Works matching DE "ELECTRIC contactors"
1
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 855, doi. 10.1007/s10854-007-9520-1
- Liday, J.;
- Hotový, I.;
- Sitter, H.;
- Vogrinčič, P.;
- Vincze, A.;
- Vávra, I.;
- Šatka, A.;
- Ecke, G.;
- Bonanni, A.;
- Breza, J.;
- Simbrunner, C.;
- Plochberger, B.
- Article
2
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 8, p. 805, doi. 10.1007/s10854-007-9210-z
- Article
3
- Journal of the National Academy of Forensic Engineers, 2021, v. 38, n. 1, p. 25, doi. 10.51501/jotnafe.v38i1.133
- Icove, David J.;
- Lawton, Thomas A.
- Article
4
- Environmental Technology, 2011, v. 32, n. 1, p. 93, doi. 10.1080/09593330.2010.487642
- Rodziewicz, Joanna;
- Filipkowska, Urszula;
- Dziadkiewicz, Ewa
- Article
5
- Eastern-European Journal of Enterprise Technologies, 2018, v. 92, n. 5, p. 48, doi. 10.15587/1729-4061.2018.128495
- Soskov, A.;
- Sabalaeva, N.;
- Ya .Forkun;
- Glebova, M.
- Article
6
- International Journal of High Speed Electronics & Systems, 2007, v. 17, n. 1, p. 85, doi. 10.1142/S0129156407004278
- Sun, Yunju;
- Eastman, Lester F.
- Article
7
- International Journal of High Speed Electronics & Systems, 2005, v. 15, n. 4, p. 781, doi. 10.1142/S0129156405003429
- ROCCAFORTE, FABRIZIO;
- LA VIA, FRANCESCO;
- RAINERI, VITO
- Article
8
- Agronomy Research, 2017, v. 15, n. S1, p. 1072
- Linda, M.;
- Künzel, G.;
- Hromasová, M.
- Article
10
- Quality & Reliability Engineering International, 1993, v. 9, n. 4, p. 367, doi. 10.1002/qre.4680090423
- Anderson, W. T.;
- Christianson, K. A.;
- Moglestue, C.
- Article
11
- Quality & Reliability Engineering International, 1993, v. 9, n. 4, p. 299, doi. 10.1002/qre.4680090410
- Ferlazzo, L.;
- Reimbold, G.;
- Gonchond, J. P.;
- Heitzmann, M.;
- Demolliens, O.;
- Lormand, G.
- Article
12
- Quality & Reliability Engineering International, 1991, v. 7, n. 4, p. 343, doi. 10.1002/qre.4680070422
- Canali, C.;
- Magistrali, F.;
- Paccagnella, A.;
- Sangalli, M.;
- Tedesco, C.;
- Zanoni, E.
- Article
13
- Quality & Reliability Engineering International, 1991, v. 7, n. 4, p. 331, doi. 10.1002/qre.4680070420
- Saunders, N. L.;
- Rezazadeh, A. A.;
- Morgan, D. V.;
- Thomas, H.;
- Hipwood, L. G.
- Article
14
- Cogent Engineering, 2018, v. 5, n. 1, p. 1, doi. 10.1080/23311916.2018.1470889
- Wong, Chin jie;
- Nirmal, Umar;
- Murugan, Sharmeeni
- Article
15
- European Journal of Pediatric Dermatology, 2018, v. 28, n. 4, p. 248
- Article
16
- Journal of Engineering (2314-4912), 2016, p. 1, doi. 10.1155/2016/3954305
- Article
17
- Indian Chemical Engineer, 2012, v. 54, n. 4, p. 262, doi. 10.1080/00194506.2012.766004
- Kothari, D.C.;
- Renge, V.C.;
- Padma, B.;
- Rao, S.;
- Raidas, Rahul;
- Pitt, M.J.
