electroluminescent Fibers.

Published in:

Advanced Electronic Materials, 2017, v. 3, n. 12, p. n/a, doi. 10.1002/aelm.201700401

By:

Liang, Guojin;
Yi, Ming;
Hu, Haibo;
Ding, Ke;
Wang, Lei;
Zeng, Haibo;
Tang, Jiang;
Liao, Lei;
Nan, Cewen;
He, Yunbin;
Ye, Changhui

Publication type:

Article

65.1: Invited Paper: World 1<sup>st</sup> Large Size 18-inch Flexible OLED Display and the Key Technologies.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 962, doi. 10.1002/sdtp.10275

By:

Yoon, Jonggeun;
Kwon, Hoiyong;
Lee, Mireum;
Yu, Youn‐yeol;
Cheong, Nuri;
Min, Sungjoon;
Choi, Jaekyung;
Im, Hunbae;
Lee, Kwonhyung;
Jo, Jungsik;
Kim, Hojin;
Choi, Hyunmin;
Lee, Yongbaek;
Yoo, Choongkeun;
Kuk, Seunghee;
Cho, Mingu;
Kwon, Seyeoul;
Park, Weonseo;
Yoon, Sooyoung;
Kang, Inbyeong

Publication type:

Article

P-87: Applying Low Temperature Thin Film Encapsulation to 6-inch IGZO Flexible AMOLED.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 1480, doi. 10.1002/sdtp.10034

By:

Lai, Ming‐Hsiang;
Liu, Sheng‐Fa;
Huang, Ching‐Yu;
Chiou, Ji‐Yi;
Chiu, Yi‐Wen;
Liu, Yen‐Wei;
Niu, Yi‐Fan

Publication type:

Article

P-94: Ultra-thin Graphene Oxide/Polymer Multi-Layer Encapsulation for Flexible OLED Displays.

Published in:

SID Symposium Digest of Technical Papers, 2014, v. 45, n. 1, p. 1340, doi. 10.1002/j.2168-0159.2014.tb00353.x

By:

Lee, Wha‐Yong;
Yang, Seung‐Yeol;
Jeon, Jin‐Nam;
Cho, Young Jae;
Kwon, Yongwoo;
Kim, Yong‐Seog

Publication type:

Article

21.3: A 65-inch Amorphous Oxide Thin Film Transistors Active-Matrix Organic Light-Emitting Diode Television Using Side by Side and Fine Metal Mask Technology.

Published in:

2013

By:

Chen, Chia-Yu;
Lin, Li-Fong;
Lee, Jen-Yu;
Wu, Wen-Hao;
Wang, San-Chi;
Chiang, Yuan Ming;
Chen, Yu-Hung;
Chen, Chih-Cheng;
Chen, Chih-Lei;
Shih, Tsung-Hsiang;
Liu, Chun-Hsin;
Ting, Hung-Che;
Lu, Hsueh-Hsing;
Tsai, Lun;
Lin, Hong-Shen;
Chang, Lee-Hsun;
Lin, Yu-Hsin

Publication type:

Other

P.40: Encapsulated Flexible Organic Light-Emitting Diodes: Progress Toward a Simple and Cost Effective Contact Printing Technique.

Published in:

2013

By:

Kim, Hakkoo;
Song, Eun Ho;
Choi, Kyung Bok;
Hwang, Ju Hyun;
Park, Young Wook;
Ju, Byeong Kwon

Publication type:

Other

P.141L: Late-News Poster: ALD-based Multilayer Encapsulation of PIN OLED: On the Stability of the Organic Layer in 85°C / 85% RH Storage Conditions.

Published in:

2013

By:

Yves, Simon Jean;
Maindron, Tony;
Aventurier, Bernard;
Gatta, Sylvia Meunier Della;
Viasnoff, Emilie;
Jullien, Tony;
Ghazouani, Ahlem;
Lafond, Dominique

Publication type:

Other

Flexible OLEDs for Lighting Applications.

Published in:

SID Symposium Digest of Technical Papers, 2012, v. 43, n. 1, p. 772, doi. 10.1002/j.2168-0159.2012.tb05898.x

By:

Ma, Ruiqing;
Pang, Huiqing;
Mandlik, Prashant;
Levermore, Peter A.;
Rajan, Kamala;
Silvernail, Jeffrey;
Krall, Emory;
Paynter, Jason;
Hack, Mike;
Brown, Julie J.

Publication type:

Article

Lifetime Measurement and Reliability upon Storage of Thin-Film Encapsulated PIN OLED.

