Works matching DE "BALL grid array technology"
Results: 115
Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar.
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- International Journal of Legal Information, 2024, v. 52, n. 1, p. 771, doi. 10.1017/S1759078724000266
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- Article
Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 9/10, p. 902, doi. 10.1007/s00170-004-2286-1
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Locating and checking of BGA pins’ position using gray level.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 5/6, p. 491, doi. 10.1007/s00170-003-1617-y
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A fast full-field 3D measurement system for BGA coplanarity inspection.
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- International Journal of Advanced Manufacturing Technology, 2004, v. 24, n. 1/2, p. 132, doi. 10.1007/s00170-003-1778-8
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Measurements and Stochastic FEA with Application in Thermomechanical Characterization of Electronic Packages.
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- Journal of Engineering & Technological Sciences, 2016, v. 48, n. 6, p. 700, doi. 10.5614/j.eng.technol.sci.2016.48.6.5
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The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements.
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- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2017, v. 42, n. 5, p. 2075, doi. 10.1007/s13369-017-2491-5
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Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications.
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- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2016, v. 41, n. 5, p. 1813, doi. 10.1007/s13369-015-1986-1
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Life cycle assessment of integrated circuit packaging technologies.
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- International Journal of Life Cycle Assessment, 2011, v. 16, n. 3, p. 258, doi. 10.1007/s11367-011-0260-3
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Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint.
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- Materials Science & Technology, 2007, v. 23, n. 4, p. 411, doi. 10.1179/174328407X177009
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- Article
Fatigue fracture of SnAgCu solder joints by microstructural modeling.
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- International Journal of Fracture, 2008, v. 152, n. 1, p. 37, doi. 10.1007/s10704-008-9264-9
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- Article
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.
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- Quality & Reliability Engineering International, 2015, v. 31, n. 4, p. 543, doi. 10.1002/qre.1611
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- Article
Modified gamma correction method to enhance ball grid array image for surface defect inspection.
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- International Journal of Production Research, 2008, v. 46, n. 8, p. 2165, doi. 10.1080/00207540601042464
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- Article
Fatigue life estimation of FBGA memory device under vibration.
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- Journal of Mechanical Science & Technology, 2014, v. 28, n. 1, p. 107, doi. 10.1007/s12206-013-0946-5
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- Article
BGA Solderability Issues Due to Nickel Carbonate Contamination.
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- Texas Journal of Microscopy, 2007, v. 38, n. 1, p. 16
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Re-calibration of Engelmaier's Model for Leadless, Lead-free Solder Attachments.
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- Quality & Reliability Engineering International, 2007, v. 23, n. 4, p. 415, doi. 10.1002/qre.810
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- Article
Low-loss and broadband BGA package transition for LTCC-SiP applications.
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- Microwave & Optical Technology Letters, 2008, v. 50, n. 4, p. 1036, doi. 10.1002/mop.23276
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Application of the Foldy–Lax multiple scattering method to the analysis of vias in ball grid arrays and interior layers of printed circuit boards.
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- Microwave & Optical Technology Letters, 2007, v. 49, n. 1, p. 225, doi. 10.1002/mop.22091
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The optimum projection angle of fringe projection for ball grid array inspection based on reflectance analysis.
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- International Journal of Advanced Manufacturing Technology, 2013, v. 67, n. 5-8, p. 1597, doi. 10.1007/s00170-012-4593-2
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- Article
Topography and field effects in the inner side of microvia hole using ToF-SIMS.
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- Surface & Interface Analysis: SIA, 2014, v. 46, n. 7, p. 429, doi. 10.1002/sia.5569
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- Article
The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing.
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- Journal of Electronic Materials, 2019, v. 48, n. 5, p. 2770, doi. 10.1007/s11664-018-06907-8
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Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 1, doi. 10.1007/s11664-018-6515-z
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Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies.
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- Journal of Electronic Materials, 2018, v. 47, n. 11, p. 6781, doi. 10.1007/s11664-018-6600-3
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Recrystallization Behavior in Mixed Solder Joints of BGA Components during Thermal Shock.
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- Journal of Electronic Materials, 2018, v. 47, n. 7, p. 4156, doi. 10.1007/s11664-018-6124-x
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Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock.
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- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2479, doi. 10.1007/s11664-017-6032-5
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- Article
The Influence of Primary CuSn Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints.
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- Journal of Electronic Materials, 2018, v. 47, n. 1, p. 84, doi. 10.1007/s11664-017-5763-7
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Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance.
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- Journal of Electronic Materials, 2017, v. 46, n. 10, p. 6224, doi. 10.1007/s11664-017-5650-2
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Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate.
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- Journal of Electronic Materials, 2017, v. 46, n. 7, p. 4034, doi. 10.1007/s11664-017-5344-9
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- Article
Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages.
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- Journal of Electronic Materials, 2015, v. 44, n. 10, p. 3927, doi. 10.1007/s11664-015-3856-8
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Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4126, doi. 10.1007/s11664-014-3315-y
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Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing.
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- Journal of Electronic Materials, 2014, v. 43, n. 9, p. 3341, doi. 10.1007/s11664-014-3236-9
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Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies.
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- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 671, doi. 10.1007/s11664-013-2669-x
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Fracture Behaviors of Sn-Cu Intermetallic Compound Layer in Ball Grid Array Induced by Thermal Shock.
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- Journal of Electronic Materials, 2014, v. 43, n. 2, p. 567, doi. 10.1007/s11664-013-2845-z
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Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters.
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- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1171, doi. 10.1007/s11664-013-2551-x
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Impact of Electrical Current on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects.
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- Journal of Electronic Materials, 2013, v. 42, n. 4, p. 599, doi. 10.1007/s11664-012-2292-2
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- Article
Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps.
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- Journal of Electronic Materials, 2012, v. 41, n. 4, p. 791, doi. 10.1007/s11664-011-1888-2
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Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 253, doi. 10.1007/s11664-011-1732-8
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- Article
Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 390, doi. 10.1007/s11664-011-1763-1
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- Article
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 273, doi. 10.1007/s11664-011-1775-x
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- Article
Localized Recrystallization Induced by Subgrain Rotation in Sn-3.0Ag-0.5Cu Ball Grid Array Solder Interconnects During Thermal Cycling.
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- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2470, doi. 10.1007/s11664-011-1782-y
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- Article
Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects.
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- Journal of Electronic Materials, 2011, v. 40, n. 12, p. 2425, doi. 10.1007/s11664-011-1760-4
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A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints.
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- Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2314, doi. 10.1007/s11664-011-1738-2
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- Article
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects.
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- Journal of Electronic Materials, 2011, v. 40, n. 9, p. 1967, doi. 10.1007/s11664-011-1702-1
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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2588, doi. 10.1007/s11664-010-1348-4
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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2564, doi. 10.1007/s11664-010-1352-8
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Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2669, doi. 10.1007/s11664-010-1380-4
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Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test.
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- Journal of Electronic Materials, 2010, v. 39, n. 8, p. 1218, doi. 10.1007/s11664-010-1209-1
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Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 200, doi. 10.1007/s11664-009-0959-0
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Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2489, doi. 10.1007/s11664-009-0916-y
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Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2762, doi. 10.1007/s11664-009-0912-2
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Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2702, doi. 10.1007/s11664-009-0929-6
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