- Article
18
- Brain Topography, 2008, v. 21, n. 1, p. 52, doi. 10.1007/s10548-008-0059-0
- Nicolas Chauveau;
- Xavier Franceries;
- Florent Aubry;
- Pierre Celsis;
- Bernard Rigaud
- Article
20
- EE: Evaluation Engineering, 2011, v. 50, n. 12, p. 14
- Article
21
- Journal of Electronic Materials, 2017, v. 46, n. 8, p. 4750, doi. 10.1007/s11664-017-5406-z
- Kim, Dae-Hyun;
- Park, Jae-Seong;
- Kang, Daesung;
- Seong, Tae-Yeon
- Article
22
- Journal of Electronic Materials, 2016, v. 45, n. 6, p. 2802, doi. 10.1007/s11664-016-4375-y
- Liu, Dan;
- Lin, Chun;
- Zhou, Songmin;
- Hu, Xiaoning
- Article
23
- Journal of Electronic Materials, 2016, v. 45, n. 4, p. 2087, doi. 10.1007/s11664-015-4278-3
- Zhao, Shirong;
- McFavilen, Heather;
- Wang, Shuo;
- Ponce, Fernando A.;
- Arena, Chantal;
- Goodnick, Stephen;
- Chowdhury, Srabanti
- Article
24
- Journal of Electronic Materials, 2015, v. 44, n. 1, p. 457, doi. 10.1007/s11664-014-3399-4
- Biyik, Serkan;
- Arslan, Fazli;
- Aydin, Murat
- Article
25
- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1662, doi. 10.1007/s11664-007-0277-3
- Voss, L. F.;
- Stafford, L.;
- Khanna, R.;
- Gila, B. P.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Ren, F.;
- Kravchenko, I. I.
- Article
26
- Journal of Electronic Materials, 2004, v. 33, n. 11, p. 1406, doi. 10.1007/s11664-004-0171-1
- Huang, Robin K.;
- Wang, Christine A.;
- Harris, Christopher T.;
- Connors, Michael K.;
- Shiau, Daniel A.
- Article
27
- Journal of Electronic Materials, 2004, v. 33, n. 5, p. 418, doi. 10.1007/s11664-004-0194-7
- Wang, J. H.;
- Mohney, S. E.;
- Wang, S. H.;
- Chowdhury, U.;
- Dupuis, R. D.
- Article
28
- Philosophical Magazine, 2004, v. 84, n. 24, p. 2559, doi. 10.1080/14786430410001697306
- Article
29
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3860, doi. 10.1007/s10854-019-00669-7
- Shi, Jianjun;
- Xia, Xiaochuan;
- Liang, Hongwei;
- Abbas, Qasim;
- Liu, Jun;
- Zhang, Heqiu;
- Liu, Yang
- Article
30
- Journal of Electronic Testing, 2015, v. 31, n. 4, p. 339, doi. 10.1007/s10836-015-5535-3
- Renbi, Abdelghani;
- Delsing, Jerker
- Article
31
- Microwave & Optical Technology Letters, 2001, v. 30, n. 4, p. 257, doi. 10.1002/mop.1284
- Ahouassa, P.;
- Boussey, J.;
- Bouthinon, M.;
- Vilcot, A.
- Article
32
- Microwave & Optical Technology Letters, 1996, v. 11, n. 2, p. 59, doi. 10.1002/(SICI)1098-2760(19960205)11:2<59::AID-MOP2>3.0.CO;2-N
- Yeo, S. P.;
- Leong, M. S.;
- Kooi, P. S.;
- Yeo, T. S.;
- Zhou, X. D.
