Effect of gold addition on the microstructure, mechanical properties and corrosion behavior of Ti alloys.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 153, doi. 10.1007/s13404-014-0138-9
- By:
- Publication type:
- Article
Works matching IS 10278591 AND DT 2014 AND VI 47 AND IP 3
Results: 10
1
2
Generation of gold nanoparticles according to procedures described in the eighteenth century.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 161, doi. 10.1007/s13404-014-0139-8
- By:
- Publication type:
- Article
3
Phase diagram of Au-Al-Cu at 500 °C.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 167, doi. 10.1007/s13404-014-0140-2
- By:
- Publication type:
- Article
4
Probing the surface oxidation of chemically synthesised gold nanospheres and nanorods.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 177, doi. 10.1007/s13404-014-0141-1
- By:
- Publication type:
- Article
5
Room temperature evolution of gold nanodots deposited on silicon.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 185, doi. 10.1007/s13404-014-0142-0
- By:
- Publication type:
- Article
6
Gold etching for microfabrication.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 205, doi. 10.1007/s13404-014-0143-z
- By:
- Publication type:
- Article
7
Lamellar-forming grain boundary reaction related to age-hardening mechanism in an Au-Pt-Pd-In metal-ceramic alloy.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 195, doi. 10.1007/s13404-014-0145-x
- By:
- Publication type:
- Article
8
Highlights from recent literature.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 217, doi. 10.1007/s13404-014-0148-7
- Publication type:
- Article
9
Gold's evolving role in the electronics industry.
- Published in:
- 2014
- By:
- Publication type:
- Editorial
10
Evolution and investigation of copper and gold ball bonds in extended reliability stressing.
- Published in:
- Gold Bulletin, 2014, v. 47, n. 3, p. 141, doi. 10.1007/s13404-014-0135-z
- By:
- Publication type:
- Article