Works matching DE "WAFER-scale integration of circuits"

Results: 50

Design of due-date oriented look-ahead batching rule in wafer fabrication.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 596, doi. 10.1007/s00170-006-0723-z

By:

Sha, D. Y.;
Sheng-Yuan Hsu;
Lai, X. D.

Publication type:

Article

A hybrid look-ahead SOM-FBPN and FIR system for wafer-lot-output time prediction and achievability evaluation.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 575, doi. 10.1007/s00170-006-0741-x

By:

Chen, Toly

Publication type:

Article

Development of a new cluster index for wafer defects.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 7/8, p. 705, doi. 10.1007/s00170-005-0240-5

By:

Tong, Lee-Ing;
Wang, Chung-Ho;
Chen, Da-Lun

Publication type:

Article

Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 1/2, p. 1, doi. 10.1007/s00170-005-0165-z

By:

Tseng, S. C.;
Chen, R. S.;
Lio, C. C.

Publication type:

Article

High-mobility three-atom-thick semiconducting films with wafer-scale homogeneity.

Published in:

Nature, 2015, v. 520, n. 7549, p. 656, doi. 10.1038/nature14417

By:

Kang, Kibum;
Xie, Saien;
Huang, Lujie;
Han, Yimo;
Huang, Pinshane Y.;
Mak, Kin Fai;
Kim, Cheol-Joo;
Muller, David;
Park, Jiwoong

Publication type:

Article

The FABMAS multi-agent-system prototype for production control of water fabs: design, implementation and performance assessment.

Published in:

Production Planning & Control, 2006, v. 17, n. 7, p. 701, doi. 10.1080/09537280600901269

By:

Mönch, L.;
Stehli, M.;
Zimmermann, J.;
Habenicht, I.

Publication type:

Article

A literature survey on the design approaches and operational issues of automated wafer-transport systems for wafer fabs.

Published in:

Production Planning & Control, 2006, v. 17, n. 7, p. 648, doi. 10.1080/09537280600900774

By:

Montoya-Torres, J. R.

Publication type:

Article

A branch and bound algorithm to minimise total weighted tardiness on a single batch processing machine with ready times and incompatible job families.

Published in:

Production Planning & Control, 2006, v. 17, n. 7, p. 728, doi. 10.1080/09537280600901467

By:

Tangudu, S. K.;
Kurz, M. E.

Publication type:

Article

A parameterized-dispatching rule for a Logic IC sort in a wafer fabrication.

Published in:

Production Planning & Control, 2005, v. 16, n. 5, p. 426, doi. 10.1080/09537280500110623

By:

Lin, J. T.;
Wang, F. K.;
Kuo, P. C.

Publication type:

Article

Modeling of the MEMS Reactive Ion Etching Process Using Neural Networks.

Published in:

Jordan Journal of Mechanical & Industrial Engineering, 2011, v. 5, n. 4, p. 353

By:

Ashhab, M.;
Talat, N.

Publication type:

Article

MODELLING AND ESTIMATION OF WAFER YIELDS AND DEFECT DENSITIES FROM MICROELECTRONICS TEST STRUCTURE DATA.

Published in:

Quality & Reliability Engineering International, 1996, v. 12, n. 1, p. 9, doi. 10.1002/(SICI)1099-1638(199601)12:1<9::AID-QRE975>3.0.CO;2-K

By:

Hansen, Christian K.;
Hyregod, Poul

Publication type:

Article

Electronic Packaging Reliability Assessment.

Published in:: Quality & Reliability Engineering International, 1991, v. 7, n. 1, p. 50
Publication type:: Article

A “thru-short” method for noise de-embedding of MOSFETs.

Published in:

Microwave & Optical Technology Letters, 2009, v. 51, n. 5, p. 1379, doi. 10.1002/mop.24330

By:

Lan Nan;
Yong-Zhong Xiong;
Koen Mouthaan;
Ammar Issaoun;
Jinglin Shi;
Ban-Leong Ooi

Publication type:

Article

Self-Aligned Wafer-Level Integration Technology with an embedded faraday cage for substrate crosstalk suppression.

Published in:

Microwave & Optical Technology Letters, 2008, v. 50, n. 3, p. 829, doi. 10.1002/mop.23207

By:

Sharifi, H.;
Mohammadi, S.

Publication type:

Article

De-embedding techniques for embedded microstrips.

Published in:

Microwave & Optical Technology Letters, 2004, v. 42, n. 1, p. 50, doi. 10.1002/mop.20204

By:

Song, J. M.;
Ling, F.;
Blood, W.;
Demircan, E.;
Sriram, K.;
Flynn, G.;
To, K.-H.;
Tsai, R.;
Li, Q.;
Myers, T.;
Petras, M.;
Dengi, A.

Publication type:

Article

A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 1-4, p. 107, doi. 10.1007/s00170-014-6438-7

By:

Zhou, Ping;
Dong, Zhigang;
Kang, Renke;
Jin, Zhuji;
Guo, Dongming

Publication type:

Article

Precise Patterning of Large‐Scale TFT Arrays Based on Solution‐Processed Oxide Semiconductors: A Comparative Study of Additive and Subtractive Approaches.

