Works matching DE "WAFER-scale integration of circuits"
Results: 50
Design of due-date oriented look-ahead batching rule in wafer fabrication.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 596, doi. 10.1007/s00170-006-0723-z
- By:
- Publication type:
- Article
A hybrid look-ahead SOM-FBPN and FIR system for wafer-lot-output time prediction and achievability evaluation.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 575, doi. 10.1007/s00170-006-0741-x
- By:
- Publication type:
- Article
Development of a new cluster index for wafer defects.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 7/8, p. 705, doi. 10.1007/s00170-005-0240-5
- By:
- Publication type:
- Article
Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 1/2, p. 1, doi. 10.1007/s00170-005-0165-z
- By:
- Publication type:
- Article
High-mobility three-atom-thick semiconducting films with wafer-scale homogeneity.
- Published in:
- Nature, 2015, v. 520, n. 7549, p. 656, doi. 10.1038/nature14417
- By:
- Publication type:
- Article
The FABMAS multi-agent-system prototype for production control of water fabs: design, implementation and performance assessment.
- Published in:
- Production Planning & Control, 2006, v. 17, n. 7, p. 701, doi. 10.1080/09537280600901269
- By:
- Publication type:
- Article
A literature survey on the design approaches and operational issues of automated wafer-transport systems for wafer fabs.
- Published in:
- Production Planning & Control, 2006, v. 17, n. 7, p. 648, doi. 10.1080/09537280600900774
- By:
- Publication type:
- Article
A branch and bound algorithm to minimise total weighted tardiness on a single batch processing machine with ready times and incompatible job families.
- Published in:
- Production Planning & Control, 2006, v. 17, n. 7, p. 728, doi. 10.1080/09537280600901467
- By:
- Publication type:
- Article
A parameterized-dispatching rule for a Logic IC sort in a wafer fabrication.
- Published in:
- Production Planning & Control, 2005, v. 16, n. 5, p. 426, doi. 10.1080/09537280500110623
- By:
- Publication type:
- Article
Modeling of the MEMS Reactive Ion Etching Process Using Neural Networks.
- Published in:
- Jordan Journal of Mechanical & Industrial Engineering, 2011, v. 5, n. 4, p. 353
- By:
- Publication type:
- Article
MODELLING AND ESTIMATION OF WAFER YIELDS AND DEFECT DENSITIES FROM MICROELECTRONICS TEST STRUCTURE DATA.
- Published in:
- Quality & Reliability Engineering International, 1996, v. 12, n. 1, p. 9, doi. 10.1002/(SICI)1099-1638(199601)12:1<9::AID-QRE975>3.0.CO;2-K
- By:
- Publication type:
- Article
Electronic Packaging Reliability Assessment.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 1, p. 50
- Publication type:
- Article
A “thru-short” method for noise de-embedding of MOSFETs.
- Published in:
- Microwave & Optical Technology Letters, 2009, v. 51, n. 5, p. 1379, doi. 10.1002/mop.24330
- By:
- Publication type:
- Article
Self-Aligned Wafer-Level Integration Technology with an embedded faraday cage for substrate crosstalk suppression.
- Published in:
- Microwave & Optical Technology Letters, 2008, v. 50, n. 3, p. 829, doi. 10.1002/mop.23207
- By:
- Publication type:
- Article
De-embedding techniques for embedded microstrips.
- Published in:
- Microwave & Optical Technology Letters, 2004, v. 42, n. 1, p. 50, doi. 10.1002/mop.20204
- By:
- Publication type:
- Article
A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 1-4, p. 107, doi. 10.1007/s00170-014-6438-7
- By:
- Publication type:
- Article
Precise Patterning of Large‐Scale TFT Arrays Based on Solution‐Processed Oxide Semiconductors: A Comparative Study of Additive and Subtractive Approaches.
- Published in:
- Advanced Materials Interfaces, 2018, v. 5, n. 1, p. 1, doi. 10.1002/admi.201700981
- By:
- Publication type:
- Article
Wafer Scale Solventless Adhesive Bonding with iCVD Polyglycidylmethacrylate: Effects of Bonding Parameters on Adhesion Energies.
- Published in:
- Advanced Materials Interfaces, 2015, v. 2, n. 9, p. n/a, doi. 10.1002/admi.201500076
- By:
- Publication type:
- Article
Three-step approach for wafer sawing lane inspection.
- Published in:
- Optical Engineering, 2009, v. 48, n. 11, p. 117204, doi. 10.1117/1.3265714
- By:
- Publication type:
- Article
Ultrafast perturbation maps as a quantitative tool for testing of multi-port photonic devices.
- Published in:
- Nature Communications, 2018, v. 9, n. 1, p. 1, doi. 10.1038/s41467-018-04662-2
- By:
- Publication type:
- Article
Thin Film Transistors Using Wafer-Scale Low-Temperature MOCVD WSe.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6280, doi. 10.1007/s11664-016-4987-2
- By:
- Publication type:
- Article
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 33, doi. 10.1007/s11664-008-0560-y
- By:
- Publication type:
- Article
A new VLSI implementation of additive synthesis.
- Published in:
- Computer Music Journal, 1998, v. 22, n. 3, p. 49, doi. 10.2307/3681157
- By:
- Publication type:
- Article
Versatile pattern generation of periodic, high aspect ratio Si nanostructure arrays with sub-50-nm resolution on a wafer scale.
- Published in:
- Nanoscale Research Letters, 2013, v. 8, n. 1, p. 1, doi. 10.1186/1556-276X-8-506
- By:
- Publication type:
- Article
Wetting-Assisted Crack- and Wrinkle-Free Transfer of Wafer-Scale Graphene onto Arbitrary Substrates over a Wide Range of Surface Energies.
