Works matching DE "ELECTRICAL resistivity"
1
- 2025
- Tang, Yingchun;
- Liu, Ping;
- Jia, Shujing;
- Yang, Yang;
- Mo, Yajun;
- Zhu, Jie
- Correction Notice
2
- Minerals (2075-163X), 2025, v. 15, n. 5, p. 466, doi. 10.3390/min15050466
- Article
3
- Geosciences (2076-3263), 2025, v. 15, n. 5, p. 166, doi. 10.3390/geosciences15050166
- Sangprasat, Kornkanok;
- Puttiwongrak, Avirut;
- Inazumi, Shinya
- Article
4
- Metals (2075-4701), 2025, v. 15, n. 5, p. 472, doi. 10.3390/met15050472
- Ramírez-Acevedo, Donovan;
- Ambriz, Ricardo Rafael;
- García, Christian Jesús;
- Gómora, Cesar Mendoza;
- Jaramillo, David
- Article
5
- Applied Sciences (2076-3417), 2025, v. 15, n. 10, p. 5756, doi. 10.3390/app15105756
- Zhang, Yansong;
- Fu, Jianfei;
- Jia, Sanshi;
- Meng, Jiaqi
- Article
6
- Applied Sciences (2076-3417), 2025, v. 15, n. 10, p. 5536, doi. 10.3390/app15105536
- Zhao, Aosai;
- Yu, Yang;
- Wang, Bin;
- Liu, Yewen;
- Liu, Jingyue;
- Fu, Xubiao;
- Zheng, Wenhao;
- Tian, Fei
- Article
7
- Applied Sciences (2076-3417), 2025, v. 15, n. 10, p. 5346, doi. 10.3390/app15105346
- Capozzi, Andrea;
- Cozzolino, Marilena;
- Fasano, Federica;
- Gentile, Vincenzo;
- Mauriello, Paolo
- Article
8
- Materials (1996-1944), 2025, v. 18, n. 10, p. 2242, doi. 10.3390/ma18102242
- Luo, Yudong;
- Miao, Yonghong;
- Wang, Peng;
- Gai, Panpan;
- Yang, Jingwei;
- Zhang, Guiyu
- Article
9
- Earth Surface Processes & Landforms, 2025, v. 50, n. 6, p. 1, doi. 10.1002/esp.70091
- Bussière, Léa;
- Schmutz, Myriam;
- Dupuy, Alain
- Article
10
- Acta Geographica Slovenica, 2011, v. 51, n. 2, p. 234, doi. 10.3986/AGS51201
- Article
11
- Acta Geographica Slovenica, 2011, v. 51, n. 2, p. 246, doi. 10.3986/AGS51201
- Article
12
- Polar Research, 2015, v. 34, n. 1, p. 1, doi. 10.3402/polar.v34.25678
- Article
13
- Journal of Electronic Materials, 2025, v. 54, n. 6, p. 4471, doi. 10.1007/s11664-025-11901-y
- Al Muflih, Miqdad;
- Katsuyama, Shigeru;
- Yoshikawa, Takeshi
- Article
14
- Journal of Electronic Materials, 2025, v. 54, n. 2, p. 1104, doi. 10.1007/s11664-024-11635-3
- Missaoui, Ibtissem;
- Hcini, Sobhi;
- Alzahrani, Mussad Mohammed;
- Mallah, Abdulrahman;
- Dhahri, Abdessalem;
- Khirouni, Kamel;
- Bouazizi, Mohamed Lamjed
- Article
15
- Journal of Electronic Materials, 2025, v. 54, n. 1, p. 370, doi. 10.1007/s11664-024-11527-6
- Zhang, Zhipeng;
- Shen, Zong-Yang;
- Wang, Zhumei;
- Zeng, Tao;
- Luo, Wenqin;
- Song, Fusheng;
- Li, Yueming
- Article
16
- Journal of Electronic Materials, 2024, v. 53, n. 11, p. 7065, doi. 10.1007/s11664-024-11402-4
- Chen, J. L.;
- Wang, S. B.;
- Ren, J.;
- Huang, M. L.