Published in:

Advanced Materials Interfaces, 2018, v. 5, n. 1, p. 1, doi. 10.1002/admi.201700981

By:

Li, Minmin;
Zheng, Jiwen;
Xu, Huihua;
Wang, Zhaogui;
Wu, Qian;
Huang, Bolong;
Zhou, Hang;
Liu, Chuan

Publication type:

Article

Wafer Scale Solventless Adhesive Bonding with iCVD Polyglycidylmethacrylate: Effects of Bonding Parameters on Adhesion Energies.

Published in:

Advanced Materials Interfaces, 2015, v. 2, n. 9, p. n/a, doi. 10.1002/admi.201500076

By:

Jeevendrakumar, Vijay Jain Bharamaiah;
Pascual, Daniel N.;
Bergkvist, Magnus

Publication type:

Article

Three-step approach for wafer sawing lane inspection.

Published in:

Optical Engineering, 2009, v. 48, n. 11, p. 117204, doi. 10.1117/1.3265714

By:

Jing-Wein Wang;
Chia-Nan Wang;
Wen-Yuan Chen

Publication type:

Article

Ultrafast perturbation maps as a quantitative tool for testing of multi-port photonic devices.

Published in:

Nature Communications, 2018, v. 9, n. 1, p. 1, doi. 10.1038/s41467-018-04662-2

By:

Vynck, Kevin;
Lalann, Philippe;
Bigeng Chen;
Bruck, Roman;
Muskens, Otto L.;
Dinsdale, Nicholas J.;
Khokhar, Ali Z.;
Reynolds, Scott A.;
Crudgington, Lee;
Thomson, David J.;
Reed, Graham T.

Publication type:

Article

Thin Film Transistors Using Wafer-Scale Low-Temperature MOCVD WSe.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6280, doi. 10.1007/s11664-016-4987-2

By:

Gong, Yiyang;
Zhang, Xiaotian;
Redwing, Joan;
Jackson, Thomas

Publication type:

Article

Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 33, doi. 10.1007/s11664-008-0560-y

By:

Terashima, S.;
Kohno, T.;
Mizusawa, A.;
Arai, K.;
Okada, O.;
Wakabayashi, T.;
Tanaka, M.;
Tatsumi, K.

Publication type:

Article

A new VLSI implementation of additive synthesis.

Published in:

Computer Music Journal, 1998, v. 22, n. 3, p. 49, doi. 10.2307/3681157

By:

De Bernardinis, Fernando;
Roncella, Roberto

Publication type:

Article

Versatile pattern generation of periodic, high aspect ratio Si nanostructure arrays with sub-50-nm resolution on a wafer scale.

Published in:

Nanoscale Research Letters, 2013, v. 8, n. 1, p. 1, doi. 10.1186/1556-276X-8-506

By:

Ho, Jian-Wei;
Wee, Qixun;
Dumond, Jarrett;
Tay, Andrew;
Chua, Soo-Jin

Publication type:

Article

Wetting-Assisted Crack- and Wrinkle-Free Transfer of Wafer-Scale Graphene onto Arbitrary Substrates over a Wide Range of Surface Energies.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 13, p. 2070, doi. 10.1002/adfm.201504551

By:

Kim, Hyun Ho;
Lee, Seong Kyu;
Lee, Seung Goo;
Lee, Eunho;
Cho, Kilwon

Publication type:

Article

Wafer‐Scale Nanoimprint Lithography Process Towards Complementary Silicon Nanowire Field‐Effect Transistors for Biosensor Applications.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2018, v. 215, n. 15, p. 1, doi. 10.1002/pssa.201800234

By:

Müller, Achim;
Vu, Xuan T.;
Pachauri, Vivek;
Francis, Laurent A.;
Flandre, Denis;
Ingebrandt, Sven

Publication type:

Article

Pursuing efficiency from wafer to system.

Published in:

EE: Evaluation Engineering, 2015, v. 54, n. 8, p. 16

By:

Nelson, Rick

Publication type:

Article

WLBI and Test Churn Out KGD.

Published in:

EE: Evaluation Engineering, 2008, v. 47, n. 2, p. 42

By:

Lecklider, Tom

Publication type:

Article

Testing MEMS at Wafer Level.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 9, p. 20

By:

Feuerstein, Don;
Werner, Frank Michael

Publication type:

Article

Controlling Contact Resistance.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 5, p. 56

By:

Broz, Jerry J.;
Stalnaker, Scott;
Humphrey, Gene

Publication type:

Article

Modeling and Parameter Extraction of Test Fixtures for MOSFET On-Wafer Measurements up to 60 GHz.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2013, v. 23, n. 6, p. 655, doi. 10.1002/mmce.20701

By:

Álvarez-Botero, Germán;
Torres-Torres, Reydeze;
Murphy-Arteaga, Roberto S.

Publication type:

Article

Current tuned slotted Y‐branch laser for wafer thickness measurements with THz radiation.