Published in:

SID Symposium Digest of Technical Papers, 2012, v. 43, n. 1, p. 1520, doi. 10.1002/j.2168-0159.2012.tb06102.x

By:

Maindron, Tony;
Doyeux, Henri;
Kanaan, Hani;
Simon, Jean-Yves;
Viasnoff, Emile

Publication type:

Article

Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding.

Published in:

Journal of Polymer Engineering, 2023, v. 43, n. 2, p. 179, doi. 10.1515/polyeng-2022-0150

By:

Ott, Constantin;
Drummer, Dietmar

Publication type:

Article

Experimental Investigation of the Influence of an Encapsulation Layer on the Lightning Current Characteristics of YBCO Tapes.

Published in:

Journal of Superconductivity & Novel Magnetism, 2017, v. 30, n. 6, p. 1413, doi. 10.1007/s10948-017-3990-z

By:

Hu, D.;
He, Y.;
Li, Z.;
Mi, T.

Publication type:

Article

Sir Georg Solti and the Record Industry.

Published in:

ARSC Journal, 2010, v. 41, n. 2, p. 200

By:

Patmore, David N. C.

Publication type:

Article

Improving performance and energy efficiency of embedded processors via post-fabrication instruction set customization.

Published in:

Journal of Supercomputing, 2012, v. 60, n. 2, p. 196, doi. 10.1007/s11227-010-0505-0

By:

Noori, Hamid;
Mehdipour, Farhad;
Inoue, Koji;
Murakami, Kazuaki

Publication type:

Article

Solution-processed white graphene-reinforced ferroelectric polymer nanocomposites with improved thermal conductivity and dielectric properties for electronic encapsulation.

Published in:

Journal of Polymer Research, 2017, v. 24, n. 2, p. 1, doi. 10.1007/s10965-017-1189-4

By:

Deshmukh, Kalim;
Ahamed, M.;
Sadasivuni, Kishor;
Ponnamma, Deepalekshmi;
Deshmukh, Rajendra;
Trimukhe, Ajinkya;
Pasha, S.;
Polu, Anji;
AlMaadeed, Mariam;
Chidambaram, K.

Publication type:

Article

Cycloaliphatic epoxy resin modified by two kinds of oligo-fluorosiloxanes for potential application in light-emitting diode (LED) encapsulation.

Published in:

Journal of Polymer Research, 2012, v. 19, n. 8, p. 1, doi. 10.1007/s10965-012-9923-4

By:

Gao, Nan;
Liu, WeiQu;
Ma, SongQi;
Tang, Chunyi;
Yan, ZhenLong

Publication type:

Article

Foldable and washable textile-based OLEDs with a multi-functional near-room-temperature encapsulation layer for smart e-textiles.

Published in:

NPJ Flexible Electronics, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41528-021-00112-0

By:

Jeong, So Yeong;
Shim, Hye Rin;
Na, Yunha;
Kang, Ki Suk;
Jeon, Yongmin;
Choi, Seungyeop;
Jeong, Eun Gyo;
Park, Yong Cheon;
Cho, Ha-Eun;
Lee, Junwoo;
Kwon, Jeong Hyun;
Im, Sung Gap;
Choi, Kyung Cheol

Publication type:

Article

An examination of household solid waste generation in a Mekong Delta City, Vietnam.

Published in:

Journal of Solid Waste Technology & Management, 2010, v. 36, n. 1, p. 526

By:

Thanh, Nguyen P.;
Matsui, Yasuhiro;
Fujiwara, Takeshi

Publication type:

Article

Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition.

Published in:

Journal of Sensors & Sensor Systems, 2014, v. 3, n. 2, p. 335, doi. 10.5194/jsss-3-335-2014

By:

Gembaczka, P.;
Görtz, M.;
Celik, Y.;
Jupe, A.;
Stühlmeyer, M.;
Goehlich, A.;
Vogt, H.;
Mokwa, W.;
Kraft, M.

Publication type:

Article

Accounting for data encapsulation in the measurement of object-oriented class cohesion.

Published in:

Journal of Software: Evolution & Process, 2015, v. 27, n. 5, p. 373, doi. 10.1002/smr.1714

By:

Al Dallal, Jehad

Publication type:

Article

New Products.

Published in:: 2012
Publication type:: Product Review

Volume structuring of high power LED encapsulates by femtosecond laser direct writing.

Published in:

Applied Physics A: Materials Science & Processing, 2008, v. 93, n. 2, p. 421, doi. 10.1007/s00339-008-4779-5

By:

Kuna, L.;
Sommer, C.;
Zinterl, E.;
Krenn, J. R.;
Pachler, P.;
Hartmann, P.;
Tasch, S.;
Leising, G.;
Wenzl, F. P.

