Works matching DE "COPPER alloys"

Results: 2130

A Review of Studies on the Influence of Rare-Earth Elements on the Microstructures and Properties of Copper and Copper Alloys and Relevant Applications.

Published in:

Metals (2075-4701), 2025, v. 15, n. 5, p. 536, doi. 10.3390/met15050536

By:

Liu, Jin-Song;
Yu, Wen-Xin;
Chen, Da-Yong;
Wang, Song-Wei;
Song, Hong-Wu;
Zhang, Shi-Hong

Publication type:

Article

Three-dimensional surface topography analysis of die-sinking electrical discharge machined eco-friendly beryllium-free copper alloys.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 7, p. 2911, doi. 10.1007/s00170-025-15666-w

By:

Vijayan, Vipin;
Saju, Kaiprappady Kunchu;
Sundaresan, Jithin

Publication type:

Article

Interface Optimization, Microstructural Characterization, and Mechanical Performance of CuCrZr/GH4169 Multi-Material Structures Manufactured via LPBF-LDED Integrated Additive Manufacturing.

Published in:

Materials (1996-1944), 2025, v. 18, n. 10, p. 2206, doi. 10.3390/ma18102206

By:

Wang, Di;
Lv, Jiale;
Liu, Zhenyu;
Liu, Linqing;
Wei, Yang;
Chang, Cheng;
Zhou, Wei;
Zhang, Yingjie;
Han, Changjun

Publication type:

Article

Comparative experimental analysis of wear behavior of CuCrZr and CuZn39Pb3 alloys using pin-on-disc test from room temperature to high temperatures.

Published in:

Proceedings of the Estonian Academy of Sciences, 2025, v. 74, n. 2, p. 253, doi. 10.3176/proc.2025.2.30

By:

Cetintav, Isik;
Ceviz, Mehmet

Publication type:

Article

Plasma Spraying of W Coatings for Nuclear Fusion Applications: Advancements and Challenges.

Published in:

Crystals (2073-4352), 2025, v. 15, n. 5, p. 408, doi. 10.3390/cryst15050408

By:

Pakhomova, Ekaterina;
Palombi, Alessandra;
Varone, Alessandra

Publication type:

Article

Microstructures and properties of ultrasonically surface-modified Cu–0.2Be–1.0Co alloy.

Published in:

Surface Engineering, 2023, v. 39, n. 6, p. 751, doi. 10.1080/02670844.2023.2253392

By:

Wang, Jinyun;
Zhang, Bowen;
Hong, Zhenyu;
Zhao, Hongliang

Publication type:

Article

A development of novel Ni–P coating on anodised aluminium alloys for military industries applications in artificial sea water.

Published in:

Surface Engineering, 2019, v. 35, n. 12, p. 1033, doi. 10.1080/02670844.2019.1621004

By:

Abdel-Gawad, Soha A.;
Osman, Walid M.;
Fekry, Amany M.

Publication type:

Article

Microstructure evaluation of CO-222/SiC coating produced by the plasma spraying method.

Published in:

Surface Engineering, 2018, v. 34, n. 3, p. 220, doi. 10.1080/02670844.2016.1259731

By:

Jafari, M.;
Mostaghimi, J.;
Monajatizadeh, H.;
Rafiei, M.

Publication type:

Article

Laser ablation of phosphor bronze for superhydrophobic surface.

Published in:

Surface Engineering, 2016, v. 32, n. 12, p. 885, doi. 10.1179/1743294414Y.0000000325

By:

Yilbas, B. S.

Publication type:

Article

Characteristics of cold sprayed dendritic Cu coatings.

Published in:

Surface Engineering, 2016, v. 32, n. 9, p. 650, doi. 10.1179/1743294415Y.0000000044

By:

Ko, K. H.;
Choi, J. O.;
Lee, H.

Publication type:

Article

Electroless deposition (ED) of copper coating on micron-sized SiC particles.

Published in:

Surface Engineering, 2014, v. 30, n. 10, p. 747, doi. 10.1179/1743294414Y.0000000335

By:

Beigi Khosroshahi, N.;
Azari Khosroshahi, R.;
Taherzadeh Mousavian, R.;
Brabazon, D.

