Works matching AU Zhou, T.


Results: 402
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    Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li.

    Published in:
    JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 5, p. 3482, doi. 10.1007/s11837-025-07202-8
    By:
    • Liu, X.;
    • Zhou, T. H.;
    • Kong, L. W.;
    • Li, Y. W.;
    • Xing, Z. B.;
    • Pang, L.;
    • Wu, W. B.;
    • Ma, K. Y.;
    • Li, P.
    Publication type:
    Article
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    Experimental study of fuel-air explosive.

    Published in:
    Combustion, Explosion, & Shock Waves, 2008, v. 44, n. 2, p. 213, doi. 10.1007/s10573-008-0028-7
    By:
    • Liu, G.;
    • Hou, F.;
    • Cao, B.;
    • Xie, L.;
    • Shen, Zh.;
    • Zhou, T.
    Publication type:
    Article
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