Works matching DE "PLATING baths"

Results: 478

Void-free copper deposition.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 97

By:

Su, Zhi-Wen;
Dixit, Girish

Publication type:

Article

Jet process increases Cu plating throughput.

Published in:

Solid State Technology, 2000, v. 43, n. 2, p. 24

By:

Demmin, Jeffrey C.

Publication type:

Article

Influence of Alcohol-Based Brighteners on the Morphology and Structure of Electroplated Nickel: Experiments and Theoretical Calculations.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 7549, doi. 10.1007/s11664-024-11431-z

By:

Wang, Peng;
Li, Yang;
Sun, Qi;
Lu, Yinxiang

Publication type:

Article

Soft Magnetic Characteristics and Magnetoimpedance Phenomenon in Copper Wire Coated with Permalloy Film Electroplated from a Sodium Gluconate-Based Bath.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4450, doi. 10.1007/s11664-024-11136-3

By:

Tandon, Prerit;
Kotti, Akhila Priya;
Mishra, Amaresh Chandra;
Venkatesh, R.;
Singh, Kumud;
Srikanti, Kavita;
Gopalan, R.

Publication type:

Article

Electrochemical and surface morphology characterizations of zinc electroplated coatings.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 227, doi. 10.1177/02670844251314127

By:

Carrijo-Gonçalves, Gabriel Abelha;
da Silva, Brunela Pereira;
Veloso, Tácia Costa;
Capelossi, Vera Rosa

Publication type:

Article

Role of CTAB surfactant on electroless Ni–B deposition and its mechanical and corrosion behaviour.

Published in:

Surface Engineering, 2022, v. 38, n. 7-9, p. 725, doi. 10.1080/02670844.2022.2162564

By:

Yazdani, Sepehr;
Chapon, Patrick;
Dupont, Vedi;
Vitry, Veronique

Publication type:

Article

Effect of additives on nanocrystalline bright Zn–Ni–Fe alloy electrodeposit properties.

Published in:

Surface Engineering, 2019, v. 35, n. 12, p. 1061, doi. 10.1080/02670844.2019.1588487

By:

Nayana, K. O.;
Prashanth, S. A.;
Venkatesha, T. V.;
Pandurangappa, M.

Publication type:

Article

Characterisation and properties of Ni–W–Y2O3–ZrO2 nanocomposite coating.

Published in:

Surface Engineering, 2019, v. 35, n. 7, p. 578, doi. 10.1080/02670844.2018.1547246

By:

Zhang, Ruiyu;
Li, Zili;
Yu, Xin;
Cui, Gan

Publication type:

Article

Effects of multiple ligand coordinations on electroless nickel plating on magnesium alloys.

Published in:

Surface Engineering, 2008, v. 24, n. 4, p. 295, doi. 10.1179/174329408X326812

By:

Gao, X. L.;
Yu, G.;
Ouyang, Y. J.;
Chen, J. L.;
Lei, X. P.;
Chen, Y.

Publication type:

Article

Preparation, mechanical property and wear resistance of Ni–W/Al2O3 composite coatings.

Published in:

Surface Engineering, 2008, v. 24, n. 3, p. 226, doi. 10.1179/174329408X282613

By:

Yao, Y. W.

Publication type:

Article

Dual Metastability in Electroless Plating: Complex Inertness Enabling the Deposition of Composition‐Tunable Platinum Copper Alloy Nanostructures.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 14, p. 3030, doi. 10.1002/chem.202000158

By:

Stohr, Tobias;
Brötz, Joachim;
Oezaslan, Mehtap;
Muench, Falk

Publication type:

Article

Estimation of bending of micromachined gold cantilever due to residual stress.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 382, doi. 10.1007/s10854-013-1598-z

By:

Dutta, Shankar;
Imran, Md.;
Pandey, Akhilesh;
Saha, Tulana;
Yadav, Isha;
Pal, Ramjay;
Jain, K.;
Chatterjee, Ratnamala

Publication type:

Article

Photoelectrochemical properties of brush plated Cd x Zn1− x Se films.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 92, doi. 10.1007/s10854-008-9618-0

By:

Murali, K. R.;
Austine, A.