Publication type:

Article

UNIFIED COHESION MEASURES FOR ASPECT-ORIENTED SYSTEMS.

Published in:

International Journal of Software Engineering & Knowledge Engineering, 2011, v. 21, n. 1, p. 143, doi. 10.1142/S0218194011005128

By:

KUMAR, AVADHESH;
KUMAR, RAJESH;
GROVER, P. S.

Publication type:

Article

DC electrical stimulation enhances proliferation and differentiation on N2a and MC3T3 cell lines.

Published in:

Journal of Biological Engineering, 2022, v. 16, n. 1, p. 1, doi. 10.1186/s13036-022-00306-8

By:

Martín, Daniel;
Bocio-Nuñez, J.;
Scagliusi, Santiago F.;
Pérez, Pablo;
Huertas, Gloria;
Yúfera, Alberto;
Giner, Mercè;
Daza, Paula

Publication type:

Article

What is a reed relay?

Published in:

EE: Evaluation Engineering, 2016, v. 55, n. 4, p. 18

By:

Dale, Graham

Publication type:

Article

Rational design of vapor‐deposited self‐crosslinking polymer for transparent flexible oxygen barrier coatings.

Published in:

Journal of Applied Polymer Science, 2021, v. 138, n. 21, p. 1, doi. 10.1002/app.50505

By:

Sheng, Weijie;
Chen, Ying;
Mao, Haizhuo;
Li, Yanshuo;
Xiao, Xinle;
Wang, Chunting;
Ye, Yumin;
Liu, Wenna

Publication type:

Article

Synthesis of the lead, arsenic, and bismuth chalcogenides with liquid encapsulation.

Published in:

Semiconductors, 2011, v. 45, n. 9, p. 1242, doi. 10.1134/S106378261109020X

By:

Tallerchik, B.;
Boiko, S.;
Shtelmah, S.

Publication type:

Article

Modeling embroidered contacts for electronics in textiles.

Published in:

Journal of the Textile Institute, 2012, v. 103, n. 6, p. 644, doi. 10.1080/00405000.2011.597568

By:

Linz, Torsten;
Simon, ErikP.;
Walter, Hans

Publication type:

Article

Cyanate Ester-Based Encapsulation Material for High-Temperature Applications.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 9, p. 2803, doi. 10.1007/s11664-013-2665-1

By:

Chidambaram, Vivek;
Rong, Eric;
Lip, Gan;
Daniel, Rhee

Publication type:

Article

Thermal behavior of epoxy blends for light emitting diode encapsulation.

Published in:

e-Polymers, 2012, n. 91, p. 1

By:

Tan, Seah-Guan;
Chow, Wen-Shyang

Publication type:

Article

Failure detectors encapsulate fairness.

Published in:

Distributed Computing, 2012, v. 25, n. 4, p. 313, doi. 10.1007/s00446-012-0164-x

By:

Pike, Scott;
Sastry, Srikanth;
Welch, Jennifer

Publication type:

Article

Structural integrity investigations of spent nuclear fuel with finite element modeling.

Published in:

Safety of Nuclear Waste Disposal, 2021, v. 1, p. 13, doi. 10.5194/sand-1-13-2021

By:

Vlassopoulos, Efstathios;
Pudollek, Susanne;
Alifieris, Olympios;
Papaioannou, Dimitrios;
Nasyrow, Ramil;
Gretter, Ralf;
Rondinella, Vincenzo V.;
Caruso, Stefano

Publication type:

Article

Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic.

Published in:

Journal of the Air & Waste Management Association (Taylor & Francis Ltd), 2014, v. 64, n. 9, p. 1085, doi. 10.1080/10962247.2014.911221

By:

Muniyandi, Shantha Kumari;
Sohaili, Johan;
Hassan, Azman

Publication type:

Article

An orthogonal array based genetic algorithm for developing neural network based process models of fluid dispensing.

Published in:

International Journal of Production Research, 2006, v. 44, n. 22, p. 4815, doi. 10.1080/00207540600620880

By:

Kwong, C. K.;
Chan, K. Y.;
Aydin, M. E.;
Fogarty, T. C.

Publication type:

Article

Fuzzy regression approach to process modelling and optimization of epoxy dispensing.

Published in:

International Journal of Production Research, 2005, v. 43, n. 12, p. 2359, doi. 10.1080/00207540500046137

By:

Kwong *, C. K.;
Bai, H.

Publication type:

Article

Requirements and solutions to software encapsulation and engineering in next generation manufacturing systems: OOONEIDA approach.

