Works matching DE "SEMICONDUCTOR storage devices"
1
- Chips, 2024, v. 3, n. 4, p. 271, doi. 10.3390/chips3040014
- Pan, Jiong;
- Wang, Zeda;
- Zhao, Bingchen;
- Yin, Jiaju;
- Guo, Pengwen;
- Yang, Yi;
- Ren, Tian-Ling
- Article
2
- Advanced Electronic Materials, 2019, v. 5, n. 9, p. N.PAG, doi. 10.1002/aelm.201800914
- Yoon, Kyung Jean;
- Kim, Yumin;
- Hwang, Cheol Seong
- Article
3
- Physica Status Solidi - Rapid Research Letters, 2019, v. 13, n. 7, p. N.PAG, doi. 10.1002/pssr.201900136
- Tsurumaki‐Fukuchi, Atsushi;
- Tsuta, Yusuke;
- Arita, Masashi;
- Takahashi, Yasuo
- Article
4
- Physica Status Solidi - Rapid Research Letters, 2015, v. 9, n. 8, p. 470, doi. 10.1002/pssr.201510214
- Wang, Qing;
- Liu, Bo;
- Xia, Yangyang;
- ZhENg, Yonghui;
- Huo, Ruru;
- Zhu, Min;
- Song, Sannian;
- Lv, Shilong;
- ChENg, Yan;
- Song, Zhitang;
- FENg, Songlin
- Article
5
- EE: Evaluation Engineering, 2006, v. 45, n. 3, p. 26
- Article
6
- EE: Evaluation Engineering, 2006, v. 45, n. 3, p. 20
- Article
8
- 2021
- Van Duzer, Theodore (Ted)
- Editorial
9
- ComputerWorld Hong Kong, 2009, v. 26, n. 2, p. 11
- Article
10
- Materials Science (0137-1339), 2010, v. 28, n. 1, p. 105
- LUDWIG, C.;
- BEUG, M. F.;
- KÜSTERS, K.-H.
- Article
11
- Materials Science (0137-1339), 2007, v. 25, n. 1, p. 33
- Mikolajick, T.;
- Nagel, N.;
- Riedel, S.;
- Mueller, T.;
- Küsters, K.-H.
- Article
12
- Journal of Supercomputing, 2013, v. 64, n. 3, p. 1055, doi. 10.1007/s11227-011-0679-0
- Li, Guohui;
- Zhao, Pei;
- Yuan, Ling;
- Gao, Sheng
- Article
13
- Journal of Electronic Testing, 2016, v. 32, n. 2, p. 111, doi. 10.1007/s10836-016-5570-8
- Luo, Kun-Lun;
- Wu, Ming-Hsueh;
- Hsu, Chun-Lung;
- Chen, Chen-An
- Article
14
- Journal of Electronic Testing, 2014, v. 30, n. 6, p. 643, doi. 10.1007/s10836-014-5487-z
- Hou, Chih-Sheng;
- Li, Jin-Fu
- Article
15
- Algebras, Groups & Geometries, 2018, v. 35, n. 4, p. 427
- Article
16
- Computers (2073-431X), 2017, v. 6, n. 4, p. 28, doi. 10.3390/computers6040028
- Article
17
- IUP Journal of Electrical & Electronics Engineering, 2014, v. 7, n. 3, p. 25
- Shetty, Pooja;
- Biswas, Aindrila;
- Threse, Annie
- Article
18
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27133, doi. 10.1007/s10854-021-07105-9
- Zou, Yong Sheng;
- Gan, Chong Leong;
- Chung, Min-Hua;
- Takiar, Hem
- Article
19
- Science & Technology of Advanced Materials, 2024, v. 25, n. 1, p. 1, doi. 10.1080/14686996.2024.2342772
- Tsuruoka, Tohru;
- Terabe, Kazuya
- Article
20
- IETE Technical Review, 2009, v. 26, n. 4, p. 247, doi. 10.4103/0256-4602.52994
- Jang-Gn Yun;
- Jong Duk Lee;
- Byung-Gook Park
- Article
21
- Applied Physics A: Materials Science & Processing, 2018, v. 124, n. 11, p. 1, doi. 10.1007/s00339-018-2153-9
- Gao, Tian;
- Feng, Jie;
- Ma, Haili;
- Zhu, Xi
- Article
22
- Applied Physics A: Materials Science & Processing, 2017, v. 123, n. 5, p. 1, doi. 10.1007/s00339-017-0973-7
- Song, Bing;
- Xu, Hui;
- Liu, Haijun;
- Li, Qingjiang
- Article
23
- Nature Communications, 2023, v. 14, n. 1, p. 1, doi. 10.1038/s41467-023-36076-0
- Lee, Yong-Bok;
- Kang, Min-Ho;
- Choi, Pan-Kyu;
- Kim, Su-Hyun;
- Kim, Tae-Soo;
- Lee, So-Young;
- Yoon, Jun-Bo
- Article
24
- Chemistry - An Asian Journal, 2018, v. 13, n. 14, p. 1784, doi. 10.1002/asia.201800331
- Wang, Ming;
- Zhang, Qi‐jian;
- Li, Zhuang;
- Li, Hua;
- Lu, Jian‐Mei
- Article
25
- Multimedia Systems, 2009, v. 15, n. 2, p. 101, doi. 10.1007/s00530-009-0152-6
- Article
26
- Electronics Letters (Wiley-Blackwell), 2017, v. 53, n. 11, p. 739, doi. 10.1049/el.2017.0465
- Kim, Y.;
- Park, I. H.;
- Kwon, H. T.;
- Wee, D.;
- Park, B.-G.