- Article
17
- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6322, doi. 10.1007/s11664-024-11356-7
- Lima, Ariely V. B.;
- da Silva, Debóra Moura;
- Mélo, Adelaide C.;
- dos Passos, Tibério Andrade;
- Torquato, Ramon Alves;
- de Oliveira, Danniel Ferreira
- Article
18
- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6221, doi. 10.1007/s11664-024-11288-2
- Dabour, Mohamed Mustafa;
- Sabry, Mohamed Nabil;
- Bayoumy, Wafaa Abdallah;
- Mousa, M. A.
- Article
19
- Journal of Electronic Materials, 2024, v. 53, n. 7, p. 4111, doi. 10.1007/s11664-024-10996-z
- Ruamruk, Surasak;
- Chayasombat, Bralee;
- Singsoog, Kunchit;
- Seetawan, Tosawat
- Article
20
- Surface Engineering, 2022, v. 38, n. 5, p. 465, doi. 10.1080/02670844.2022.2106346
- Kadkhodaee, Mahdi;
- Abdollah-zadeh, Amir;
- Assadi, Hamid;
- Seraj, Rajab Ali
- Article
21
- Surface Engineering, 2020, v. 36, n. 9, p. 1000, doi. 10.1080/02670844.2020.1758013
- Boudaira, R.;
- Meglali, O.;
- Bouraiou, A.;
- Attaf, N.;
- Sedrati, C.;
- Aida, M.S.
- Article
22
- Surface Engineering, 2018, v. 34, n. 9, p. 682, doi. 10.1080/02670844.2017.1390905
- Antosoly, D.;
- Ilangovan, S.;
- Nagarethinam, V. S.;
- Balu, A. R.
- Article
23
- Surface Engineering, 2017, v. 33, n. 3, p. 217, doi. 10.1080/02670844.2016.1212519
- Wang, Y.;
- Peng, Z. J.;
- Wang, Q.;
- Fu, X. L.
- Article
24
- Surface Engineering, 2017, v. 33, n. 3, p. 175, doi. 10.1080/02670844.2016.1201184
- Narasimman, V.;
- Nagarethinam, V. S.;
- Selvan, G.;
- Abubacker, M. P.;
- Balu, A. R.
- Article
25
- Surface Engineering, 2012, v. 28, n. 9, p. 715, doi. 10.1179/1743294412Y.0000000045
- Yousfi, S;
- Hadjoudja, B;
- Chouial, B;
- Djedid, N;
- Chibani, A
- Article
26
- Chemistry - A European Journal, 2021, v. 27, n. 26, p. 7383, doi. 10.1002/chem.202005312
- Lee, Shannon J.;
- Won, Juyeon;
- Wang, Lin‐Lin;
- Jing, Dapeng;
- Harmer, Colin P.;
- Mark, Justin;
- Akopov, Georgiy;
- Kovnir, Kirill
- Article
27
- Natural Computing, 2015, v. 14, n. 3, p. 355, doi. 10.1007/s11047-014-9440-y
- Gajda-Zagórska, Ewa;
- Schaefer, Robert;
- Smołka, Maciej;
- Paszyński, Maciej;
- Pardo, David
- Article
28
- 2015
- Coello, Carlos;
- Franco, Giuditta;
- Krasnogor, Natalio;
- Pavone, Mario
- Editorial
29
- Marine Geophysical Research, 2018, v. 39, n. 4, p. 491, doi. 10.1007/s11001-018-9347-6
- Aziz, Omer;
- Hussain, Tahir;
- Ullah, Matee;
- Bhatti, Asher Samuel;
- Ali, Aamir
- Article
30
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 19035, doi. 10.1007/s10854-019-02261-5
- Wang, Xiaojin;
- Chen, Qingming;
- Li, Ling;
- Wang, Chengyi;
- Sun, Peng;
- Zhang, Hui
- Article
31
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 17572, doi. 10.1007/s10854-019-02106-1
- Almessiere, M. A.;
- Slimani, Y.;
- Hannachi, E.;
- Algarni, R.;
- Ben Azzouz, F.