Publication type:

Article

Electrodeposition of tin: a simple approach.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 553, doi. 10.1007/s10854-007-9385-3

By:

He, Anqiang;
Liu, Qi;
Ivey, Douglas G.

Publication type:

Article

Comparison of Soil-Water Characteristic Curves from Conventional Testing and Combination of Small-Scale Centrifuge and Dew Point Methods.

Published in:

Geotechnical & Geological Engineering, 2019, v. 37, n. 2, p. 659, doi. 10.1007/s10706-018-0636-2

By:

Rahardjo, Harianto;
Satyanaga, Alfrendo;
Mohamed, Haneena;
Yee Ip, Sabrina Chui;
Shah, Rishi Suryakant

Publication type:

Article

Achieving high joule heating and self-cleaning performance in copper-coated fabrics with excellent microwave shielding.

Published in:

Cellulose, 2023, v. 30, n. 9, p. 5987, doi. 10.1007/s10570-023-05202-y

By:

Luo, Cheng-Long;
Huang, Ming-Lu;
Sun, Chang;
Zhao, Kun-Yan;
Hu, Zongqian;
Wang, Ming

Publication type:

Article

Effects of four carboxyl-containing additives on imitation gold electroplating Cu-Zn-Sn alloys in an HEDP system.

Published in:

Journal of Solid State Electrochemistry, 2021, v. 25, n. 4, p. 1361, doi. 10.1007/s10008-021-04914-0

By:

Chen, Chongyan;
Ding, Lifeng;
Li, Qiang;
Wang, Ruonan;
Yuan, Jinxia;
Wang, Qi;
Xue, Yanfeng;
Li, Hongdao;
Niu, Yulan

Publication type:

Article

Electrodeposition of zinc-ceria nanocomposite coatings in alkaline bath.

Published in:

Journal of Solid State Electrochemistry, 2014, v. 18, n. 1, p. 223, doi. 10.1007/s10008-013-2264-3

By:

Exbrayat, L.;
Steyer, P.;
Rébéré, C.;
Berziou, C.;
Savall, C.;
Ayrault, P.;
Tertre, E.;
Joly-Pottuz, G.;
Creus, J.

Publication type:

Article

Electrodeposition and characterization of zinc–nickel–iron alloy from sulfate bath: influence of plating bath temperature.

Published in:

Journal of Solid State Electrochemistry, 2009, v. 13, n. 6, p. 879, doi. 10.1007/s10008-008-0620-5

By:

M. Abou-Krisha;
F. Assaf;
S. El-Naby

Publication type:

Article

Genome mining of cyanide-degrading nitrilases from filamentous fungi.

Published in:

Applied Microbiology & Biotechnology, 2008, v. 80, n. 3, p. 427, doi. 10.1007/s00253-008-1559-2

By:

Basile, Lacy;
Willson, Richard;
Sewell, B.;
Benedik, Michael

Publication type:

Article

Kinetics of Ni/Nano-SiO2 Codeposition on the Sintered NdFeB Surface.

Published in:

Strength of Materials, 2021, v. 53, n. 1, p. 134, doi. 10.1007/s11223-021-00269-z

By:

Li, Y. J.;
Zhang, X. Z.;
Zhi, C. C.

Publication type:

Article

Motion of an Elastic Drop through an Orifice in a Thin Plate.

Published in:

Fluid Dynamics, 2024, v. 59, n. 5, p. 1088, doi. 10.1134/S001546282460336X

By:

Rudenko, A. O.;
Rozhkov, A. N.

Publication type:

Article

ELECTROCATALYTIC BEHAVIOR OF Ni–MO ALLOY ELECTRODEPOSITED FROM DEEP EUTECTIC SOLVENTS-ASSISTED PLATING BATHS: ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY STUD.