Published in:

Electronics Letters (Wiley-Blackwell), 2021, v. 57, n. 24, p. 936, doi. 10.1049/ell2.12314

By:

Surkamp, N.;
Gerling, A.;
O'Gorman, J.;
Honsberg, M.;
Schmidtmann, S.;
Nandi, U.;
Preu, S.;
Sacher, J.;
Brenner, C.;
Hofmann, M. R.

Publication type:

Article

Future bright with copper, low-k, 300mm, shrink.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 20
Publication type:: Article

First wafer-scale packages show up in commercial products.

Published in:

Solid State Technology, 2000, v. 43, n. 10, p. 39

By:

Asakura, Hiroshi

Publication type:

Article

TI plans DMOS 4 upgrade.

Published in:: Solid State Technology, 1999, v. 42, n. 7, p. 40
Publication type:: Article

Wafer-level packaging technology milestones.

Published in:

Solid State Technology, 1998, v. 41, n. 10, p. 42

By:

Burggraaf, Pieter

Publication type:

Article

Experimental characterization of wafer probe burn.

Published in:

Turkish Journal of Electrical Engineering & Computer Sciences, 2016, v. 24, n. 5, p. 3513, doi. 10.3906/elk-1407-109

By:

ZAFER, Baha;
TUNABOYLU, Bahadır

Publication type:

Article

DEVELOPMENT OF A DUAL BURN-IN POLICY FOR SEMICONDUCTOR PRODUCTS BASED ON THE NUMBER OF DEFECTIVE NEIGHBORHOOD CHIPS.

Published in:

International Journal of Reliability, Quality & Safety Engineering, 2006, v. 13, n. 6, p. 501, doi. 10.1142/S0218539306002409

By:

TONG, SEUNG HOON;
YUM, BONG-JIN

Publication type:

Article

A Dynamic TNFS Rule for Job Dispatching in a Wafer Fab.

Published in:

International Review on Computers & Software, 2011, v. 6, n. 3, p. 412

By:

Yu Cheng Wang;
Toly Chen

Publication type:

Article

The SOM-RBF Approach for Forecasting Job Interval Cycle Time in a Wafer Fab.

Published in:

International Review on Computers & Software, 2011, v. 6, n. 3, p. 407

By:

Yu-Cheng Lin;
Toly Chen

Publication type:

Article

Optimizing Cycle Time Average and Variation for a Wafer Fabrication Factory with a Dynamic Dispatching Rule.

Published in:

International Review on Computers & Software, 2011, v. 6, n. 3, p. 400

By:

Hsin-Chieh Wu;
Toly Chen;
Yu Cheng Wang

Publication type:

Article

Monitoring wafer map data from integrated circuit fabrication processes for spatially clustered...

Published in:

Technometrics, 1997, v. 39, n. 3, p. 241, doi. 10.1080/00401706.1997.10485116

By:

Hansen, Mark H.;
Nair, Vijayan N.

Publication type:

Article

Screen-printed single-walled carbon nanotube networks and their use for dimethyl methylphosphonate detection.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 10, p. 1823, doi. 10.1007/s10854-012-0669-x

By:

Jing, Hongjun;
Jiang, Yadong;
Du, Xiaosong

Publication type:

Article

Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 10, p. 1536, doi. 10.1007/s10854-011-0457-z

By:

Tao-Chi Liu;
Chih Chen;
Shih-Ting Liu;
Ming-Lun Chang;
Jandel Lin

Publication type:

Article

Matching characteristics of high-performance, low-cost, analog fiber-optic links for arrayed-antenna applications.

Published in:

Microwave & Optical Technology Letters, 2000, v. 24, n. 6, p. 363, doi. 10.1002/(SICI)1098-2760(20000320)24:6<363::AID-MOP1>3.0.CO;2-O

By:

Myslinski, P.;
Misner, R.;
Yan, B.;
Lee, J.

Publication type:

Article

Influence of Repeated Measurement on One Occasion, on Successive Days, and on Workdays on Home Blood Pressure Values.

Published in:

Clinical & Experimental Hypertension, 2005, v. 27, n. 2/3, p. 215, doi. 10.1081/CEH-200048854

By:

Kawabe, Hiroshi;
Saito, Ikuo;
Saruta, Takao

Publication type:

Article

Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers.

Published in:

Nature Photonics, 2012, v. 6, n. 9, p. 612, doi. 10.1038/nphoton.2012.204

By:

Justice, John;
Bower, Chris;
Meitl, Matthew;
Mooney, Marcus B.;
Gubbins, Mark A.;
Corbett, Brian

Publication type:

Article

SMARTIEHS Offers Faster Inspection of Micro-Optical Components.

Published in:: Electronic Device Failure Analysis, 2011, v. 13, n. 2, p. 41
Publication type:: Article

Electroglas Offers Advanced Dual-Loops Z-Stage Control.

Published in:: Electronic Device Failure Analysis, 2008, v. 10, n. 3, p. 42
Publication type:: Article

Graphene/Si-nanowire heterostructure molecular sensors.

Published in:

Scientific Reports, 2014, p. 1, doi. 10.1038/srep05384

By:

Jungkil Kim;
Si Duk Oh;
Ju Hwan Kim;
Dong Hee Shin;
Sung Kim;
Suk-Ho Choi

Publication type:

Article