- Article
27
- Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 13, p. 1172, doi. 10.1049/el.2016.0938
- Weiwei He;
- Jing Chen;
- Jiexin Luo;
- Zhan Chai;
- Xi Wang
- Article
28
- Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 13, p. 1155, doi. 10.1049/el.2015.4001
- Article
29
- Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 6, p. 477, doi. 10.1049/el.2015.2874
- Hunt, M. R.;
- Mitchell, C.;
- McCartney, C. L.;
- Ho, F. D.
- Article
30
- Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 8, p. 615, doi. 10.1049/el.2014.4375
- Article
31
- Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 2, p. 55, doi. 10.1049/el.2013.4247
- Article
32
- Electronics Letters (Wiley-Blackwell), 2013, v. 49, n. 25, p. 1607, doi. 10.1049/el.2013.1418
- Article
33
- Scientific Reports, 2015, p. 17103, doi. 10.1038/srep17103
- Arita, Masashi;
- Takahashi, Akihito;
- Ohno, Yuuki;
- Nakane, Akitoshi;
- Tsurumaki-Fukuchi, Atsushi;
- Takahashi, Yasuo
- Article
34
- Nanomaterials (2079-4991), 2025, v. 15, n. 5, p. 362, doi. 10.3390/nano15050362
- Tian, Qian;
- Liang, Xinchao;
- Xu, Maoping;
- Liu, Yi;
- Wu, Qilong;
- Tai, Guoan
- Article
35
- Nanomaterials (2079-4991), 2024, v. 14, n. 23, p. 1920, doi. 10.3390/nano14231920
- Qiu, Xinxia;
- Xu, Mingsheng;
- Cong, Chunxiao;
- Qiu, Zhi-Jun;
- Hu, Laigui;
- Liu, Ran
- Article
36
- Nanomaterials (2079-4991), 2022, v. 12, n. 3, p. 548, doi. 10.3390/nano12030548
- Kim, Hak-Gyeong;
- Hong, Da-Hee;
- Yoo, Jae-Hoon;
- Lee, Hee-Chul
- Article
37
- Nanomaterials (2079-4991), 2021, v. 11, n. 1, p. 101, doi. 10.3390/nano11010101
- Takahashi, Mitsue;
- Sakai, Shigeki
- Article
38
- International Journal of Nanoelectronics & Materials, 2022, v. 15, n. 1, p. 37
- Channa, Naimatullah;
- Abbas, Nasir;
- Khan, Junaid Kareem;
- Khalid, Muhammad;
- HafeezUllah, Malik Muhammad;
- Kashif, Muhammad;
- Inam, Sehrish;
- Arshad, Maria
- Article
39
- Monthly Weather Review, 2002, v. 130, n. 5, p. 1384, doi. 10.1175/1520-0493(2002)130<1384:AESDCF>2.0.CO;2
- Rivier, L.;
- Loft, R.;
- Polvani, L. M.
- Article
40
- Journal of Circuits, Systems & Computers, 2021, v. 13, n. 15, p. 1, doi. 10.1142/S0218126621502704
- Mishra, Jitendra Kumar;
- Mankali, Lakshmi Likhitha;
- Kandpal, Kavindra;
- Misra, Prasanna Kumar;
- Goswami, Manish
- Article
41
- Journal of Circuits, Systems & Computers, 2004, v. 13, n. 6, p. 1321, doi. 10.1142/S0218126604001994
- LIU, WANLI;
- ALBONESI, DAVID H.;
- GOSTOMSKI, JOHN;
- PALUM, LLOYD;
- HINTERBERGER, DAVE;
- WANZENRIED, RICK;
- INDOVINA, MARK
- Article
42
- PLoS ONE, 2017, v. 12, n. 3, p. 1, doi. 10.1371/journal.pone.0174375
- Baek, Seungjae;
- Cho, Sangyeun;
- Choi, Jongmoo
- Article
43
- Journal of Experimental Nanoscience, 2013, v. 8, n. 3, p. 389, doi. 10.1080/17458080.2012.708440
- Ray, SounakK;
- Panda, Debashis;
- Aluguri, Rakesh
- Article
44
- Chemistry & Industry, 2023, v. 87, n. 11, p. 46, doi. 10.1002/cind.10195
- Article
45
- Multimedia Tools & Applications, 2019, v. 78, n. 5, p. 5463, doi. 10.1007/s11042-018-6783-x
- Youn, Jonghee;
- Cho, Doosan
- Article
46
- Wireless Personal Communications, 2023, v. 130, n. 1, p. 103, doi. 10.1007/s11277-023-10277-8
- Santosh Kumar, T.;
- Tripathi, Suman Lata
- Article
47
- Wireless Personal Communications, 2023, v. 128, n. 1, p. 471, doi. 10.1007/s11277-022-09963-w
- Addala, Durgesh;
- Sinha, Sanjeet Kumar;
- Gadiparthi, Mohan Chandu;
- Chander, Sweta
- Article
48
- Wireless Personal Communications, 2018, v. 102, n. 4, p. 3879, doi. 10.1007/s11277-018-5418-x
- Article
49
- IET Communications (Wiley-Blackwell), 2018, v. 12, n. 14, p. 1671, doi. 10.1049/iet-com.2017.0440
- Ashrafi, Reza A.;
- Pusane, Ali E.
- Article
50
- Journal of Analysis & Applications, 2025, v. 23, n. 1, p. 1
- Article