- Article
32
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 18, p. 17432, doi. 10.1007/s10854-019-02093-3
- Yüksel Price, Berat;
- Hardal, Gökhan
- Article
33
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16596, doi. 10.1007/s10854-019-02038-w
- Shyam Prasad, K.;
- Rao, Ashok
- Article
34
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16124, doi. 10.1007/s10854-019-01982-x
- Algün, Gökhan;
- Akçay, Namık
- Article
35
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11727, doi. 10.1007/s10854-019-01534-3
- Chen, Zhenning;
- Li, Xudong;
- Sheng, Linsheng;
- Li, Lili;
- Wen, Fei;
- Zheng, Peng;
- Wu, Wei;
- Zheng, Liang;
- Du, Juan;
- Bai, Wangfeng
- Article
36
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11588, doi. 10.1007/s10854-019-01516-5
- Tang, Chengli;
- Zheng, Shuhu;
- Wang, Fan;
- Lu, Yebo;
- Huang, Fengli;
- Xing, Bo;
- Zuo, Chuncheng
- Article
37
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11164, doi. 10.1007/s10854-019-01459-x
- Pozos, Heberto Gómez;
- Maldonado, Arturo;
- Izpura, J. I.;
- Muñoz, Elías
- Article
38
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8832, doi. 10.1007/s10854-019-01209-z
- Özkurt, Berdan;
- Aytekin, M. Ersin;
- Madre, M. A.;
- Sotelo, A.;
- Torres, M. A.
- Article
39
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8805, doi. 10.1007/s10854-019-01205-3
- Hannachi, E.;
- Slimani, Y.;
- Ekicibil, A.;
- Manikandan, A.;
- Azzouz, F. Ben
- Article
40
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8611, doi. 10.1007/s10854-019-01183-6
- Ullah, Mati;
- Chunlei, Wang;
- Su, Wenbin;
- Liu, Dakang;
- Zaman, Arif
- Article
41
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8508, doi. 10.1007/s10854-019-01171-w
- Hamouda, F.;
- Herth, E.;
- David, C.;
- Bayle, F.;
- Plante, M. P.;
- Martin, A.;
- Aassime, A.
- Article
42
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 8080, doi. 10.1007/s10854-019-01130-5
- Wu, Yung-Ping;
- Chiang, Hsin-Yun;
- Hsiang, Hsing-I
- Article
43
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4618, doi. 10.1007/s10854-019-00754-x
- Kundu, Soumalya;
- Majumder, Rahul;
- Ghosh, Ria;
- Pal Chowdhury, Manish
- Article
44
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 4079, doi. 10.1007/s10854-019-00696-4
- Lee, Choong-Jae;
- Jung, Kwang-Ho;
- Park, Bum-Geun;
- Kim, Yongil;
- Jung, Seung-Boo
- Article
45
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3349, doi. 10.1007/s10854-018-00608-y
- Abdallah, F. B.;
- Benali, A.;
- Triki, M.;
- Dhahri, E.;
- Nomenyo, K.;
- Lerondel, G.
- Article
46
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2829, doi. 10.1007/s10854-018-0559-y
- Wang, Xiao-Qing;
- Gan, Wei-Ping;
- Xiang, Feng;
- Li, Bi-Yuan
- Article
47
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 561, doi. 10.1007/s10854-018-0322-4
- Naveena, D.;
- Logu, T.;
- Dhanabal, R.;
- Sethuraman, K.;
- Bose, A. Chandra
- Article
48
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 424, doi. 10.1007/s10854-018-0307-3
- Kungumadevi, L.;
- Sathyamoorthy, R.;
- Chandra, G. Hema
- Article
49
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 23, p. 20462, doi. 10.1007/s10854-018-0180-0
- Nan, Ruihua;
- Li, Tao;
- Jian, Zengyun;
- Xu, Gang;
- Li, Xiaojuan
- Article
50
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 20, p. 17881, doi. 10.1007/s10854-018-9903-5
- Teichmann, Christian;
- Töpfer, Jörg
- Article