Published in:

Issues of Chemistry & Chemical Technology / Voprosy Khimii & Khimicheskoi Tekhnologii, 2024, n. 1, p. 81, doi. 10.32434/0321-4095-2024-152-1-81-88

By:

Protsenko, V. S.;
Bobrova, L. S.;
Sukhatskyi, O. D.;
Danilov, F. I.

Publication type:

Article

ELECTROCATALYTIC ACTIVITY OF NICKEL-BASED COATINGS DEPOSITED IN DES-ASSISTED PLATING BATHS CONTAINING CERIUM(III) IONS.

Published in:

Issues of Chemistry & Chemical Technology / Voprosy Khimii & Khimicheskoi Tekhnologii, 2022, n. 6, p. 29, doi. 10.32434/0321-4095-2022-145-6-29-38

By:

Danilov, F. I.;
Bobrova, L. S.;
Pavlenko, L. M.;
Korniy, S. A.;
Protsenko, V. S.

Publication type:

Article

基于深度学习的板壳结构网格智能划分技术研究.

Published in:

Automobile Technology, 2025, n. 4, p. 47, doi. 10.19620/j.cnki.1000-3703.20241025

By:

黄泽辉;
唐洪斌;
范阳;
王士彬

Publication type:

Article

聚乙烯醇分光光度法测定电镀液中硼酸含量.

Published in:

Chinese Journal of Inorganic Analytical Chemistry / Zhongguo Wuji Fenxi Huaxue, 2023, v. 13, n. 10, p. 1118, doi. 10.3969/j.issn.2095-1035.2023.10.011

By:

李积慧;
王万里;
姚振铎;
陈建新

Publication type:

Article

Effect of MoS2 content on properties of electroplated Fe--MoS2 composite coating.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 21, p. 20, doi. 10.19289/j.1004-227x.2023.21.004

By:

ZHAO Enrui;
HOU Jiabin;
YU Guangyu;
FU Zhenqiang

Publication type:

Article

Study on electroless plating and properties of nickel--phosphorus alloy on 2A12 aluminum alloy pretreated with dopamine.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 21, p. 34, doi. 10.19289/j.1004-227x.2023.21.006

By:

DU Guang;
YANG Zhigang;
CHEN Yangjie;
GAO Jin;
QIANG Rongming

Publication type:

Article

高强钢无氰和氰化物电镀镉钛合金性能对比.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 19, p. 21, doi. 10.19289/j.1004-227x.2023.19.004

By:

段党全;
郝江华;
詹中伟;
孙志华;
宇波;
张骐

Publication type:

Article

巯基羧酸类有机物对无氰亚硫酸盐体系电镀金的影响.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 17, p. 35, doi. 10.19289/j.1004-227x.2023.17.006

By:

王吉成;
曾铭;
徐欣移;
秦伟恒;
罗锦逸;
陈相;
罗继业;
孙明;
郝志峰;
王彤;
邓川

Publication type:

Article

Study on application of heavy metal capturing agent DTC in deep removal of nickel from spent concentrated electroless nickel plating bath.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 15, p. 72, doi. 10.19289/j.1004-227x.2023.15.011

By:

TANG Yao;
LIANG Gaojie;
SHI Zongwu;
ZHOU Jian;
XIE Fei

Publication type:

Article

Study on a novel cyanide-free copper(I)-based bath for direct electroplating on steel substrate.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 15, p. 24, doi. 10.19289/j.1004-227x.2023.15.004

By:

LIU Ying;
XING Xirui;
TIAN Dong;
XIA Fangquan;
LI Ning

Publication type:

Article

Gold electroplating of single-layered ceramic chip capacitor.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 7, p. 37, doi. 10.19289/j.1004-227x.2023.07.006

By:

WEN Zhanfu;
LUO Yanjun;
NIE Kaifu;
TANG Qing

Publication type:

Article

Electroless Ni--B alloy plating process and bath stability.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 7, p. 16, doi. 10.19289/j.1004-227x.2023.07.003

By:

CHEN Haixin;
LIU Ninghua;
DENG Zhengping;
TIAN Zhibin

Publication type:

Article

碳纤维化学镀银工艺.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 3, p. 1, doi. 10.19289/j.1004-227x.2023.03.001

