Adhesion of polymer thin-films and patterned lines.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 475, doi. 10.1023/A:1024940132299
- By:
- Publication type:
- Article
Works matching IS 03769429 AND DT 2003 AND VI 120 AND IP 1/2
Results: 8
1
2
High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 449, doi. 10.1023/A:1024988031390
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- Publication type:
- Article
3
Fiducial mark and CTOA estimates of thin film adhesion.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 431, doi. 10.1023/A:1024983930481
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- Publication type:
- Article
4
Measurement of the noibium/sapphire interface toughness via delamination.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 441, doi. 10.1023/A:1024936014552
- By:
- Publication type:
- Article
5
Length scales for the fracture of nanostructures.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 387, doi. 10.1023/A:1024927812734
- By:
- Publication type:
- Article
6
Effects of diffusion on interfacial fracture of gold-chromium hybrid microcircuit films.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 407, doi. 10.1023/A:1024979829573
- By:
- Publication type:
- Article
7
Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 421, doi. 10.1023/A:1024931913643
- By:
- Publication type:
- Article
8
Mechanical properties and fracture toughness of organo-silicate glass (OSG) low- k dielectric thin films for microelectronic applications.
- Published in:
- International Journal of Fracture, 2003, v. 120, n. 1/2, p. 487, doi. 10.1023/A:1024944316369
- By:
- Publication type:
- Article