- Article
33
- Journal of Solid State Electrochemistry, 2009, v. 13, n. 5, p. 733, doi. 10.1007/s10008-008-0603-6
- Article
34
- Journal of Solid State Electrochemistry, 2009, v. 13, n. 1, p. 123, doi. 10.1007/s10008-008-0579-2
- Chun-Ze Lai;
- Marti Joyer;
- Melissa Fierke;
- Nicholas Petkovich;
- Andreas Stein;
- Philippe Bühlmann
- Article
35
- IET Power Electronics (Wiley-Blackwell), 2016, v. 9, n. 6, p. 1279, doi. 10.1049/iet-pel.2015.0443
- Buticchi, Giampaolo;
- Barater, Davide;
- Concari, Carlo;
- Franceschini, Giovanni
- Article
36
- Physica Status Solidi. A: Applications & Materials Science, 2017, v. 214, n. 11, p. n/a, doi. 10.1002/pssa.201700466
- Temahuki, Nephi;
- Gillet, Rémi;
- Sallet, Vincent;
- Jomard, François;
- Chikoidze, Ekaterina;
- Dumont, Yves;
- Pinault‐Thaury, Marie‐Amandine;
- Barjon, Julien
- Article
37
- Australian Journal of Pharmacy, 2011, v. 92, n. 1089, p. 40
- Article
38
- International Review of Electrical Engineering, 2010, v. 5, n. 4, p. 1754
- Hannan, M. A.;
- Nordin, N. A.;
- Mohamed, A.
- Article
39
- Complexity, 2018, p. 1, doi. 10.1155/2018/9054623
- Yang, Wenying;
- Guo, Jiuwei;
- Liu, Yang;
- Zhai, Guofu
- Article
40
- Chemie Ingenieur Technik (CIT), 2017, v. 89, n. 4, p. 409, doi. 10.1002/cite.201600142
- Grafschafter, Annika;
- Siebenhofer, Matthäus
- Article
41
- Journal of Solid State Electrochemistry, 2009, v. 13, n. 8, p. 1259, doi. 10.1007/s10008-008-0660-x
- R. Singh;
- A. Singh;
- Anindita
- Article
42
- Przegląd Elektrotechniczny, 2017, v. 93, n. 12, p. 47, doi. 10.15199/48.2017.12.12
- Article
43
- Proceedings of Odessa Polytechnic University / Odes'kyi Politechnichnyi Universytet Pratsi, 2017, v. 51, n. 1, p. 92, doi. 10.15276/opu.1.51.2017.14
- Glukhenkaya, T. A.;
- Egorov, V. V.;
- Kanischeva, N. O.;
- Nazarov, E. I.;
- Kipenskiy, A. V.
- Article
44
- GSTF Journal of Engineering Technology, 2013, v. 2, n. 3, p. 46, doi. 10.5176/2251-3701_2.3.90
- Hardi, Surya;
- Hafizi, Muhd.;
- Isa, Muzamir;
- Ismail, Rohana
- Article
45
- Inverse Problems & Imaging, 2013, v. 7, n. 2, p. 417, doi. 10.3934/ipi.2013.7.417
- BORCEA, LILIANA;
- VASQUEZ, FERNANDO GUEVARA;
- MAMONOV, ALEXANDER V.;
- Lassas, Matti
- Article
46
- Applied Physics A: Materials Science & Processing, 2017, v. 123, n. 5, p. 1, doi. 10.1007/s00339-017-0947-9
- Huang, Xin;
- Zhang, Huaiwu;
- Lai, Yuanming;
- Li, Jie
- Article
47
- Applied Physics A: Materials Science & Processing, 2005, v. 81, n. 3, p. 561, doi. 10.1007/s00339-004-2673-3
- Reddy, V. R.;
- Kim, S.-H.;
- Seong, T.-Y.
- Article
48
- Transactions of FAMENA, 2016, v. 40, n. 3, p. 57, doi. 10.21278/TOF.40305
- Article
49
- Semiconductors, 2018, v. 52, n. 1, p. 131, doi. 10.1134/S1063782618010190
- Sachenko, A.;
- Belyaev, A.;
- Konakova, R.
- Article
50
- Semiconductors, 2017, v. 51, n. 4, p. 438, doi. 10.1134/S1063782617040194
- Slapovskiy, D.;
- Pavlov, A.;
- Pavlov, V.;
- Klekovkin, A.
- Article