Publication type:

Article

Mechanism of corrosion due to unalloyed copper inclusion in ancient bronzes.

Published in:

Surface Engineering, 2013, v. 29, n. 2, p. 128, doi. 10.1179/174329413X13601473753808

By:

Emami, M A;
Bigham, M

Publication type:

Article

Fabrication and examination of oxidation resistance of zinc coated copper and brass components by chemical deposition.

Published in:

Surface Engineering, 2011, v. 27, n. 5, p. 362, doi. 10.1179/026708410X12786785573274

By:

Chaliampalias, D;
Papazoglou, M;
Tsipas, S;
Pavlidou, E;
Skolianos, S;
Stergioudis, G;
Vourlias, G

Publication type:

Article

The metal of the moon goddess.

Published in:

Surface Engineering, 2008, v. 24, n. 2, p. 110, doi. 10.1179/174329408X286079

By:

Giumlia-Mair, A.

Publication type:

Article

Original surface treatment of copper alloy in ancient Roman Empire: chemical patination on a Roman strigil.

Published in:

Surface Engineering, 2005, v. 21, n. 5/6, p. 346, doi. 10.1179/174329305X64303

By:

Mathis, F.;
Descamps, S.;
Robcis, D.;
Aucouturier, M.

Publication type:

Article

Furnishing an Early Medieval Monastery: New Evidence from Iona.

Published in:

Medieval Archaeology, 2019, v. 63, n. 2, p. 298, doi. 10.1080/00766097.2019.1672301

By:

Campbell, Ewan;
Batey, Colleen;
Murray, Griffin;
Thickpenny, Cynthia

Publication type:

Article

Early Medieval Copper-Alloy Metalworking at Rendlesham, Suffolk, England.

Published in:

Medieval Archaeology, 2022, v. 66, n. 2, p. 343, doi. 10.1080/00766097.2022.2129684

By:

Blakelock, Eleanor;
Martinón-Torres, Marcos;
Scull, Christopher

Publication type:

Article

Dual Metastability in Electroless Plating: Complex Inertness Enabling the Deposition of Composition‐Tunable Platinum Copper Alloy Nanostructures.

Published in:

Chemistry - A European Journal, 2020, v. 26, n. 14, p. 3030, doi. 10.1002/chem.202000158

By:

Stohr, Tobias;
Brötz, Joachim;
Oezaslan, Mehtap;
Muench, Falk

Publication type:

Article

Fabrication of novel Cu2O/Bi24O31Br10 composites and excellent photocatalytic performance.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19544, doi. 10.1007/s10854-018-0085-y

By:

He, Zuming;
Tang, Bin;
Su, Jiangbin;
Xia, Yongmei

Publication type:

Article

Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15983, doi. 10.1007/s10854-018-9684-x

By:

Hu, Xiaowu;
Qiu, Yu;
Jiang, Xiongxin;
Li, Yulong

Publication type:

Article

Microstructure and mechanical behavior of Sn-40Bi- xCu alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 20, p. 15708, doi. 10.1007/s10854-017-7464-7

By:

Wu, Xulei;
Xia, Ming;
li, Sujie;
Wang, Xiaojing;
Liu, Bin;
Zhang, Jiaoxia;
Liu, Ning

Publication type:

Article

Retarding the Cu-Sn and Ag-Sn intermetallic compounds by applying Cu-xZn alloy on micro-bump in novel 3D-IC technologies.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2357, doi. 10.1007/s10854-015-2691-2

By:

Chen, Wei-Yu;
Chou, Tzu-Ting;
Tu, Wei;
Chang, Hsiang-Ching;
Lee, Christine;
Duh, Jenq-Gong

Publication type:

Article

Electrodeposition of Cu-Sn alloys: theoretical and experimental approaches.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1969, doi. 10.1007/s10854-014-2636-1

By:

Heidari, G.;
Mousavi Khoie, S.;
Abrishami, M.;
Javanbakht, M.