By:

路杨;
付翀;
李旭;
周雄飞;
刘宇昕;
李振阳

Publication type:

Article

2024 铝合金直接化学镀镍工艺及镀层性能.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 1, p. 24, doi. 10.19289/j.1004-227x.2023.01.005

By:

宿辉;
张迎;
原小寓;
付雅琦

Publication type:

Article

微型断路器动触头高速连续局部镀银.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 1, p. 13, doi. 10.19289/j.1004-227x.2023.01.003

By:

任雅勋

Publication type:

Article

自动电位滴定法测定氯化钾镀锌溶液的硼酸.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 23, p. 1717, doi. 10.19289/j.1004-227x.2022.23.013

By:

王晓红;
王琳;
韩卫平;
程星华;
刘涛;
喻晓军

Publication type:

Article

活性碳酸镍的制备及其在光亮镀镍液除杂中的应用.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 23, p. 1664, doi. 10.19289/j.1004-227x.2022.23.004

By:

吴双成

Publication type:

Article

添加剂对 ABS 化学镀铜的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1510, doi. 10.19289/j.1004-227x.2022.21.004

By:

程熠;
宋晅;
朱皓;
赵文霞;
回凯宏;
李鑫巍;
刘欣;
陈怀军

Publication type:

Article

水合氯醛对光亮镍镀层性能的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1505, doi. 10.19289/j.1004-227x.2022.21.003

By:

李剑斌;
郭兴红

Publication type:

Article

Effect of leveling agent on copper electroplating of through hole on aluminum-based copper clad laminate.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 19, p. 1393, doi. 10.19289/j.1004-227x.2022.19.010

By:

ZENG Xiangjian;
LU Zehao;
YUAN Zhenjie;
FU Liuyu;
TAN Jie;
HUANG Lixin;
PAN Zhanchang;
HU Guanghui;
ZHANG Yafeng;
SHI Shikun;
XIA Guowei

Publication type:

Article

CTAB 对锌−镍合金基复合电镀液中 PTFE 分散性的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 17, p. 1208, doi. 10.19289/j.1004-227x.2022.17.003

By:

刘嘉楠;
黄嘉乐;
阳颖飞;
张鹏;
陈德馨;
王启伟

Publication type:

Article

电镀层达因值的影响因素和控制.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 13, p. 917, doi. 10.19289/j.1004-227x.2022.13.004

By:

黄皓;
朱万宇

Publication type:

Article

含氟硅酸的镀液成分对镀铬板性能的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 11, p. 777, doi. 10.19289/j.1004-227x.2022.11.006

By:

王悦鼎;
周雪荣;
李秀军;
兰剑;
李建中

Publication type:

Article

复配磷酸盐无氰镀金液中配位导电盐的筛选.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 9, p. 628, doi. 10.19289/j.1004-227x.2022.09.005

By:

叶仁祥;
浦建堂

Publication type:

Article

超声电沉积Ni-SiC 和Ni-SiC-纳米石墨复合镀层及其性能.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 9, p. 621, doi. 10.19289/j.1004-227x.2022.09.004

By:

张翠翠;
吴化;
于晓丰;
鞠川

Publication type:

Article

纳米WS2 含量对Ni-P-BN(h)-WS2 化学镀层组织结构及摩擦学性能的影响.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 9, p. 601, doi. 10.19289/j.1004-227x.2022.09.001

By:

郭文恺;
郑晓华;
黄寅迪;
杨芳儿;
郑晋翔

Publication type:

Article

石墨烯-镍磷化学复合镀层磨蚀性能及机理研究.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 7, p. 453, doi. 10.19289/j.1004-227x.2022.07.001

By:

王昕阳;
黄燕滨;
黄俊雄;
许诠;
曾佳佳;
张志刚

Publication type:

Article

化学镀法制备Cu@Ni@Ag 复合粉末及其性能.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 5, p. 345, doi. 10.19289/j.1004-227x.2022.05.009

By:

徐恒一;
臧丽坤;
徐菊

Publication type:

Article