Published in:

International Journal of Computer Integrated Manufacturing, 2005, v. 18, n. 7, p. 572, doi. 10.1080/09511920500069507

By:

Auinger, F.;
Brennan, R.;
Christensen, J.;
Martinez Lastra, J.L.;
Vyatkin, V.

Publication type:

Article

Thermal and Electromagnetic Combined Optimization Design of Dry Type Air Core Reactor.

Published in:

Energies (19961073), 2017, v. 10, n. 12, p. 1989, doi. 10.3390/en10121989

By:

Fating Yuan;
Zhao Yuan;
Lixue Chen;
Yong Wang;
Junxiang Liu;
Junjia He;
Yuan Pan

Publication type:

Article

Beyond Thermal Interaction between Ocean and Atmosphere: On the Extratropical Climate Variability due to the Wind-Induced SST.

Published in:

Journal of Climate, 2008, v. 21, n. 10, p. 2001, doi. 10.1175/2007JCLI1532.1

By:

Dong Eun Lee;
Zhengyu Liu;
Yun Liu

Publication type:

Article

EVALUATION OF ENCAPSULATED EQUIPMENT.

Published in:

Annals of the University of Petrosani Electrical Engineering, 2018, v. 20, p. 5

By:

COLDA, COSMIN;
BURIAN, SORIN;
DARIE, MARIUS;
CSASZAR, TIBERIU;
GRECEA, DĂNUĂ

Publication type:

Article

On the Construction of Public Key Encryption with Sender Recovery.

Published in:

International Journal of Foundations of Computer Science, 2015, v. 26, n. 1, p. 1, doi. 10.1142/S012905411550001X

By:

Wei, Puwen;
Zheng, Yuliang

Publication type:

Article

Thermoplastic encapsulations of a sensor platform by high‐temperature injection molding up to 360°C.

Published in:

Polymer Engineering & Science, 2019, v. 59, n. 7, p. 1315, doi. 10.1002/pen.25114

By:

Werner, Valerie M. K.;
Krumpholz, Roman;
Rehekampff, Christoph;
Scherzer, Tim;
Eblenkamp, Markus

Publication type:

Article

Aerodynamic Characteristics and Design Guidelines of Push–Pull Ventilation Systems.

Published in:

Annals of Occupational Hygiene, 2005, v. 49, n. 1, p. 1, doi. 10.1093/annhyg/meh065

By:

HUANG, R. F.;
LIN, S. Y.;
JAN, S.-Y.;
HSIEH, R. H.;
CHEN, Y.-K.;
CHEN, C.-W.;
YEH, W.-Y.;
CHANG, C.-P.;
SHIH, T.-S.;
CHEN, C.-C.

Publication type:

Article

Fatigue lifetime study of piezoceramic patch transducers.

Published in:

Acta Mechanica, 2013, v. 224, n. 11, p. 2529, doi. 10.1007/s00707-013-0953-8

By:

Gall, Monika;
Thielicke, Bärbel

Publication type:

Article

Adhesion of underfill and components in flip chip encapsulation.

Published in:

Journal of Adhesion Science & Technology, 2002, v. 16, n. 2, p. 213, doi. 10.1163/156856102317293713

By:

Fan, Lianhua;
Moon, Kyoung-Sik;
Wong, C. P.

Publication type:

Article

Extending the Lifetime of Perovskite Solar Cells using a Perfluorinated Dopant.

Published in:

ChemSusChem, 2016, v. 9, n. 18, p. 2708, doi. 10.1002/cssc.201601030

By:

Salado, Manuel;
Ramos, F. Javier;
Manzanares, Valentin M.;
Gao, Peng;
Nazeeruddin, Mohammad Khaja;
Dyson, Paul J.;
Ahmad, Shahzada

Publication type:

Article

Encapsulation of Perovskite Solar Cells for High Humidity Conditions.

Published in:

ChemSusChem, 2016, v. 9, n. 18, p. 2518, doi. 10.1002/cssc.201601090

By:

Dong, Qi;
Liu, Fangzhou;
Wong, Man Kwong;
Tam, Ho Won;
Djurišić, Aleksandra B.;
Ng, Annie;
Surya, Charles;
Chan, Wai Kin;
Ng, Alan Man Ching

Publication type:

Article

Local endostatin treatment of gliomas administered by microencapsulated producer cells.

Published in:

Nature Biotechnology, 2001, v. 19, n. 1, p. 29, doi. 10.1038/83471

By:

Read, Tracy-Ann;
Sorensen, Dag R.;
Mahesparan, Rupavathana;
Enger, Per Ø.;
Timpl, Rupert;
Olsen, Bjørn R.;
Hjelstuen, Mari H.B;
Haraldseth, Olav;
Bjerkvig, Rolf

Publication type:

Article