Publication type:

Article

Microstructure dependence of magnetic properties on electrochemically produced ternary CuCoNi alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4483, doi. 10.1007/s10854-014-2191-9

By:

Karpuz, Ali;
Kockar, Hakan;
Alper, Mursel

Publication type:

Article

Selenization of electrodeposited copper-indium alloy thin films for solar cell applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4643, doi. 10.1007/s10854-014-2217-3

By:

Londhe, Priyanka;
Rohom, Ashwini;
Chaure, Nandu

Publication type:

Article

Synthesis and characterization of NaPbPrWTiTaO.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 4, p. 1132, doi. 10.1007/s10854-012-0895-2

By:

Behera, S.;
Parida, B.;
Nayak, P.;
Das, Piyush

Publication type:

Article

Effect of Zn on properties and microstructure of SnAgCu alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 11, p. 1950, doi. 10.1007/s10854-012-0686-9

By:

Zhang, Liang;
Han, Ji-guang;
He, Cheng-wen;
Guo, Yong-huan

Publication type:

Article

Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 9, p. 1664, doi. 10.1007/s10854-012-0644-6

By:

Satyanarayan;
Prabhu, K.

Publication type:

Article

Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 735, doi. 10.1007/s10854-010-0202-z

By:

Li-Ngee Ho;
Teng Wu;
Nishikawa, Hiroshi;
Takemoto, Tadashi;
Miyake, Koichi;
Fujita, Masakazu;
Ota, Koyu

Publication type:

Article

Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn–Cu hypereutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 6, p. 608, doi. 10.1007/s10854-009-9965-5

By:

Çadırlı, E.;
Böyük, U.;
Engin, S.;
Kaya, H.;
Maraşlı, N.;
Keşlioğlu, K.;
Ülgen, A.

Publication type:

Article

Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 6, p. 635, doi. 10.1007/s10854-009-9969-1

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Zhong Sheng;
Guang Zeng;
Yan Chen;
Sheng-lin Yu

Publication type:

Article

Investigation of microhardness and thermo-electrical properties in the Sn–Cu hypereutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 468, doi. 10.1007/s10854-009-9940-1

By:

Çadırlı, E.;
Böyük, U.;
Engin, S.;
Kaya, H.;
Maraşlı, N.;
Arı, M.

Publication type:

Article

Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 12, p. 1193, doi. 10.1007/s10854-008-9850-7

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Yan Chen;
Sheng-lin Yu;
Zhong Sheng;
Guang Zeng

Publication type:

Article

Influence of Ce3+ on dielectric properties of tungsten bronze structured PBN ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 2, p. 132, doi. 10.1007/s10854-008-9655-8

By:

Chandramouli, K.;
Reddy, G. Srinivas;
Ramam, Koduri

Publication type:

Article

Effect of zinc additions on structure and properties of Sn–Ag eutectic lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 1, p. 81, doi. 10.1007/s10854-007-9289-2

By:

Kamal, Mustafa;
Gouda, El

Publication type:

Article

Modeling of mechanical behavior of brass at high strain rates.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 20, p. 1393, doi. 10.1023/A:1025738825378

By:

Wang, Yang;
Xia, Yuanming

Publication type:

Article

Superplastic deformation of Al-Cu-Mg-Ag alloys at elevated temperatures.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 9, p. 703, doi. 10.1023/A:1023635515626

By:

Ding, D. Y.;
Wang, J. N.;
Xiao, D. H.;
Yang, H. L.;
Xu, K.

Publication type:

Article

Antiviral properties of copper and its alloys to inactivate covid-19 virus: a review.

Published in:

BioMetals, 2021, v. 34, n. 6, p. 1217, doi. 10.1007/s10534-021-00339-4

By:

Govind, V.;
Bharadwaj, S.;
Sai Ganesh, M. R.;
Vishnu, Jithin;
Shankar, Karthik V.;
Shankar, Balakrishnan;
Rajesh, R.

Publication type:

Article

Optimization of CuW alloy electrodeposition towards high-tungsten content.

Published in:

Journal of Solid State Electrochemistry, 2016, v. 20, n. 11, p. 3143, doi. 10.1007/s10008-016-3339-8

By:

Bacal, Pawel;
Stojek, Zbigniew;
Donten, Mikolaj

Publication type:

Article

Anodic dissolution of brass and dezincing-resistant brass investigated using channel flow double electrode.