- Published in:
- Advanced Functional Materials, 2016, v. 26, n. 13, p. 2070, doi. 10.1002/adfm.201504551
- By:
- Publication type:
- Article
Wafer‐Scale Nanoimprint Lithography Process Towards Complementary Silicon Nanowire Field‐Effect Transistors for Biosensor Applications.
- Published in:
- Physica Status Solidi. A: Applications & Materials Science, 2018, v. 215, n. 15, p. 1, doi. 10.1002/pssa.201800234
- By:
- Publication type:
- Article
Pursuing efficiency from wafer to system.
- Published in:
- EE: Evaluation Engineering, 2015, v. 54, n. 8, p. 16
- By:
- Publication type:
- Article
WLBI and Test Churn Out KGD.
- Published in:
- EE: Evaluation Engineering, 2008, v. 47, n. 2, p. 42
- By:
- Publication type:
- Article
Testing MEMS at Wafer Level.
- Published in:
- EE: Evaluation Engineering, 2004, v. 43, n. 9, p. 20
- By:
- Publication type:
- Article
Controlling Contact Resistance.
- Published in:
- EE: Evaluation Engineering, 2004, v. 43, n. 5, p. 56
- By:
- Publication type:
- Article
Modeling and Parameter Extraction of Test Fixtures for MOSFET On-Wafer Measurements up to 60 GHz.
- Published in:
- International Journal of RF & Microwave Computer-Aided Engineering, 2013, v. 23, n. 6, p. 655, doi. 10.1002/mmce.20701
- By:
- Publication type:
- Article
Current tuned slotted Y‐branch laser for wafer thickness measurements with THz radiation.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2021, v. 57, n. 24, p. 936, doi. 10.1049/ell2.12314
- By:
- Publication type:
- Article
Future bright with copper, low-k, 300mm, shrink.
- Published in:
- Solid State Technology, 2001, v. 44, n. 9, p. 20
- Publication type:
- Article
First wafer-scale packages show up in commercial products.
- Published in:
- Solid State Technology, 2000, v. 43, n. 10, p. 39
- By:
- Publication type:
- Article
TI plans DMOS 4 upgrade.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 40
- Publication type:
- Article
Wafer-level packaging technology milestones.
- Published in:
- Solid State Technology, 1998, v. 41, n. 10, p. 42
- By:
- Publication type:
- Article
Experimental characterization of wafer probe burn.
- Published in:
- Turkish Journal of Electrical Engineering & Computer Sciences, 2016, v. 24, n. 5, p. 3513, doi. 10.3906/elk-1407-109
- By:
- Publication type:
- Article
DEVELOPMENT OF A DUAL BURN-IN POLICY FOR SEMICONDUCTOR PRODUCTS BASED ON THE NUMBER OF DEFECTIVE NEIGHBORHOOD CHIPS.
- Published in:
- International Journal of Reliability, Quality & Safety Engineering, 2006, v. 13, n. 6, p. 501, doi. 10.1142/S0218539306002409
- By:
- Publication type:
- Article
A Dynamic TNFS Rule for Job Dispatching in a Wafer Fab.
- Published in:
- International Review on Computers & Software, 2011, v. 6, n. 3, p. 412
- By:
- Publication type:
- Article
The SOM-RBF Approach for Forecasting Job Interval Cycle Time in a Wafer Fab.
- Published in:
- International Review on Computers & Software, 2011, v. 6, n. 3, p. 407
- By:
- Publication type:
- Article
Optimizing Cycle Time Average and Variation for a Wafer Fabrication Factory with a Dynamic Dispatching Rule.
- Published in:
- International Review on Computers & Software, 2011, v. 6, n. 3, p. 400
- By:
- Publication type:
- Article
Monitoring wafer map data from integrated circuit fabrication processes for spatially clustered...
- Published in:
- Technometrics, 1997, v. 39, n. 3, p. 241, doi. 10.1080/00401706.1997.10485116
- By:
- Publication type:
- Article
Screen-printed single-walled carbon nanotube networks and their use for dimethyl methylphosphonate detection.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 10, p. 1823, doi. 10.1007/s10854-012-0669-x
- By:
- Publication type:
- Article
Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 10, p. 1536, doi. 10.1007/s10854-011-0457-z
- By:
- Publication type:
- Article
Matching characteristics of high-performance, low-cost, analog fiber-optic links for arrayed-antenna applications.
- Published in:
- Microwave & Optical Technology Letters, 2000, v. 24, n. 6, p. 363, doi. 10.1002/(SICI)1098-2760(20000320)24:6<363::AID-MOP1>3.0.CO;2-O
- By:
- Publication type:
- Article
Influence of Repeated Measurement on One Occasion, on Successive Days, and on Workdays on Home Blood Pressure Values.
- Published in:
- Clinical & Experimental Hypertension, 2005, v. 27, n. 2/3, p. 215, doi. 10.1081/CEH-200048854
- By:
- Publication type:
- Article
Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers.
- Published in:
- Nature Photonics, 2012, v. 6, n. 9, p. 612, doi. 10.1038/nphoton.2012.204
- By:
- Publication type:
- Article
SMARTIEHS Offers Faster Inspection of Micro-Optical Components.
- Published in:
- Electronic Device Failure Analysis, 2011, v. 13, n. 2, p. 41
- Publication type:
- Article
Electroglas Offers Advanced Dual-Loops Z-Stage Control.
- Published in:
- Electronic Device Failure Analysis, 2008, v. 10, n. 3, p. 42
- Publication type:
- Article
Graphene/Si-nanowire heterostructure molecular sensors.
- Published in:
- Scientific Reports, 2014, p. 1, doi. 10.1038/srep05384
- By:
- Publication type:
- Article