Published in:

Journal of Solid State Electrochemistry, 2015, v. 19, n. 12, p. 3551, doi. 10.1007/s10008-015-2840-9

By:

Hoshi, Yoshinao;
Itagaki, Masayuki;
Tabei, Kozue;
Shitanda, Isao

Publication type:

Article

Copper oxides: kinetics of formation and semiconducting properties. Part I. Polycrystalline copper and copper-gold alloys.

Published in:

Journal of Solid State Electrochemistry, 2014, v. 18, n. 10, p. 2755, doi. 10.1007/s10008-014-2522-z

By:

Vvedenskii, A.;
Grushevskaya, S.;
Ganzha, S.;
Eliseev, D.

Publication type:

Article

Effect of Cu content on structure, hydrogen storage properties and electrode performance of LaNiCoMnCu alloys.

Published in:

Journal of Solid State Electrochemistry, 2014, v. 18, n. 9, p. 2563, doi. 10.1007/s10008-014-2515-y

By:

Lv, Peng;
Wang, Zhong-min;
Peng, Ying;
Liu, Wen-ping;
Balogun, Muhammad-Sadeeq;
Zhou, Huai-ying

Publication type:

Article

Effects of exposure time on the anodic dissolution of Monel-400 in aerated stagnant sodium chloride solutions.

Published in:

Journal of Solid State Electrochemistry, 2012, v. 16, n. 3, p. 891, doi. 10.1007/s10008-011-1438-0

By:

Sherif, El-Sayed

Publication type:

Article

Use of Ecorr vs time plots for the qualitative analysis of metallic elements from scientific and technical objects: the SPAMT Test Project.

Published in:

Journal of Solid State Electrochemistry, 2010, v. 14, n. 3, p. 425, doi. 10.1007/s10008-009-0890-6

By:

Degrigny, Christian;
Guibert, Geoffroy;
Ramseyer, Stephan;
Rapp, Guillaume;
Tarchini, Antonin

Publication type:

Article

Electrochemical lithium insertion in -MoO3: novel LixMoO3 bronzes.

Published in:

Journal of Solid State Electrochemistry, 2003, v. 7, n. 5, p. 259

By:

I. Jurez Ramrez;
A. Martnez-de la Cruz

Publication type:

Article

Survival of bacteria on metallic copper surfaces in a hospital trial.

Published in:

Applied Microbiology & Biotechnology, 2010, v. 87, n. 5, p. 1875, doi. 10.1007/s00253-010-2640-1

By:

Mikolay, André;
Huggett, Susanne;
Tikana, Ladji;
Grass, Gregor;
Braun, Jörg;
Nies, Dietrich H.

Publication type:

Article

Microstructure, EBSD, and Corrosion Resistance of Nip Modified H63 Copper Alloy Prepared by FSSP.

Published in:

Strength of Materials, 2023, v. 55, n. 2, p. 404, doi. 10.1007/s11223-023-00534-3

By:

Song, W. W.;
Zuo, D. W.;
Shi, Y. G.;
Wang, H. F.;
Pu, J. F.

Publication type:

Article

High-Temperature Strength of Copper-Based Condensed Materials.

Published in:

Strength of Materials, 2018, v. 50, n. 6, p. 888, doi. 10.1007/s11223-019-00036-1

By:

Rudnitskii, N. P.

Publication type:

Article

Acoustic and Electromagnetic Properties of Maraging Iron–Chromium–Nickel Alloy with Addition of Copper in Mechanical Tension.

Published in:

Russian Journal of Nondestructive Testing, 2023, v. 59, n. 5, p. 515, doi. 10.1134/S1061830923700365

By:

Murav'ev, V. V.;
Murav'eva, O. V.;
Vladykin, A. L.

Publication type:

Article

Robust parameter design of the procedure for determining the chemical composition of copper alloys by X-ray fluorescence.

Published in:

Measurement Techniques, 2024, v. 66, n. 11, p. 889, doi. 10.1007/s11018-024-02304-2

By:

Mitrofanova, S. A.;
Muravyeva, I. V.

Publication type:

Article